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이 학술지의 논문 검색
Applications of Electrochemistry to Chip Packaging, an Overview
Kovac, Z. Electrochemical Society 1999 p.3-10
Micro-Fabrication Technologies on Recent Packagings
Kobayashi, T.;Honma, H. Electrochemical Society 1999 p.11-20
Microfabrication on Electronics Packaging
Wakabayashi, S.-I. Electrochemical Society 1999 p.21-30
Electrochemically Deposited Microstructures in Packaging and System Integration
Engelmann, G.;Wolf, J.;Dietrich, L.;Fehlberg, S.;Muller, S.;Ehrmann, O.;Reichl, H. Electrochemical Society 1999 p.31-37
Recent Advances in Gap Filling Cu Electroplating Technology
Zhu, M.;Papapanayiotou, D.;Lee, Y.;Ting, C. H. Electrochemical Society 1999 p.38-43
Tin-Silver Alloys for Flip-Chip Bonding Studied with a Rotating Cylinder Electrode
Tang, P. T.;Pedersen, E. H.;Bech-Nielsen, G.;Kuhmann, J. F. Electrochemical Society 1999 p.44-50
Via-Filling Using Electroplating for Build-Up Printed Circuit Boards
Kawasaki, J.;Mihara, K.;Kobayashi, T.;Honma, H. Electrochemical Society 1999 p.51-55
Improvements of Plating Copper Distribution into Printed Circuit Board Interconnections
Fournier, J.;Menini, R.;Henuset, Y. M. Electrochemical Society 1999 p.56-68
Integration of Electroless and Electrolytic Cu in the IC Back End of Line Technologies
Maex, K.;Brongersma, S. H.;Lantasov, Y.;Richard, E.;Palmans, R.;Vervoort, I. Electrochemical Society 1999 p.71-79
Plieth, W. Electrochemical Society 1999 p.80-88