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Decreasing the Time-to-Market Through Virtual Risk Assessment and Risk Mitigation
Pecht, M. G. ASME 1997 p.1-6
Surface Mount Packaging and Assembly: Past, Present, and Future
Hwang, J. S. ASME 1997 p.19-24
Wyndrum, R. W. ASME 1997 p.25-28
Next Generation of Packaging: Challenges and Recent Advances
Tummala, R. R. ASME 1997 p.29-36
Plastic Packaging-Related Consortia Activities: An Update
Nguyen, L. T.; Johnson, R. W. ASME 1997 p.41-46
Evolution of Microelectronics Packaging in Taiwan: Getting Ready for BGA and MCM
Lin, A. W. ASME 1997 p.47-56