Darveaux 모델에 의한 플립칩 패키지 솔더 접합부의 열피로 해석 및 수명 평가 = The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model

다국어 초록 (Multilingual Abstract)

Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.

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