The interest of utilizing SU-8 for the fabrication of thick micro-electro-mechanical systems(MEMS) has been growing recently. Especially SU-8 is a widespread material for soft structures in MEMS applications. However, the fabrication of thick SU-8 MEM...
The interest of utilizing SU-8 for the fabrication of thick micro-electro-mechanical systems(MEMS) has been growing recently. Especially SU-8 is a widespread material for soft structures in MEMS applications. However, the fabrication of thick SU-8 MEMS process has been experienced severe problems such as cracks, distortions and delaminations due to post expose bake(PEB) photolithography process. In order to design a reliable device using SU-8 , it is necessary to measure the mechanical properties of SU-8. The mechanical behavior of micro-scale structures usually is very different from that of the bulk materials. The behavior of small scale structures is dependent on their dimension and fabrication process. In this study, we used an advanced Pillar Compression Test using nanoindentation apparatus to measure the stress-strain relationship of SU-8 micro pillars fabricated by MEMS process. Stress-strain curves and mechanical properties of baked SU-8 pillar at 65℃ ~ 120 ℃ were extracted from measured load-displacement data.