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Improved Performances of AlN/Polyimide Hybrid Film and its Application in Redistribution Layer
Zhe Liu,Guifu Ding,Jiangbo Luo,Wen Lu,Xiaolin Zhao,Ping Cheng,Yanlei Wang 대한금속·재료학회 2016 ELECTRONIC MATERIALS LETTERS Vol.12 No.5
The AlN/polyimide (PI) hybrid film was studied as thedielectric layer in the redistribution layer (RDL) in this work. The incorporation of the AlN into the PI matrix was achievedby mechanical ball-milling process. The spin-coating processwas used to fabricate the AlN/PI hybrid film, which iscompatible with micro-electro-mechanical system (MEMS)technology for fabricating RDL. The AlN/PI hybrid film wascharacterized by Fourier transform infrared (FTIR) spectrumand thermogravimetric analysis (TGA). The effect of the AlNcontent on the thermal stability, thermal expansion coefficient,hardness and water adsorption of the AlN/PI hybrid film wasstudied. The results indicated that the addition of AlN nanoparticlesimproved the thermal stability and hardness, butdecreased the thermal expansion coefficient and waterabsorption of the pure PI film. As an example of its typicalapplication, the AlN/PI hybrid film with 8 wt.% AlN waspatterned using micromachining technology and used as thedielectric layer in RDL successfully.
Self-assembled magnetic lamellar hydroxyapatite as an efficient nanovector for gene delivery
Guangyao Xiong,Yizao Wan,Guifu Zuo,Kaijing Ren,Honglin Luo 한국물리학회 2015 Current Applied Physics Vol.15 No.7
Magnetic lamellar hydroxyapatite (ML-HA) nanoparticles were synthesized by a template-assisted selfassembly process. The as-prepared ML-HA nanoparticles self-assembled under different conditions were characterized by XRD, TEM, cytotoxicity assessment, and DNA-loading and transfection efficiency measurements. We found that the structure and morphology of ML-HA were controlled by self-assembly conditions. The ML-HA synthesized in this work exhibited good biocompatibility. The DNA-loading capacity and z-potential of ML-HA were much lower in comparison to bare lamellar HA (L-HA) without magnetic nanoparticles. Despite that, the ML-HA with good lamellar structure showed 47% higher transfection efficiency than L-HA. Results suggested that the ordered lamellar structure is a key factor in controlling transfection efficiency and magnetization is an effective way of improving the transfection efficiency of lamellar HA. Mechanisms were proposed to interpret these experimental results. It is demonstrated that the ML-HA may be a promising gene vector to deliver DNA into the cells effectively and safely.
A Review of Epitaxial Metal-Nitride Films by Polymer-Assisted Deposition
Hongmei Luo,Haiyan Wang,Guifu Zou,Eve Bauer,Thomas M. McCleskey,Anthony K. Burrell,Quanxi Jia 한국전기전자재료학회 2010 Transactions on Electrical and Electronic Material Vol.11 No.2
Polymer-assisted deposition is a chemical solution route to high quality thin films. In this process, the polymer controls the viscosity and binds metal ions, resulting in a homogeneous distribution of metal precursors in the solution and the formation of crack-free and uniform films after thermal treatment. We review our recent effort to epitaxially grow metal-nitride thin films, such as hexagonal GaN, cubic TiN, AlN, NbN, and VN, mixed-nitride Ti1-xAlxN, ternary nitrides tetragonal SrTiN2, BaZrN2, and BaHfN2, hexagonal FeMoN2, and nanocomposite TiN-BaZrN2.
Honglin Luo,Yang Zhang,Zhiwei Yang,Guifu Zuo,Quanchao Zhang,Fanglian Yao,Yizao Wan 한국물리학회 2019 Current Applied Physics Vol.19 No.11
In this work, doxorubicin (DOX) was intercalated into layered nanohydroxyapatite (LHAp). The drug loaded LHAp (DOX@LHAp) was then mixed with poly(lactic-co-glycolic acid) (PLGA) and electrospun to yield DOX@ LHAp/PLGA composite scaffolds. As control, needle-like nanohydroxyapatite (nHAp) was also used to make an DOX@nHAp/PLGA composite scaffold and bare DOX was used to fabricate DOX/PLGA scaffold. The morphology, release behavior of DOX, and capability to inhibit cancer cells were assessed. The addition of DOXloaded nHAp to PLGA causes a slight decrease in the average fiber diameter of DOX@LHAp/PLGA as compared to PLGA. The in vitro drug release tests reveal a much faster release of DOX from DOX/PLGA than DOX@LHAp/ PLGA. Moreover, DOX@LHAp/PLGA displays a more sustainable release over DOX@nHAp/PLGA due to the storage of DOX in the gallery of LHAp, which is further proved by their cancer cell inhibition results. We believe that the DOX@LHAp/PLGA scaffold has potential as an implantable drug delivery system.
A Review of Epitaxial Metal-Nitride Films by Polymer-Assisted Deposition
Luo, Hongmei,Wang, Haiyan,Zou, Guifu,Bauer, Eve,Mccleskey, Thomas M.,Burrell, Anthony K.,Jia, Quanxi The Korean Institute of Electrical and Electronic 2010 Transactions on Electrical and Electronic Material Vol.11 No.2
Polymer-assisted deposition is a chemical solution route to high quality thin films. In this process, the polymer controls the viscosity and binds metal ions, resulting in a homogeneous distribution of metal precursors in the solution and the formation of crack-free and uniform films after thermal treatment. We review our recent effort to epitaxially grow metal-nitride thin films, such as hexagonal GaN, cubic TiN, AlN, NbN, and VN, mixed-nitride $Ti_{1-x}Al_xN$, ternary nitrides tetragonal $SrTiN_2$, $BaZrN_2$, and $BaHfN_2$, hexagonal $FeMoN_2$, and nanocomposite TiN-$BaZrN_2$.
Yanmei Liu,Yunna Sun,Yan Wang,Guifu Ding,Bin Sun,Xiaolin Zhao 대한금속·재료학회 2017 ELECTRONIC MATERIALS LETTERS Vol.13 No.1
A complex reinforced polymer interposer comprised with conductive Nicylinders, ordered Ni grid and SiC nano-whiskers/Polyimide (PI)composite was proposed. The conductive Ni cylinders distributing in themiddle of each Ni grid unite designed as the supporting structure wereused as electric connecting component for the interposer and wereinsulated by the SiC nano-whiskers/PI composite. The comprehensiveproperties of the complex reinforced polymer interposer were improvedby a complex reinforced mechanism: the improved thermal conductivityand mechanical strength by the Ni supporting structure and the reducedmetal/polymer interfacial mismatch due to the SiC nano-whiskers/PIcomposite with the optimized mixture ratio. The above complexreinforced polymer interposer and a traditional reinforced polymerinterposer only with Ni grid were fabricated using micro-machiningtechnology for comparative analysis. The comprehensive properties ofthese two polymer interposers were analyzed respectively. Comparedwith the traditional design, the comprehensive properties of the proposedcomplex reinforced polymer interposer were improved further, such as,21.3% increase for the Young modulus, 10.1% decrease for thecoefficient of thermal expansion (CTE) and 54.9% increase for thethermal conductivity. Such complex reinforced mechanism based on themetal ordered grid and random nano-whiskers has potential to expandthe applications of the polymer interposer.
Wenwen Zhou,Yahui Li,Yunna Sun,Jinyuan Yao,Xutong Song,Guifu Ding 대한금속·재료학회 2020 ELECTRONIC MATERIALS LETTERS Vol.16 No.6
SU-8 photoresist has been more and more widely used as a structural material in micro electromechanical system (MEMS) because of its low cost and excellent biocompatibility. However, the inferior mechanical and thermal performances immensely impinge the reliability of the MEMS device based SU-8 and accordingly restrict its application. Here we report the mechanicaland thermal performance of SU-8 reinforced by the multilayer glass fabric with the MEMS technology. The finite element simulation and specific experiment are conducted, which confirm that the reinforced SU-8 composites have a 281% increase in Young’s modulus and a 64% decrease in coefficient of thermal expansion (CTE) compared with pure SU-8. Additionally,the improved mechanism has also been analyzed, including the excellent interface bonding between the SU-8 and glass fabric, and the high-bond energy of Si–O-Si chain structures in glass fabric. Furthermore, the glass fabric reinforced SU-8 could still possess a high light transmittance to maintain the ability of lithography patterning. Therefore, it is believed thatthe strategy proposed here may satisfy higher requirements of MEMS devices, which guarantees its practical applications in the functional microstructures.