전자 패키징의 플립칩 본딩 기술과 신뢰성 = Flip-chip Bonding Technology and Reliability of Electronic Packaging

참고문헌 (Reference)

1 "전자부품연구원 전자정보센터"

2 K. Takahashi, "Ultra-high-density interconnection technology of three-dimensional packaging" 43 : 1267-1279, 2003

3 B. Morgan, "Substrate interconnect technologies for 3-D MEMS packaging" 81 : 106-116, 2005

4 J.H. Lau, "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies" McGRAW HILL BOOK Co. 1-9, 1997

5 S.S. Ha, "S.S. Ha: Master degree thesis, Sungkyunkwan University" 2006

6 J.W. Yoon, "Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating" 22 (22): 2007

7 T. Velten, "Packaging of Bio-MEMS: Strategies, Technologies, and Applications" 28 (28): 533-546, 2005

8 K. Hara, "Optimization for chip stack in 3-D packaging" 28 : 367-376, 2005

9 J.H. Lau, "Low Cost Flip Chip Technologies" McGRAW HILL BOOK Co. 1-90, 2001

10 J.W. Yoon, "J.W. Yoon: Ph.D degree thesis, Sungkyunkwan University" 2006

11 O.V. Abramov, "High-Intensity Ultrasonics, Theory and Industrial Applications" Gordon and Breach Science Publishers 604-625, 1998

12 D.G. Kim, "Fabrication of through-hole interconnect in Si wafer for 3D package" 24 (24): 172-178, 2006

13 Q.T. Huynh, "Electromigration in eutectic SnPb solder lines" 89 : 4332-4335, 2001

14 J.W. Kim, "Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process" 452-453, 2007

15 Y.K. Tsui, "Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing" 28 : 413-420, 2005

16 J.W. Yoon, "Core technology of electronic packaging" 23 (23): 116-123, 2005

17 J.W. Kim, "Application of MEMS technology in microelectronic packaging" 24 (24): 142-149, 2006