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PECVD법에 의한 TiN, TiCN 증착 시 gradient plasma power가 코팅층에 미치는 영향
김동진 ( D. J. Kim ),신창현 ( C. H. Shin ),허정 ( J. Hur ),남태운 ( T. W. Nam ) 한국열처리공학회 2004 熱處理工學會誌 Vol.17 No.4
N/A Effect of plasma power on PECVD process were investigated in this study. TiN and TiCN films were deposited on nitrided STD11 steel with 600W, 1,200W and 1,600W plasma power. As the plasma power was increased, the preferred orientation was reinforced from (200) to (111) and the hardness of films was improved. The low plasma power was, however, effective for improving of adhesion force of films. Regarding above proper-ties, TiN and TiCN films were deposited by gradient plasma power. It was possible to get high hardness as well as adhesion force through gradient plasma power.