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천연고무 컴파운딩의 초탄성 재료 모델링 및 차량용 부싱 성능의 유한요소해석 연구
조중근(Jung Keun Cho),김라성(Ra Sung Kim),박인경(In-Kyung Park),김예찬(Ye Chan Kim),황민주(Min Ju Hwang),서종환(Jonghwan Suhr),정헌섭(Heon Seob Jung),강재욱(Jae Wook Kang),남재도(Jae-Do Nam) 한국고분자학회 2018 폴리머 Vol.42 No.6
본 연구에서는 차량용 고무 부싱의 설계기준이 되는 강성(stiffness)을 정확히 예측하기 위해 천연고무 컴파운드의 응력-인장 특성을 반영한 Ogden 3차 초탄성 모델이 고무 재료의 거동을 가장 정확하게 예측한다는 것을 규명하였다. 스웨이징 공정에 의한 4.6%의 변형 결과를 재료의 응력-변형률에 보정(calibration)하여 초탄성 모델에 적용한 결과, 스웨이징 효과를 고려하지 않은 예측 대비 약 45% 정확도가 향상되었으며, 실제 시험 결과와 99.6%의 정확도를 보였다. 본 연구는 정확한 고무소재 물성의 모델링을 통하여 부싱의 특성을 성공적으로 예측할 수 있다는 것을 확인하였고, 이를 통해 차량용 부싱의 설계, 공정 및 성능 평가 단계를 획기적으로 단축할 수 있는 방법을 제안하였다. The design process in automobile industry requires to predict the stiffness of rubber busing materials. The behavior of rubber compound can be simulated using the strain energy density function. It is needed to consider the change of the material properties because the compression deformation caused by the swaging process of the busing. In this study, numerical simulations of the stress-strain curve including the swaging process were carried out using the finite element method and compared with experimental data. The Ogden 3rd model of strain energy density functions predicted the behavior of the busing with natural rubber compound. The stress-strain curves of the rubber busing was calibrated using that the initial compression of the swaging process was the 4.6% strain. Compared to the stiffness of the bushing without swaging effect, the stiffness was improved by 45% and had 99.6% accuracy with the actual test results.
3D Cyber Museum Service의 Multicast performance Monitoring 구조 설계
조중근(Joong-Keun Cho),박인수(In-Soo Park),박용진(Yong-Jin Park),권용무(Yong-Moo Kwon) 한국정보과학회 2002 한국정보과학회 학술발표논문집 Vol.29 No.2Ⅲ
본 논문에서는 3D Cyber Museum Service에서의 효과적인 Multicast performance monitoring을 위한 receiver 기반의 분산 모델을 제안한다. 멀티캐스트 네트워크를 통해 전송되는 멀티미디어 서비스의 효과적인 performance monitoring을 위해서 사용자들이 경험하는 QoS를 사용자의 호스트상에서 보다 직접적으로 측정하고, 멀티캐스트를 사용함으로써 얻어지는 대역폭의 효율적인 사용에 대한 측정을 위한 모델을 설계한다.
Lactobacillus spp. 와 Bifidobacterium spp. 에 의한 돌연변이원물질 2-Nitrofluorene 에 대한 돌연변이 억제특성
윤영호(Y . H . Yoon),조중근(J . G . Cho) 한국낙농식품응용생물학회 1998 Journal of Dairy Science and Biotechnology (JMSB) Vol.16 No.2
N/A Studies on the antimutagenicity of Lactobacillus spp. and Bifidobactrium spp. against 2-nitrofluorene have been conducted utilyzing Salmonella typhimurium TA 98 in order to characterize the activity by the starter and non-starter strains. The average antimutagenic activity of Lactobacillus spp. and Bifidobactrium spp. against 2-nitrofluorene was 20.29% and L. plantarum CU 722 revealed the greatest mutation inhibition activity of 50.34%. An intensive antimutagenicity was found in the cell wall and cytoplasm fraction of L. plantarum CU 722 in skim milk culture showing inhibition rate of 34.9% and 24.5% respectively and very low activity remained in cell free broth and in lactic acid The optimum cultivation time for Lactobacillus spp. and Bifidobacterium spp. to inhibit mutation was 24 hours and the optimum preincubation time of the reaction mixture containing the mutagen, lactic culture and indicator strain was 60 minutes, and the optimum incubation time for the test elates was 48 hours.
안영기,김현종,구교욱,조중근,Ahn, Young-Ki,Kim, Hyun-Jong,Koo, Kyo-Woog,Cho, Jung-Keun 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
Various methods of making thin film is being used in semiconductor manufacturing process. The most common method in this field includes CVD(Chemical Vapor Deposition) and PVD(Physical Vapor Deposition). Thin film is deposited on both the backside and the frontside of wafers. The thin film deposited on the backside has poor thickness profile, and can contaminate wafers in the following processes. If wafers with the thin film remaining on the backside are immersed in batch type process tank, the thin film fall apart from the backside and contaminate the nearest wafer. Thus, it is necessary to etch the backside of the wafer selectively without etching the frontside, and chemical injection nozzle positioned under the wafer can perform the backside etching. In this study, the backside chemical injection nozzle with optimized chemical injection profile is built for single wafer tool. The evaluation of this nozzle, performed on $Si_3N_4$ layer deposited on the backside of the wafer, shows the etching rate uniformity of less than 5% at the etching rate of more than $1000{\AA}$.
Kefir 와 Yogurt 로부터 분리된 Lactobacillus spp. 의 Probiotic 활성과 Pulsed Field Gel 전기영동에 의한 균주 동정
강동규(D . G . Kang),조중근(J . G . Cho),윤영호(Y . H . Yoon) 한국낙농식품응용생물학회 1998 Journal of Dairy Science and Biotechnology (JMSB) Vol.16 No.1
N/A Determinations on the probiotic activities of Lactobacillus spp. from yogurt and kefir and the strain identification studies were carried out by pulsed gel electrophoresis of genomic DNA, the following results were obtained: 1. A prominent antimutagenicity against 2-Nitrofluene by Lactobacillus plantarum CU 722, 685, and 735 was revealed and they possessed same genomic structures by PFGE. 2. L. acidophilus CU 674 showed the strongest cholesterol assimilation activity of 60.27 % and almost all the L. acidophilus did not show the cholesterol assimilation activity, which was strain dependent. 3. L. acidophilus CU 806 from domestic yoghurt showed a strong antagonistic activity against pathogenic Staphylococcus aureus ATCC 3939, which was strain dependent. 4. Grouping of Lactobacillus acidophilus strains into five types, and into three types of L. plantarum was possible by pulsed field gel electrophoresis pattern of the genomic DNA, probiotic activities of the homologous PFGE pattern sustained in different kind of fermented products.
안영기,김현종,성보람찬,구교욱,조중근,Ahn, Young-Ki,Kim, Hyun-Jong,Sung, Bo-Ram-Chan,Koo, Kyo-Woog,Cho, Jung-Keun 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
Wet etching process in recent semiconductor manufacturing is devided into batch and single wafer type. Batch type wet etching process provides more throughput with poor etching uniformity compared to single wafer type process. Single wafer process achieves better etching uniformity by boom-swing injected chemical on rotating wafer. In this study, etching characteristics of $SiO_2$ layer at room and elevated temperature is evaluated and compared. The difference in etching rate and uniformity of each condition is identified, and the temperature profile of injected chemical is theoretically calculated and compared to that of experimental result. Better etching uniformity is observed with single wafer tool with boom-swing injection compared to single wafer process without boom-swing or batch type tool.
안영기,최중봉,구교욱,조중근,김태성,Ahn, Young-Ki,Choi, Jung-Bong,Koo, Kyo-Woog,Cho, Jung-Keun,Kim, Tae-Sung 한국반도체디스플레이기술학회 2009 반도체디스플레이기술학회지 Vol.8 No.1
Typically, single-wafer wet etching is done by dispensing chemical onto the front and back side of spin wafer. The wafer is fixed by a number of chuck pins, which obstruct the chemical flow and would result in the incomplete removal of the remaining film, which can become a source of contamination in the next process. In this paper, we introduce a novel design of wafer chuck, in which chuck pins are groupped into two and each group of pins fixes the substrate alternatively. Two groups of chuck pins fix the high-speed spin substrate with non contact method using a magnetic material. The actual process has been executed to observe the effectiveness of this new wafer chuck. It was found that the new wafer chuck performed better than the conventional wafer chuck for removing the remaining film from the bevel and edge side of substrate.