전자현미경 In-Situ 관찰방법을 이용한 황동의 절삭성평가

정승부,임옥동,안성욱,Jung, Seung-Boo,Lim, Ok-Dong,An, Seong-Uk 한국현미경학회 1994 Applied microscopy Vol.24 No.3

In order to elucidate the machinability of lead brass, orthogonal machining experiment was conducted in SEM(Scanning Electron Microscope) equipped with a micro-machining device at a cutting speed of $7{\mu}m/s$ for brass containing 0.2 to 3wt% Pb. The microfactors (i.e., shear angle, contact length between chip and tool) were determined by in-situ observations. Machinability of brass containing lead is discussed in terms of the microfactors and the cutting resistant force tested by lathe cutting. The dynamic behavior of the chip formation of lead brass during the machining process was examined: The chips of lead brass form as a shear angle type. The shear angle increases with the content of lead in (6:4) brass. The pronounced effect of lead on the contact length between chip and tool was observed above 1% Pb. The cutting resistant force tested by lathe decreases remarkably with the lead content in brass. The observed microfactors are in close relation to the tested resistant force in macromachining.

마찰교반접합한 오스테나이트계 스테인리스강과 6013알루미늄 합금 이종 접합부의 접합 특성 및 계면 성질

이원배,정승부,Lee, Won-Bae,Biallas, gehard,Schmuecker, Martin,Jung, Seung-Boo 대한용접접합학회 2005 대한용접·접합학회지 Vol.23 No.5

Dissimilar joining of Al 6013-T4 alloys and austenite stainless steel was carried out using friction stir welding technique. Microstructures near the weld zone and mechanical properties of the joint have been investigated. Microstructures in the stainless steel side were composed of the heat affected zone and the plastically deformed zone, while those in the Al alloy side were composed of the recrystallized zone including stainless steel particles, the thermo-mechanically affected zone and the heat affected zone. TEM micrographs revealed that the interface region was composed of the mixed layers of elongated stainless steel and ultra-fine grained Al alloy with lamella structure and intermetallic compound layer. Thickness of the intermetallic layer was approximately 300nm and was identified as the A14Fe with hexagonal close packed structure. Mechanical properties, such as tensile and fatigue strengths were lower than those of 6013 Al alloy base metal, because tool inserting location was deviated to Al alloy from the butt line, which resulted in the lack of the stirring.

금속 이온 마이그레이션의 해석적 방법

홍원식,정승부,김광배,Hong Won-Sik,Jung Seung-Boo,Kim Kwang-Bae 대한용접접합학회 2005 대한용접·접합학회지 Vol.23 No.2

Ni-Aluminide 금속간 화합물의 확산과 고온산화 특성

이동복,정승부 ( Dong Bok Lee,Seung Boo Jung ) 대한금속재료학회 1997 大韓金屬學會會報 Vol.10 No.1

마찰교반프로세스를 이용한 금속기 복합소재 제조 및 특성

최돈현,연윤모,정승부,Choi, Don-Hyun,Yeon, Yun-Mo,Jung, Seung-Boo 대한용접접합학회 2012 대한용접·접합학회지 Vol.30 No.5

Friction stir processing (FSP), developed based on the basic principles of friction stir welding(FSW), a solid-state joining process originally developed for various metal alloys, is an emergingmetalworking technique that can provide localized modification and control of microstructures in near-surface layers of processed metallic components. The FSP causes intense plastic deformation, material mixing, and thermal exposure, resulting in significant microstructural refinement, densification, and homogeneity of the processed zone. The FSP technique has been successfully used for producing the fine-grained structure and surface composite, modifying the microstructure of materials, and synthesizing the composite and intermetallic compound in situ. In this review article, the current state of the understanding and development of FSP is addressed.

열소결로 제작된 유연기판 인쇄회로의 전기적 거동

김상우,감동근,정승부,Kim, Sang-Woo,Gam, Dong-Gun,Jung, Seung-Boo 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.3

열 소결 공정 중 소결 온도와 시간을 다르게 하여 제작된 은 인쇄회로의 전기적 거동과 유연성을 분석하였다. 은 인쇄회로의 비저항값과 고주파 전송 특성을 4-포인트 프로브 및 네트워크 분석기를 사용하여 각각 측정하였다. 비저항값은 DC 전류가 회로에 흐를 때의 전기 저항을, 고주파 전송 특성은 은 회로의 신호 전송 특성을 의미한다. 은 인쇄회로의 유연성은 IPC 슬라이딩 테스트 중 발생하는 회로 저항의 변화를 실시간으로 측정하여 평가하였다. 은 인쇄회로의 파괴 모드는 주사전자 현미경과 광학 현미경을 통해 관측하였다. 폴리이미드 기판 위에 인쇄된 은 회로의 비저항값은 소결 온도와 소결 시간이 증가함에 따라 급격하게 감소하였다. $250^{\circ}C$에서 45분간 열 소결된 은 인쇄회로의 비저항값이 가장 낮았으며 그 때의 값은 $3.8{\mu}{\Omega}{\cdot}cm$였다. 은 인쇄회로에서 발생한 균열은 슬라이딩 테스트 10만번 이후의 길이가 2.5만번 테스트 후의 균열보다 열 배는 더 길게 측정되었다. 측정된 전송계수와 반사계수는 전산모사 결과와 그 경향이 거의 일치하였으며 슬라이딩 테스트가 진행될수록 은 회로의 전송손실은 증가하였다. The electrical behavior and flexibility of the screen printed Ag circuits were investigated with infrared radiation sintering times and sintering temperatures. Electrical resistivity and radio frequency characteristics were evaluated by using the 4 point probe measurement and the network analyzer by using cascade's probe system, respectively. Electrical resistivity and radio frequency characteristics means that the direct current resistance and signal transmission properties of the printed Ag circuit. Flexibility of the screen printed Ag circuit was evaluated by measuring of electrical behavior during IPC sliding test. Failure mode of the Ag printed circuits was observed by using field emission scanning electron microscope and optical microscope. Electrical resistivity of the Ag circuits screen printed on Pl substrate was rapidly decreased with increasing sintering temperature and durations. The lowest electrical resistivity of Ag printed circuit was up to $3.8{\mu}{\Omega}{\cdot}cm$ at $250^{\circ}C$ for 45 min. The crack length arisen within the printed Ag circuit after $10{\times}10^4$ sliding numbers was 10 times longer than that of after $2.5{\times}10^4$ sliding numbers. Measured insertion loss and calculated insertion loss were in good agreements each other. Insertion loss of the printed Ag circuit was increased with increasing the number of sliding cycle.

CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합

구자명,문정훈,정승부,Koo, Ja-Myeong,Moon, Jung-Hoon,Jung, Seung-Boo 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.1

본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다. This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

Sn-0.7wt%Cu-Xwt%Re 솔더의 특성에 관한 연구

노보인,원성호,정승부,Noh, Bo-In,Won, Sung-Ho,Jung, Seung-Boo 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.4

In this study, the properties of Sn-0.7wt%Cu-Xwt%Re(X=$0.01{\sim}1.0$) older were investigated by using DSC(differential scanning calorimetry), wetting balance, victors hardness and tensile testers. The melting temperature of solder was increased with increasing the contents of rare earth element, and the melting temperature range of Sn-0.7Cu-($0.01{\sim}1.0$)Re solder was $233.9{\sim}234.7^{\circ}C$. The wettability with Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7Cu-0.01Re and Sn-0.7Cu-1.0Re solders, and the wettability of Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7wt%Cu-0.01w%P solder. Also, the hardness and tensile strength of solder were increased with increasing the contents of rare earth element. 본 연구에서는 시차주사열량법, 젖음성 시험기, 비커스 경도계와 인장 시험기를 이용하여 Sn-0.7wt%Cu-Xwt%Re(X=$0.01{\sim}1.0$) 솔더의 특성에 관하여 평가하였다. 희토류 금속의 함량이 증가함에 따라 솔더의 용융 온도가 약간 상승하는 경향을 나타내었으나 $0.01{\sim}1.0%$의 희토류 금속이 첨가된 범위에서는 $233.9{\sim}234.7^{\circ}C$의 작은 용융 온도 범위를 갖는 것을 확인할 수 있었다. 솔더의 젖음성 시험 결과로부터 Sn-0.7Cu-0.1Re 솔더의 젖음성이 다른 솔더보다 우수한 것을 확인할 수 있었으며, Sn-0.7Cu-0.1Re 솔더의 젖음성이 Sn-0.7wt%Cu-0.01wt%P 솔더보다 우수한 것을 확인할 수 있었다. 또한 희토류 금속의 함량이 증가할수록 솔더의 경도와 인장 강도가 증가하는 경향을 확인할 수 있었다.

BGA 솔더 접합부의 기계적.전기적 특성에 미치는 리플로우 횟수의 효과

구자명,이창용,정승부,Koo, Ja-Myeong,Lee, Chang-Yong,Jung, Seung-Boo 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.4

본 연구에서는 리플로우 횟수를 달리하여 Sn-37Pb, Sn-3.5Ag와 Sn-3.5Ag-0.75Cu (all wt.%) BGA 솔더 접합부들을 OSP가 코팅된 Cu 패드 상에 형성시킨 후, 기계적 전기적 특성을 연구하였다. 주사전자현미경 분석 결과, 접합 계면에 생성된 $Cu_6Sn_5$ 금속간화합물 층의 두께는 리플로우 횟수가 증가함에 따라 증가하였다. Sn-Pb와 Sn-Ag-Cu 솔더 접합부의 경우, 3회 리플로우 후 최대 전단 강도를 나타내었으며, Sn-Ag 솔더 접합부의 경우 4회 리플로우 후 최대 전단 강도를 나타내었다. 이후 리플로우 횟수가 10회까지 증가함에 따라 전단 강도는 점차 감소하였다. 리플로우 횟수가 증가함에 따라 전기적 특성은 점차 감소하였다. In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.

파워디바이스 패키징의 열제어 기술과 연구 동향

김광석,최돈현,정승부,Kim, Kwang-Seok,Choi, Don-Hyun,Jung, Seung-Boo 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.