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저온 합성을 이용한 인듐 주석 산화물 나노입자 및 졸 박막의 제작
홍성제 ( Sung Jei Hong ),한정인 ( Jeong In Han ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 ELECTRONIC MATERIALS LETTERS Vol.2 No.2
In this paper, indium tin oxide (ITO) nanoparticle and sol film were successfully fabricated by using low temperature synthetic method. The synthetic method is to eliminate the chloridic and nitridic elements which are included in the current wet type synthetic method. Therefore, it is possible to lower synthetic temperature lower than 600℃ required to eliminate the harmful elements. Accordingly, fine particle can be achieved by applying the process. Particle size, surface area, crystal structure, and composition ratio of the synthesized ITO nanoparticle by using the method were analyzed with high resolution transmission electron microscopy (HRTEM), BET surface area analyzer, X-ray diffraction (XRD), and energy dispersion spectroscopy (EDS). As a result, its particle size is less than 10 nm and the surface area exceeds 100㎠/g. The XRD analysis indicates that the cystal structure of the powder is cubic one with orientation of <222>, <400>, <440>. Also, the analysis of the composition demonstrates that the around 8 wt% tin is uniformly included in In2O3 lattice of the nanoparticle. Also, using the synthesized ITO nanoparticle, ITO sol thin film was fabricated. As a result, the optimized ITO sol thin film could be successfully fabricated with good optical transmittance over 83% and electrical resistance less than 7×10(3) Ω by including the 0.6wt% ITO nanoparticle into the ITO sol.
COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구
한정인,Han, Jeong-In 한국재료학회 1995 한국재료학회지 Vol.5 No.7
LCD 모듈을 위한 실장 기술인 Chip on Glass 공정 기술을 개발함에 있어 구동 IC와 기판d의 Al 전극을 연결하기 위하여 기존의 기술과의 연관성 및 공정의 연속성, 제조단가등을 고려하여 Pb-Sn 범프를 사용하고자 하였으며 이를 위해 Al 금속 박막위에 니켈 무전해 도금하는 방법을 연구 하였다. Al 전극에 무전해 니켈 도금하기 위해서는 광레지스트 차폐막을 손상하지 않는 전처리 방법이 필요하기 때문에 전처리 방법으로서 알칼리 아연산염 처리법과 불화물을 이용한 아연산염 처리법을 선택하여 실시하였다. 이 가운데 산성불화암모늄(NH$_4$HF)을 1.5 g/$\ell$ 함유하고 황산아연(ZnSO$_4$)을 100 g/$\ell$ 함유한 산성 아연산염 용액에서는 광레지스트 차폐막이 손상되지 않았으며 처리시간을 적절히 조절함으로써 알루미늄 박막상에 선택적으로 니켈 무전해 도금을 할 수 있었다. 아연산염 응액중의 첨가제와 무전해 도금액 중의 억제제인 Thiourea는 도금층의 평활도를 높이는 역할을 하였다. 또한 아연산염 처리를 하기 전에 산세 처리를 함으로써 도금층의 균일성을 향상시킬 수 있었다. To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.
COG(Chip On Glass)를 위한 ACA (Anisotropic Conductive Adhesives) 공정 조건에 관한 연구
한정인,Han, Jeong-In 한국재료학회 1995 한국재료학회지 Vol.5 No.8
구동 IC를 유리기판 위의 Al패드 전극에 연결하는 LCD(Liquid Crystal Display) 모듈을 실장하는 Chip On Glass (COG) 기술을 개발하기 위하여 기존에 잘 알려진 기술 가운데 실제로 적용 가능성이 가장 유망한 이방성 도전 접착제 (ACA, Anisotropic Conductive Adhesives)를 사용한 공정에 대하여 조사하였다. ACA 공정은 본딩 부분에 ACA 수지를 균일하게 분포시키는 공정과 자외선을 조사하여 수지를 경화하여 칩을 실장하는 공정의 2단계로 진행하였다. 칩에 가해준 하중은 2-15kg이었고 칩의 예열 온도는 12$0^{\circ}C$이었다. 이방성 도전체는 Au 또는 Ni이 표면 피막 재료로 사용된 것을 사웅하였으며 전도성 입자의 갯수가 500, 1000, 2000, 4000개/$\textrm{mm}^2$이며 크기가 5, 7, 12$\mu\textrm{m}$이었다. ACA 처리의 결과 입자 크기가 5$\mu\textrm{m}$이고 입자 밀도는 4000개/$\textrm{mm}^2$일 경우가 대단히 낮은 접촉 저항 및 가장 안정된 본딩 특성을 나타냈었다. In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.
IEC 61850 기반의 IED 통합 엔지니어링 툴 개발
한정열(Jeong-Yeol Han),안용호(Yong-Ho Ahn),장병태(Byung-Tae Jang),송인준(In-Jun Song),김용학(Yong-Hak Kim) 한국조명·전기설비학회 2010 조명·전기설비학회논문지 Vol.24 No.8
IEC 61850 기반의 변전소자동화 시스템을 구축하기 위해서는 실계통 변전소에서 엔지니어링이 가능한 IED 공통의 엔지니어링 툴 개발이 요구된다. 따라서 본 연구에서는 해외 선진사가 지원하는 시스템 및 SCL 구성 툴과 같이 IED 상호간의 통신분석 및 운영관리에 요구되는 IED 통합 엔지니어링 툴을 개발하고자 한다. 본 연구에서 개발된 IED 통합 엔지니어링 툴은 IEC 61850에서 규정하는 XML 기반의 언어로 작성된 ICD, SCL 및CID 파일을 생성, 편집 및 저장할 수 있는 프로그램이다. 특히 IEC 61850 기반으로 국내에서 개발된 IED에 대한 엔지니어링 작업 등 모든 IED에 적용이 가능한 범용적인 툴로써, IED에 대한 신뢰성 검증과 사용자 중심의 편리함과 효율성을 제공할 수 있다는 장점을 갖고 있다. In order to construct the IEC 61850 based substation automation system, the IED integration engineering tool is necessary to cope with the substation automation by full digital devices in the real power system. Compared the configuration tools provided IED vendors which are able to support the operation and communication analysis among IEDs, the XML based IED integration engineering tool can build, edit and save the ICD, SCL and CID files. Particularly, the IED integration engineering tool is possible to apply the IEC 61850 based IEDs to engineering the systems and also provides the reliability and efficiency of the system to the utilities and manufacturers.
나노 가스 감지 소자의 특성에 미치는 촉매 구조의 영향
홍성제,한정인,Hong, Sung-Jei,Isshiki Minoru,Han, Jeong-In 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.10
In this paper, effect of catalytic configuration on the sensing properties of $SnO_2$ nanoparticle gas sensitive thick film was investigated. Two types of catalytic configuration, mono and binary, were made on the $SnO_2$ nanoparticle. In case of mono catalytic system, $3 wt\%$ Pd or Pt catalyst was doped onto the $SnO_2$ nanoparticle, respectively. In case of binary catalytic system, Pd and Pt was doped simultaneously with concentration ratio of 1:2 to 2:1 onto the $SnO_2$ nanoparticle. After doping, gas sensitive thick film was printed on alumina substrate and heat-treated at 450 to $600^{\circ}C$. Gas sensing properties was evaluated using 500 to 10,000 ppm $CH_4$ gas. As a result, gas sensitive thick film with binary catalytic system showed unstable phenomena that the gas sensitivity was changed according to aging time. In contrary, the mono catalytic system showed relatively stable phenomena despite of aging time. Especially, gas sensitive thick film doped with $3 wt\%$ Pt catalyst and heat-treated at $500^{\circ}C$ showed good sensing properties such as 0.57 of $R_{3500}/R_{1000}$ and very small variation within $3.5\%$ after aging for 5 hours, and response time was very short less than 20 seconds.
그래핀나노플레이트렛 및 재활용 페놀폼으로 제조된 목재기반 복합보드의 난연 및 열적 특성
한정인 ( Jeong-in Han ),김민지 ( Min-ji Kim ),송은지 ( Eun Ji Song ),김경훈 ( Kyung Hoon Kim ),인세진 ( Se-jin In ),이영석 ( Young-seak Lee ) 한국공업화학회 2019 공업화학 Vol.30 No.3
그래핀나노플레이트렛(GnP)이 목재기반 복합보드의 열적 및 난연 특성에 미치는 영향을 조사하기 위하여, 5, 10, 및 20 wt% 등 여러 가지 GnP 함량으로 GnP/재활용 페놀폼(re-PF)/목재 복합보드를 제조하였다. 제조된 복합보드의 열적특성 및 난연성은 열중량분석(TGA) 및 한계산소지수(LOI) 시험을 통하여 각각 분석되었다. 복합보드의 열안정성은 GnP 첨가량에 따라 비례하게 증가하였고, 이 복합보드의 탄화수율(char yield)은 순수 목재보드 대비 최대 22%까지 증가하였다. 복합보드의 LOI 값은 순수 목재보드보다 약 4.8~7.8% 높았다. 또한, 재활용 페놀폼 및 GnP 첨가로 인하여 복합보드의 난연성이 크게 향상되었음을 확인하였다. 이는 열안정성이 높은 재활용 페놀폼과 GnP가 복합보드의 열분해 개시 온도를 지연시키고, 탄화층(char layer)을 보다 조밀하고 두껍게 형성하였기 때문에, 복합보드의 연소 지연효과를 이끌었다. 특히 탄소기반 재료로서 GnP는 탄화층의 형성을 용이하게 하고, 탄화수율을 현저히 증가시켜 재활용 페놀폼에 비하여 난연성에 높은 효과를 나타내었다. Graphene nanoplatelet (GnP)/reused phenolic foam (re-PF)/wood composite boards were fabricated with different GnP content as 5, 10 and 20 w/w% to investigate the effect of GnP on thermal- and flame retardant properties of wood-based composite boards. The thermal- and flame retardant properties of fabricated composite boards were investigated by thermogravimetric analysis (TGA) and limiting oxygen index (LOI), respectively. The thermal stability of the composite boards increased proportionally with respect to the amount of GnP, and the char yield of these boards increased up to 22% compared to that of the pure wood board. The LOI values of composite boards were about 4.8~7.8% higher than those of using pure wood boards. It was also confirmed that the flame retardant properties of composite boards were remarkably improved by the addition of re-PF and GnP. These results were because of the fact that the re-PF and GnP with a high thermal stability delayed the initial thermal degradation temperature of composite boards and made their char layers denser and thicker which led the overall combustion delay effect of the composite board. Especially, GnP as a carbon-based material, facilitated the char layer formation and increased remarkedly the char yield, which showed higher effect on flame retardant properties than those of the re-PF.
홍성제,한정인,Hong, Sung-Jei,Han, Jeong-in 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.10
In this paper, synthetic conditions of titania nanparticle was investigated to enhance its uniformity of the particle size as a child particle on organic mother particle of liquid powder type electronic paper. The physical properties are very important to improve the uniformity of electrical charging properties Concentration of titania raw material ($C_9H_{19}NO_4Ti$) in the ethanol solvent, pH, and concentration of the solution in the D.I. water were selected as parameters. As a result, ultrafine and well crystallized titania nanoparticle with good uniformity could be synthesized as the concentration of the $C_9H_{19}NO_4Ti$ in the ethanol solvent, pH of the solution, and the amount of the D.I. water were increased. Using the optimized conditions, the titania nanparoticle with uniformly ultrafime size of 10 nm could be synthesized.
한영인,한정인,손수경,Han, Yeong-In,Han, Jeong-In,Son, Su-Gyeong 한국호스피스협회 2005 호스피스 학술지 Vol.5 No.2
Purpose : The purpose of this study were to identify the relationship of depression and pain in patients with breast cancer. Method : The data was collected from 117 breast cancer patients who were admitted at K University hospital in Busan, from January 4, to January 31, 2003 using questionnaire method. Their depression was measured using depression scale developed by Zung(1965) and translated by Song(1977) and pain was measured using the Revised Melzack Pain Scale developed by Melzack(1975). The data were analysed by the SPSS WIN 11.0 PC program using frequency and percentage, t-test, ANOVA, Pearson Correlation Coefficient. Result : The results of this study were as follows: The mean and standard deviation of the total depression score were 48±7.89 in 20(lowest)-to-80(highest) scoring system. The analysis of the depression according to general characteristics of the breast cancer patients showed correlation at Age(F=5.81, p=.000), Education level (F=7.48, p=.000), Insurance for cancer(t=6.94, p=.010), Period after Dx(F=6.85, p=.001), Duration of pain experience(F=9.74, p=.000), Surgical method(F=3.87, p=.005), Stage(F=10.31, p=.000), and Lesion site(F=20.63, p=.000). The mean and standard deviation of the total pain score were .48± .40 in 0(lowest)-to-4(highest) scoring system. The analysis of the pain according to general characteristics of the breast cancer patients showed differentiation at Education level(F=3.75, p=.007), Income per mouth(F=3.77, p=.010), Period after Dx(F=3.77, p=.002), Duration of pain experience(F=5.48, p=.000), Stage(F=10.39, p=.000), and Lesion site(F=8.10, p=.000). There was a significant positive correlation between depression and pain(r=.37, p=.000) and between depression and discomfort(r=.37, p=.000). Conclusion : Patients with breast cancer experiencing depression and pain. Increase in depression was associated with increase in pain and discomfort. Nurses must provide patients with nursing care about the occurrence of depression and interventions to deal with pain control and prevent discomfort.