Recently, because of development of semiconductor technology, number of pads at unit area is increasing and pad array have become irregular 2-dimensional. Therefore, we have developed micro-spring for application of vertical type MEMS probe tip with s...
Recently, because of development of semiconductor technology, number of pads at unit area is increasing and pad array have become irregular 2-dimensional. Therefore, we have developed micro-spring for application of vertical type MEMS probe tip with small area(about 100㎛²). Main process of fabrication is wafer bonding, Si etching by DRIE and elector-plating, and material of the electro-plated micro-spring is Ni-Co alloy. For the design optimization, we designed various models and measured successfully produced micro-springs in micro compression & tensile tester. Structure analysis of the micro-spring was accomplished with FEM(Finite Element Method) and compared with measurement value. In this study, we verified potentiality for application of the vertical type probe tip with small area, showing displacement of 10~40㎛ at contact force of 1~8g<SUB>f</SUB>.