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A Wavelet-Based Approach in Detecting Visual Defects on Wafer Dies
Yeh Chihao,Wu Fulchiang,Chang Chinglan,Chiu Chuiyu,Ji Weilung 제어로봇시스템학회 2009 제어로봇시스템학회 국제학술대회 논문집 Vol.2009 No.8
The objective of this paper is to implement two-dimensional wavelet transform (2-D WT) in detecting the visualdefects such as particle and scratch on wafer dies. The gray image of 1/20 wafer die is initially processed by smooth and high-pass filters, then, it is decomposed directly by 2-D WT at multiple scales and different wavelet bases. The inter-scale ratio from the wavelet transform modulus sum (WTMS) across adjacent decomposition levels (scales) for suspicious pixels on a wafer die are calculated to detect the visual defects.