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이종항,이상조,Lee, Jong-Hang,Lee, Sang-Jo 대한기계학회 1993 대한기계학회논문집 Vol.17 No.7
Pattern recognition technique using fuzzy c-means algorithm and multilayer perceptron was applied to classify tool wear states in turning. The tool wear states were categorized into the three regions 'Initial', 'Normal', 'Severe' wear. The root mean square(RMS) value of acoustic emission(AE) and current signal was used for the classification of tool wear states. The simulation results showed that a fuzzy c-means algorithm was better than the conventional pattern recognition techniques for classifying ambiguous informations. And normalized RMS signal can provide good results for classifying tool wear. In addition, a fuzzy c-means algorithm(success rate for tool wear classification : 87%) is more efficient than the multilayer perceptron(success rate for tool wear classification : 70%).
이종항(Jong Hang Lee),박철우(Cheol Woo Park),이석우(Seok Woo Lee),최헌종(Hon Zong Choi) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.4
As environmental restrictions have continuously become more strict, it has emphasized development of environment-friendly technologies. In cutting technology, it has been well recognized that cutting fluids might have undesirable effects on worker's health and working environment and, hence, recently there have been numerous attempts to minimize harmful effects of cutting fluids on environments. To minimize the use of cutting fluids in machining, conventional cutting fluids have been replaced with the technologies of pressurized cold air and minimum quantity lubrication (MQL). compared with milling, turning is a continuous cutting process, where tools are continuously heated up and lack of lubricity could lead to tool wear and deteriorated surface roughness. In this study, it has been investigated how tool wear and surface roughness could be affected by cutting conditions, supply and cooling methods. The experimental results show that MQL technology is able to minimize harmful effects of conventional cutting fluids.
이종항(Jong Hang Lee) 한국산학기술학회 2021 한국산학기술학회논문지 Vol.22 No.1
본 연구는 웨이퍼를 적재할 때 웨이퍼의 손상을 최소화 시키기 위한 기술이다. 반도체와 솔라셀에 이용되는 두께가 얇은 웨이퍼는 적재된 웨이퍼 사이의 표면 장력에 의해 웨이퍼의 분리를 어렵게 만들어 웨이퍼의 표면에 손상을 줄 수 있다. 이러한 웨이퍼의 손상을 최소화시키는 기술은 압축 공기를 웨이퍼 쪽으로 분사하고, 미소의 수평 이동 기구를 동시에 적용하는 것이다. 연구에 사용된 주요 실험 인자는 웨이퍼의 공급 속도, 압축 공기의 노즐 압력, 그리고 흡착헤드의 흡착 시간이다. 실험 결과, 동일한 노즐 압력에서 웨이퍼의 공급 속도가 빠를수록 파손율이 증가하고, 동일한 공급 속도에서는 노즐 압력이 낮을수록 파손율이 증가한다. 그리고, 웨이퍼를 흡착시키데 필요한 시간은 어느 수준 이상이면 웨이퍼의 공급 속도에 따른 파손율에는 큰 영향을 미치지 않는다. 본 연구의 실험 범위 안에서 최적의 실험 조건은 웨이퍼의 공급 속도 600 ea/hr, 압축 공기의 노즐 압력 0.55 MPa, 흡착 헤드의 흡착 시간 0.9 sec 이다. 또한, 반복성능 실험을 통해 개선된 기술은 웨이퍼의 파손율을 최소화시킬 수 있음을 보여 주었다. This paper presents a technique to minimize damaged wafers during loading. A thin wafer used in solar cells and semiconductors can be damaged easily. This makes it difficult to separate the wafer due to surface tension between the loaded wafers. A technique for minimizing damaged wafers is to supply compressed air to the wafer and simultaneously apply a small horizontal movement mechanism. The main experimental factors used in this study were the supply speed of wafers, the nozzle pressure of the compressed air, and the suction time of a vacuum head. A higher supply speed of the wafer under the same nozzle pressure and lower nozzle pressure under the same supply speed resulted in a higher failure rate. Furthermore, the damage rate, according to the wafer supply speed, was unaffected by the suction time to grip a wafer. The optimal experiment conditions within the experimental range of this study are the wafer supply speed of 600 ea/hr, nozzle air pressure of 0.55 MPa, and suction time of 0.9 sec at the vacuum head. In addition, the technology improved by the repeatability performance tests can minimize the damaged wafer rate.