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디지털 소자용 방열판 제작을 위한 초고속 금속필름 증착장치 및 공정기술 개발
윤효은(Hyo Eun Yoon),안성준(Seong Joon Ahn),한동환(Dong Hwan Han),안승준(Seungjoon Ahn) 한국산학기술학회 2017 한국산학기술학회논문지 Vol.18 No.7
최근에 LED나 OLED와 같은 조명용 소자의 온도 상승에 따른 문제점을 개선하기 위하여 전기 도금 방법을 사용하여 제작한 두께가 두꺼운 금속 필름을 heat sink로 사용하고 있다. Cu 필름과 같은 두꺼운 금속 필름은 습식 방법인 전기 도금으로 제작하여 주로 소자의 방열판으로 사용되어 왔으나 건식의 증착 방법을 이용한 수 백 ㎛의 Cu 금속 필름에 대한 필요성이 요구되고 있다. 본 연구에서 설계⋅제작된 유도 가열 방식의 Cu 필름 증착 장비는 가열부가 세라믹 도가니 히터 부분과 세라믹 도가니 부분으로 분리된 이중 구조의 heating 방식을 채택하여 열 손실을 최소화 하고 보온 효과를 극대화시켰다. 또한 유도 가열 방식으로 초고속의 필름 증착 속도를 구현하였다. 그리고 열전도도가 높고 안정적인 두꺼운 Cu 필름 증착 기술을 확보하고 최적화 하여 1000 Å/s의 증착율로 100 ㎛의 필름을 증착 하였으며 ~2.0% 이내의 두께 균일도를 얻었다. To resolve the problem of the temperaturerise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated fromthe ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a 100-μm thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as 1000 Å/s.
윤효은 ( Yoon Hyo Eun ),황보주 ( Hwang Bo Ju ),석웅 ( Seng Woong ),민희석 ( Min Hee Suk ) 국군의무사령부 2010 대한군진의학학술지 Vol.41 No.1
Objective: Yellow fever, a mosquito-borne viral hemorrhagic fever, is one of the most lethal diseases. Recently Korea raise nation's states to a higher level by hosting G20 SEOUL SUMMIT 2010. And Korea sends troops overseas such as Peace keeping operation(PKO) to contribute to world peace. Therefore, we carried out this study to provide Overseas dispatch soldiers information about Yellow Fever Vaccine(YFV). Method: This study was conducted at the OO clinic between June 7 to June 24, 2010, for the evaluation of adverse events of YFV. Eighty-three healthy adults were vaccinated YFV(17-DD) and were prospectively monitored for adverse events through questionnaire to July 23, 2010, after YFV vaccination. Results: Adverse events were observed in 41(49.4%) of 83 adults who were vaccinated YFV. Sixty-four of the adults(77.1%) were males. The mean age was 38.2±8.2 years. The common adverse events were myalgia in 28(33.7%), Chilling sense in 25(30.1%), Headache in 21(25.3%). There were no differences of adverse events according to gender or age. Most adverse events were developed between 4~9days after YFV injection. Conclusion: This study showed that adverse events by YFV have a higher incidence and delayed onset time than Influenza Vaccine. Studies are ongoing to clarify the cause and risk factors for rare adverse events.