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박재준,신성식,윤찬영,이재영,박주언 한국전기전자재료학회 2015 Transactions on Electrical and Electronic Material Vol.16 No.5
Epoxy/micro-sized alumina composite was prepared and the effects of alumina content on the electrical and mechanical properties were investigated in order to develop an insulation material for gas insulated switchgear (GIS). Nano-sized alumina (average particle size: 30 μm) was also incorporated into the epoxy/micro-sized alumina composite. An electrical insulation breakdown strength test was carried out in sphere-sphere electrodes and the data were estimated by Weibull statistical analysis. Tensile strength was measured at a crosshead speed of 10 mm/ min using a universal testing machine. Alumina content was varied from 0 wt% to 70 wt%.). As micro-sized alumina content increased, insulation breakdown strength increased until 40 wt% alumina content and decreased after that content. The tensile strength of a neat epoxy system was 82.2 MPa and that value for 60 wt% alumina content was 91.8 MPa, which was 111.7% higher than inthe neat epoxy system. The insulation breakdown strength of micro-sized alumina (60 wt%)/nano-sized alumina (1 phr) glycerol diglycidyl ether (GDE) (1 phr) composite was 54.2 MPa, which was 116% higher than the strength of the system without nano-sized alumina.
박재준,김재설,윤찬영,신성식,이재영,정종훈,김영우,강근배 한국전기전자재료학회 2015 Transactions on Electrical and Electronic Material Vol.16 No.2
Mechanical and electrical properties of epoxy/silica microcomposites were investigated. The cycloaliphatic- typeepoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and the curing agent was of an anhydride type. To measurethe glass transition temperature (Tg), dynamic differential scanning calorimetry (DSC) analysis was carried out, andtensile and flexural tests were performed using a universal testing machine (UTM). Electrical breakdown strength, themost important property for electrical insulation materials, and insulation breakdown strength were also tested. Themicrocomposite with 60 wt% microsilica showed maximum values in mechanical and electrical properties.
이재영,박재준,김재설,신성식,윤찬영,정종훈,김영우,강근배 한국전기전자재료학회 2015 Transactions on Electrical and Electronic Material Vol.16 No.2
The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. Acycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was88.9 kJ/mol and pre-exponential factor was 2.64×1012 min-1, while the activation energy and pre-exponential factor forepoxy/silica composite were 97.4 kJ/mol and 9.21×1012 min-1, respectively. These values showed that the silica particleshave effects on the cure kinetics of the neat epoxy matrix.