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고속 전단시험법을 이용한 Sn-37Pb/Cu와 Sn-37Pb/ENIG 솔더 접합의 기계적신뢰성 평가
전성재(Seong-jae Jeon),현승민(Seungmin Hyun),이후정(Hoo-Jeong Lee),이학주(Hak-Joo Lee) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu and Sn-37Pb/Electroless Nickel immersion Gold under bump metallization solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures (120 ℃, 150 ℃, 170 ℃) and afterward tested at different displacement rates (0.01 ㎜/s to 500 ㎜/s) to examine the effects of aging on the drop life reliability. The combination of the stress-strain graphs captured from the shear tests and identifying a fracture mode dominant in the samples for different strain rates leads us to conclude that the drop reliability of solder joints degrades as the aging temperature increases, possibly due to the role of the IMC layer. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.
Effusion-cell evaporation을 이용한 열전박막 제조와 소형 열전 냉각소자 설계
전성재(Seong-jae Jeon),오민섭(Minsub Oh),현승민(Seungmin Hyun),이후정(Hoo-jeong Lee) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.4
본 연구는 Bi-Te 박막과 Sb-Te 박막을 co-evaporation 공정을 사용하여 제조하고 박막의 열전, 전기적 특성을 평가하였다. 앞서 제조한 박막을 이용하여 박막형 열전 냉각 소자를 설계하였다.