http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
공통 결함접지구조를 이용한 브랜치 라인 커플러의 소형화
임종식(Jongsik Lim),이재훈(Jaehoon Lee),권경훈(Kyunghoon Kwon),한상민(Sang-Min Han),안달(Dal Ahn) 한국정보기술학회 2012 한국정보기술학회논문지 Vol.10 No.6
The design of a size-reduced high frequency branch line coupler using common defected ground structure (DGS) is proposed in this paper. Common DGSs are realized on the common ground plane of double-sided microstrip transmission line structures. Common DGSs highly contribute to the size-reduction of microwave circuits because the second try for size-reduction is applied to the result of the first miniaturization step which uses the conventional DGS. In this paper, a branch line coupler which is one of widely used microwave circuits for wireless systems is selected for size-reduction using the common DGSs, The branch line coupler, designed at 1㎓ as an example, has the size of 44.7% compared to the standard circuit due to the applied common DGS. In addition, it is shown that the measured transfer characteristics (S21, S31) at two output ports are -3.09㏈ and -3.3㏈, respectively, and the measured magnitude and phase error between two output ports are 0.21㏈ and 2o, respectively, which are excellent values.
임종식(Jongsik Lim),권경훈(Kyunghoon Kwon),도한주(Hanjoo Do),안달(Dal Ahn) 한국산학기술학회 2014 한국산학기술학회 학술대회 Vol.- No.-
가유전체 기판구조와 결함접지구조를 지니는 마이크로스트립 전송선로의 전기적 길이가 증가되는 원 리를 이용하여 설계된 링 하이브리드 커플러에 대하여 기술한다. 설계된 커플러는 가유전체 기판구조 나 결함접지구조의 어느 한 가지만 있는 경우에 비하여 65.2% - 53.7%의 크기를 갖는다. 회로가 소형 화되어 설계된 이후에도 전기적인 성능은 그대로 유지됨을 보인다.
임종식(Jongsik Lim),이재훈(Jaehoon Lee),이준(Jun Lee),정용채(Yongchae Jeong),한상민(Sang-Min Han),안달(Dal Ahn) 대한전기학회 2010 전기학회논문지 Vol.59 No.8
In this paper, a double lorentz composite right left handed(DL-CRLH) transmission line is designed using defected ground structure (DGS) and varactor diodes. Previously, the diode has been adopted only selectively for one of parallel or series resonators, and the balanced frequency as well as triple band frequencies were fixed. However in the proposed DL-CRLH transmission line, the balanced frequency, where the resonant frequencies of the series-connected parallel resonator and shunt-connected series resonator are the same, is adjustable. In addition, the triple band frequencies are controlled, too. The measured balanced frequency varies between 3.42∼4.8㎓ according to the controlled bias voltage. Under the same bias condition for the balanced frequency, the adjusted frequencies are 2.22∼2.77GHz, 3.7∼5.2㎓, 7.32∼8.23㎓, 3.42∼4.8㎓, and 4.44∼5.92㎓ for the conditions that βd=+0.5π, -0.5π, 2nd +0.5π, ω∞, and ωo, respectively.
양면형 가유전체 기판구조를 이용한 브랜치 라인 결합기의 설계
임종식(Jongsik Lim),권경훈(Kyunghoon Kwon),한상민(Sang-Min Han),안달(Dal Ahn),정용채(Yongchae Jeong) 한국정보기술학회 2015 한국정보기술학회논문지 Vol.13 No.4
In this paper, the design of a branch line coupler using a double-sided artificial dielectric substrate (DSADS) structure is described. Lots of metalized via-holes in the artificial dielectric substrate (ADS) structure induce an additional equivalent capacitance and effective permittivity, which lead a length-reduction of the transmission line on ADS. Beside this effect, the ADS is folded for half size, and the transmission line is designed on this folded or double-sided ADS with the transmission characteristics preserved. In order to show an application example of the DSADS to wireless circuit design, this paper designs a microwave branch line coupler on the proposed DSADS. The designed coupler has the half size as compared to the case of single-sided ADS, while the electrical performances in matching, isolation, power division, and coupling are still preserved as an required level. The paper also provides the measured data.
접지 접촉 문제가 없는 새로운 DGS 비대칭 브랜치 라인 하이브리드 결합기
林鍾植(Jongsik Lim),車顯源(Hyeonwon Cha),鄭龍采(Yongchae Jeong),朴雄熙(Ung-Hee Park),安達(Dal Ahn) 대한전기학회 2008 전기학회논문지 Vol.57 No.8
A 10 ㏈ branch Line hybrid coupler included with defected ground structure (DGS) is proposed. In this contribution, a contact between the grounded metal housing and DGS is avoided, which has been a serious problem in applying DGS to high frequency circuits. An isolation between the metal housing and the DGS pattern is provided by inserting additional substrate between DGS and the metal package. Therefore, it is possible to design branch line hybrid couplers having highly asymmetric power dividing ratio using these DGS structure, which is demonstrated in this paper. The designed and fabricated branch line hybrid coupler using DGS is well packaged in a metal housing without touching the ground metal directly. The measurement is performed under realistic practical operating situations because it is packaged in a metal housing. The measured performances of the fabricated 10㏈ coupler shows a 1:9 asymmetric power dividing ratio at output ports, as predicted. In addition, the measured performances in terms of matching, isolation, and phase difference are in excellent agreement with the simulated characteristics.
임종식(Jongsik Lim),권경훈(Kyunghoon Kwon),정용채(Yongchae Jeong),안달(Dal Ahn) 한국정보기술학회 2014 한국정보기술학회논문지 Vol.12 No.5
In this paper, a size-reduced Wilkinson power divider designed by combining defected ground structure(DGS) and artificial dielectric substrate(ADS), or substrate integrated artificial dielectric(SIAD), is discussed. DGS increases the equivalent inductance per unit length of transmission line, while ADS supplies the additional equivalent capacitance due to the periodically inserted metalized via-holes. Because both DGS and ADS produce the additional electrical length of transmission line, the physical length of the transmission line should be reduced to keep the required electrical length. ADS consists of 5mils and 31mils dielectric substrates with 2.2 of dielectric constant. The size of the designed divider is only 55.67% and 79.43% of DGS-only-inserted and ADS-only-inserted dividers, respectively. The measured power dividing ratio(S21 and S31) are -3.19dB and -3.32dB. In addition, the measured matching and isolation between output ports are ?20.94dB and -23.11dB, which agree well with the predicted S-parameters.
비대칭 나선형 결함접지구조를 이용한 마이크로파 증폭기 설계
임종식(Jongsik Lim),이재훈(Jaehoon Lee),이준(Jun Lee),안달(Dal Ahn) 한국정보기술학회 2010 한국정보기술학회논문지 Vol.8 No.11
In this paper, a design of size reduced amplifier using asymmetric spiral defected ground structure is described. The asymmetric spiral defected ground structure contributes to size reduction and improved performances of the amplifier. In addition, it contains the rejection characteristics for the second and third harmonic frequencies, so the matching network of the amplifier rejects the harmonic components inherently without an additional attempt. The designed amplifier matching networks has smaller size by 15mm before size reduction. The size-reduced amplifier is fabricated and measured. An excellent improvement in output power and power added efficiency is observed while the gain and matching performances are maintained. Additionally, the second and third harmonics are suppressed by more than 10dB and 15dB at least, respectively, than the basic amplifier.
마이크로파 버랙터 다이오드의 실제 사용 조건에서의 실험적 등가회로
임종식(Jongsik Lim),이준(Jun Lee),이재훈(Jaehoon Lee),한상민(Sang-Min Han),안달(Dal Ahn) 한국정보기술학회 2010 한국정보기술학회논문지 Vol.8 No.8
An empirical equivalent circuit under practical application conditions of microwave varactor diodes is described. The equivalent circuit of varactor diodes in the data sheet provided by the manufacturer consists of adjustable junction capacitance(C<SUB>j</SUB>) which is inherent, parasitic inductance(L<SUB>p</SUB>) and capacitance (C<SUB>p</SUB>). However they are not accurate under the practical usage situation in most case, because the effects of dielectric substrate and via-holes are not considered for the practical usage situation. In this work, the equivalent circuit including the effective parasitic inductance(L<SUB>p,eff</SUB>) which contains the effect of the practical dielectric substrate and via-holes is extracted. The sample diode, MSV34,060-0805-2, is adopted as an example, and its C<SUB>j</SUB>, L<SUB>p</SUB> and C<SUB>p</SUB> on the data sheet are 0.4pF, 0.4nH and 0.06pF, while the empirically extracted C<SUB>j</SUB>, L<SUB>p,eff</SUB> and C<SUB>p</SUB> are 0.487pF, 1.526nH and 0.121pF, respectively. In addition, the extracted L<SUB>p,eff</SUB> and C<SUB>p</SUB> under the variable bias voltages of 0~15V are 1.476~1.567nH and 0.109~0.133pF, which are fairly uniform values with a good reliability.
마이크로파 회로의 성능 측정을 위한 테스트 픽스춰의 개발
임종식(Jongsik Lim),박형식(Hyung-Sik Park),진철호(Cheul-Ho Jin),한상민(Sang-Min Han),안달(Dal Ahn) 한국산학기술학회 2023 한국산학기술학회논문지 Vol.24 No.10
본 논문에서는 무선시스템에 사용되는 마이크로파 회로의 성능을 측정하기 위한 마이크로파 테스트 픽스춰의 개발에 대하여 기술한다. 마이크로파 회로의 성능을 측정하기 위해서는, 프로토타입 회로의 입출력단에 동축형 RF컨넥터를 납땜하고, 벡터 회로망 분석기라는 장비를 이용하여 S-파라미터 특성을 측정하는 것이 기본이다. 그런데 어떤 회로에 RF컨넥터가 납땜으로 부착되면 컨넥터의 교체나 수리가 필요할 경우에, 기존의 납땜 부위를 제거해야 하는 불편이 매우 크다. 이에 본 연구에서는 컨넥터의 납땜 없이도 초고주파 회로의 성능을 편리하게 측정할 수 있는 테스트 픽스춰를 개발한다. 개발된 픽스춰에는 탈부착이 가능한 RF컨넥터가 입출력 단자에 기계적으로 체결되어 있다. 따라서 마이크로파 신호의 전달이 납땜 대신 기계적 접촉 방식으로 이루어지므로 매우 편리하고 빠르며 반복 측정이 가능하다. 개발된 픽스춰를 이용하면 초고주파 회로의 성능 측정에 소요되는 시간이 종래의 컨넥터 납땜 방법에 비하여 1/40 이하로 줄어든다. This paper describes the development of a microwave test fixture that measures the performance of microwave circuits for wireless systems. To measure the performance of microwave circuits conventionally, coaxial RF connectors are soldered to the input/output ports of the prototype circuit, and S-parameters of the circuits are measured on vector network analyzers. However, once the RF connector is soldered to the circuit, it is not easy to replace it with another one because it is very difficult to remove the soldered section. In this work, a test fixture is developed that measures microwave circuits easily without soldered connectors. The proposed fixture adapts RF connectors at the input/output ports, providing a mechanical contact without soldering. Instead of through solder, the microwave signal flows through contact points between the mechanically combined RF connectors and the microwave circuits so measurements can be made easily, quickly, and repeatedly. The required time for measurement using the developed fixture is shorter than 1/40 of the conventional soldered connector method.