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정석훈,서헌덕,박범영,박재홍,박성민,정문기,정해도,김형재,Jeong, Sukhoon,Seo, Heondeok,Park, Boumyoung,Park, Jaehong,Park, Seungmin,Jeong, Moonki,Jeong, Haedo,Kim, Hyoungjae 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.9
This study introduces Electro-chemical Mechanical Deposition(ECMD) lot making Cu interconnect. ECMD is a novel technique that has ability to deposit planar conductive films on non-planar substrate surfaces. Technique involves electrochemical deposition(ECD) and mechanical sweeping of the substrate surface Preferential deposition into the cavities on the substrate surface nay be achieved through two difference mechanisms. The first mechanism is more chemical and essential. It involves enhancing deposition into the cavities where mechanical sweeping does not reach. The second mechanism involves reducing deposition onto surface that is swept. In this study, we demonstrate ECMD process and characteristic. We proceeded this experiment by changing of distribution of current density on divided water area zones and use different pad types.
황색종 연초에 있어서 변이체의 조합능력 및 Heterosis
정석훈,이승철,김흥배,Jeong, Seok-Hun,Lee, Seung-Cheol,Kim, Heung-Bae 한국연초학회 1993 한국연초학회지 Vol.15 No.1
This experiment were conducted to investigate heterosis and combining ability for several mutant characters by analyzing dialled crosses of flue-cured tobacco. In a dialled cross of 3 flue-cured varieties and the mutant line 83H -5, the heterosis was somewhat higher in Fl than in F2. For growth character, the heterosis was 0.28-6.03% in plant height, leaf number, leaf shape index and yield, and was 43.2% for bacterial wilt disease index. The mutant line 83H-5 showed significantly negative GCA effect for plant height, leaf width and bacterial wilt disease index in Fl and F2, leaf length in F2, and positive GCA effect for total alkaloids, total nitrogen in Fl and days to flower in F2, respectively. Specific combining ability(SCA) in 83H-5 x Hicks was significant in negative effect for leaf length(F2), number of leaves(F2), leaf shape(F1, F2), bacterial wilt(F2) and alkaloids(F1), and in 83H-5 x NC 2326 in positive effect for leaf length(F1, F2) and leaf width(F2), and for 83H-5 x NC 82 in positive effect for plant height(F1, F2) and leaf width(F2), and for 83H-5 x NC 82 in Positive effect for Plant height(F1, F2), leaf length(F2) and yield(F1, F2).
정석훈,서헌덕,박범영,박재홍,정해도,Jeong, Suk-Hoon,Seo, Heon-Deok,Park, Boum-Young,Park, Jae-Hong,Jeong, Hae-Do 한국전기전자재료학회 2007 전기전자재료학회논문지 Vol.20 No.3
Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.
황색종 연초 품종의 Gamma선에 의한 돌연변이 유기 및 변이형질의 유전분석 II. 변이형질의 유전분석
정석훈,이승철,김흥배,Jeong, Seok-Hun,Lee, S.C.,Kim, H.B. 한국연초학회 1992 한국연초학회지 Vol.14 No.2
This experiment was conducted to examine characteristics of agronomic characters and estimate of gene effect for several mutant characters. The genetic populations were derived from cross between 83H-5 and Hicks. There were significant difference for plant height, stlk height, leaf shape and bacterial wilt disease index except leaf number, leaf length, and what is more, F3 variance is more than Bl and B2 generation from cross 83H-5 X Hicks. Gene actions for stalk height and bacterial wilt disease were estimated by 3-parameter, and by 6- parameter model for all characters except above two characters but stalk height and bacterial wilt disease index are not significant in the additive and dominance effects. Dominant$\times$dominant epitasis for plant height, dominant and dominant$\times$dominant epistasis for leaf length, additive and additive$\times$additive and dominant$\times$dominant epistasis for leaf width, and additive and additive$\times$dominant epistasis for days to flower were appeared significant in gene action.
미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구
정석훈,정재우,박기현,서현덕,박재홍,박범영,주석배,최재영,정해도,Jeong, Suk-Hoon,Jung, Jae-Woo,Park, Ki-Hyun,Seo, Heon-Deok,Park, Jae-Hong,Park, Boum-Young,Joo, Suk-Bae,Choi, Jae-Young,Jeong, Hae-Do 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.3
Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.
화학기계적 연마에 의한 리튬니오베이트의 광학 특성에 관한 연구
정석훈(Suk-Hoon Jeong),김영진(Young-Jin Kim),이현섭(Hyun-Seop Lee),정해도(Hae-Do Jeong) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.3
Lithium niobate (LN:LiNbO₃) is a compound of niobium, lithium and oxygen. The characteristics of LN are piezoelectricity, ferroelectricity and photoelectricity, and which is widely used in surface acoustic wave (SAW). To manufacture LN devices, the LN surface should be a smooth surface and defect-free because of optical property, but the LN material is processed difficult b traditional processes such as grinding and mechanical polishing (MP) because of its brittleness. To decrease defects, chemical mechanical polishing (CMP) was applied to the LN wafer. In this study, the suitable parameters such as down force and relative velocity, were investigated for the LN CMP process To improve roughness, the LN CMP was performed using the parameters that were the highest removal rate among process parameters. And, evaluation of optical property was performed by the optical reflectance.
정석훈 ( Seokhoon Jeong ),고국원 ( Kuk Won Ko ),강제용 ( Je-yong Kang ),장수원 ( Suwon Jang ),이상준 ( Sangjoon Lee ) 한국정보처리학회 2016 정보처리학회논문지. 소프트웨어 및 데이터 공학 Vol.5 No.7
본 연구는 비 정형 농산물 중 6년근 수삼의 자동 등급 분류하기 위한 선행연구로, 이를 위해 4방향에서 이미지 취득이 가능한 수삼 영상 측 정기를 제작 하였으며 총 245 수삼 개체에 대해서 영상을 취득하였다. 취득된 영상의 각 수삼 개체마다 12개의 파라미터를 추출하였으며, KGC 인삼공사의 수삼등급 분류 기준과 각 등급별 평균 파라미터의 분포를 조사하여 최종 4개 파라미터를 선정하였다. 패턴인식 분류기는 Support Vector Machine을 사용하였으며 공용 소프트웨어인 OpenCV Library를 사용하여 k-Class 분류기를 설계하였다. 각 등급별 학습 데이터 수를 10, 15, 20으로 조정하여 등급별 인식률, 본인 거부율, 타인 인식율을 조사하였으며, 학습데이터 수가 10개일 때 1등급 인식률 94%, 2등급 인식 률 98%, 3등급 인식률 90%로 가장 높은 인식 성능을 보였다 This study is a leading research project to develop an automatic grade decision making algorithm of a 6-years-old fresh ginseng. For this work, we developed a Ginseng image acquiring instrument which can take 4-direction’s images of a Ginseng at the same time and obtained 245 jingen images using the instrument. The 12 parameters were extracted for each image by a manual way. Lastly, 4 parameters were selected depending on a Ginseng grade classification criteria of KGC Ginseng research institute and a survey result which a distribution of averaging 12 parameters. A pattern recognition classifier was used as a support vector machine, designed to “k-class classifier” using the OpenCV library which is a open-source platform. We had been surveyed the algorithm performance(Correct Matching Ratio, False Acceptance Ratio, False Reject Ratio) when the training data number was controlled 10 to 20. The result of the correct matching ratio is 94% of the 1st ginseng grade, 98% of the 2nd ginseng grade, 90% of the 3rd ginseng grade, overall, showed high recognition performance with all grades when the number of training data are 10