http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
SEALING OF POLYMER MICRO DEVICES USING A BOILING POINT CONTROL SYSTEM
Taehyun Park(박태현),In-Hyouk Song(송인혁),Michael C. Murphy 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
A new advanced technique for thermoplastic fusion bonding (TPB) using a Pressure-Assisted Boiling Point (PABP) control system was developed. The proposed PABP system enables precise control of both the temperature and pressure in the fusion layer. The temperature variation was ~ 0.1℃ at the target temperature and a uniform pressure distribution was accomplished. Very low aspect ratio channels (AR=1/100, 10 ㎛ in depth and 1000 ㎛ in width) were successfully sealed without deformation or collapse. Bond strengths were greater than 496 ㎪. In addition, a microfluidic system on a non-flat surface was sealed, enabling Lab-on-a-Foil technology. The PABP system can be easily built using inexpensive components and simply operated. Moreover the PABP system should be scalable for mass production and large area devices.