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용량형 Bulge 시험기를 이용한 금속 박막의 기계적 물성 측정
현승민(Seungmin Hyun),이학주(Hak-Joo Lee),이상주(Sang-Joo Lee),박현성(Hyun-Sung Park) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.10
The mechanical behavior of thin films is very important to semiconductor and MEMS devices due to reliability issues. Thin metal films are often used as structural elements under various conditions. To understand mechanical behavior of thin film, we have utilized a bulge system and measured mechanical behavior of Al thin films. Al thin films were prepared on 2㎜ ×12 ㎜ rectangular silicon nitride membrane window in 2 x 2 ㎝ silicon frame. Load was applied to the membrane by Nitrogen gas and the bulge displacement was measured by the capacitance changes between the membrane and an electrode. The system provides a precise measurement of stress relaxation behavior of Al thin films at low strain.
공명법을 사용한 나노 스케일 Al 박막의 열-기계적 거동 측정
현승민(Seungmin Hyun),박정민(Jungmin Park),이학주(Hak-Joo Lee),Walter Brown 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
Thin films in the sub micrometer thickness range have been studied due to their importance in applications such as semiconductor devices, storage media and micromechanical systems. There has been enormous progress in micromechanical system design and fabrication to take advantage of structures with small dimensions. For micromechanical systems such as micromirrors, the long-term stress stability of the thin metal films is a major concern because residual stresses present in metal layers and changes in those stresses with time cause undesired curvature and curvature changes in films on substrates. Among several metal films that serve as structural elements or reflective surfaces in this type of application, Al is attractive because it is light and provides good reflectivity at low cost compared to more noble metals. In order to gain a better understanding of mechanical behavior in very thin films we have studied the stress changes of nanoscale Al thin films using a unique resonance system
나노압입시험기를 이용한 MEMS 공정조건에 따른 SU-8 감광제의 기계적 물성 측정
최현주(Hyun-ju Choi),김재현(Jae-Hyun Kim),이학주(Hak-joo Lee),현승민(Seungmin Hyun),한승우(Seung-Woo Han) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.11
The interest of utilizing SU-8 for the fabrication of thick micro-electro-mechanical systems(MEMS) has been growing recently. Especially SU-8 is a widespread material for soft structures in MEMS applications. However, the fabrication of thick SU-8 MEMS process has been experienced severe problems such as cracks, distortions and delaminations due to post expose bake(PEB) photolithography process. In order to design a reliable device using SU-8 , it is necessary to measure the mechanical properties of SU-8. The mechanical behavior of micro-scale structures usually is very different from that of the bulk materials. The behavior of small scale structures is dependent on their dimension and fabrication process. In this study, we used an advanced Pillar Compression Test using nanoindentation apparatus to measure the stress-strain relationship of SU-8 micro pillars fabricated by MEMS process. Stress-strain curves and mechanical properties of baked SU-8 pillar at 65℃ ~ 120 ℃ were extracted from measured load-displacement data.
고속 전단시험법을 이용한 Sn-37Pb/Cu와 Sn-37Pb/ENIG 솔더 접합의 기계적신뢰성 평가
전성재(Seong-jae Jeon),현승민(Seungmin Hyun),이후정(Hoo-Jeong Lee),이학주(Hak-Joo Lee) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu and Sn-37Pb/Electroless Nickel immersion Gold under bump metallization solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures (120 ℃, 150 ℃, 170 ℃) and afterward tested at different displacement rates (0.01 ㎜/s to 500 ㎜/s) to examine the effects of aging on the drop life reliability. The combination of the stress-strain graphs captured from the shear tests and identifying a fracture mode dominant in the samples for different strain rates leads us to conclude that the drop reliability of solder joints degrades as the aging temperature increases, possibly due to the role of the IMC layer. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.
열 사이클(Thermal cycle) 하에서 그래핀(Graphene) 박막의 기계적 거동
황보윤(Yun Hwangbo),현승민(Seungmin Hyun),이학주(Hak-Joo Lee),이영빈(Young-Bin Lee),안종현(Jong-Hyun Ahn) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.11
As a new material, graphene is expected to be a promising material for various applications. The study of its basic property in graphene is now being carried out by many research groups in the whole world. On the other hand, a study of graphene film fabricated by chemical vapor deposition (CVD) method is still more needed. This paper presents the mechanical and electrical behavior of graphene film under thermal cycle conditions. Graphene film was transferred on silicon nitride (SiN<SUB>x</SUB>) membrane and to evaluate residual stress of graphene film, the resonance system was used. The system derives graphene film electrostatically and detects the continuous change of resonant frequency under thermal cycles. Residual stress due to the difference in thermal expansion coefficient between SiNx and graphene was obtained from the resonant frequency. Simultaneously, the variation of resistance in graphene film was also measured to assess electrical behavior under thermal cycle.
4 점굽힘시험법 이용 나노임프린트용 폴리머의 접착력 평가
장은정(Eun?Jung Jang),현승민(Seungmin Hyun),최대근(Dae-Geun Choi),박영배(Young-Bae Park),이학주(Hak-Joo Lee) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.10
The adhesion property in UV-nanoimprint lithography is very important due to a sticking problem between UV curable resin and a substrate after a pull-off process. Self-assembly monolayer(SAM), is often used to increase adhesion of UV resin on a substrate. In this paper, we have tested adhesion properties of UV resin/substrate interfaces using 4 point bending test. Glass wafer as a substrate was carefully cut for the test and UV curable resin was dispensed on the slice of the wafer. The properties between the resin and glass wafer were evaluated with various surface treatment conditions such as O2 plasma, 3-acryloxypropyl methyldichlorosilane(APMDS), 3- aminopropyl triethoxysilane(APTS), 3-gycidoxypropyl trimethorysilane(GPTS). The test results showed quantitative comparisons of interfacial fracture energy (G) among surface treatment conditions.
열사이클하의 공진주파수 측정을 통한 알루미늄 박막의 잔류응력 평가
박정민(Jungmin Park),현승민(Seungmin Hyun),Walter Brown,이학주(Hak-Joo Lee) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
The residual stress of nano-scale aluminum thin films, which are deposited on relatively thick tensile silicon nitride membranes, was evaluated by resonance system. The system electrostatically actuated membranes and detected resonant frequency. Resonance frequency of aluminum film on membrane is converted to residual stress. Since aluminum film was deposited on silicon nitride membranes, composite stress of aluminum and silicon nitride layers was evaluated. To subtract aluminum film stress only, another apparatus has been added to the system for acquiring resonant frequency of silicon nitride membrane. In this study aluminum thin films as a function of thickness were subjected to thermal cycle from room temperature to 300 't in vacuum, their change of stress and characteristic features were investigated.