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전자빔 증착법으로 제작한 Cu 박막의 부착력과 저항율 특성
신중홍,유충희,백상봉,Shin, Joong-Hong,Yu, Chung-Hui,Paik, Sang-Bong 한국전기전자재료학회 2005 전기전자재료학회논문지 Vol.18 No.1
In this thesis, We Fabricated Cu thin films of 1000 $\AA$, 3000 $\AA$, and 6000 $\AA$ thickness on the single crystal sapphire, polycrystal alumina, and amorphous slide glass substrates deposited by electron beam evaporation(EBE) method. We investigated properties of resistivity and adhesion of these Cu thin films under various conditions, substrate temperature(room temperature, 10$0^{\circ}C$, 20$0^{\circ}C$ under vacuum) and annealing temperatures(400 $^{\circ}C$, 600 $^{\circ}C$ for 30 min after the deposition). We found that these adhesion was increased in order of slide glass, sapphire, and alumina. The adhesion of the Cu thin films on alumina was high value about 4 times, compared with that of the Cu thin films on slide glass. We found that these resistivities were decreased with increasing substrate temperature and thin film thickness. The resistivity(2.05 $\mu$Ω\ulcornercm) of the Cu thin films with 6000 $\AA$ thickness at 200 $^{\circ}C$ on the slide glass was low value, compared with that of aluminum(2.66 $\mu$Ω\ulcornercm).
愼重弘(Joong-Hong Shin),李敦揆(Don-Kyu Lee),윤초롬(Cho-Rom Yoon),許禎恩(Jeong-Eun Heo),朴正后(Chung-Hoo Park) 대한전기학회 2008 전기학회논문지 Vol.57 No.2
In order to improve cost and efficacy of AC PDP with metal discharge electrodes, a new Ⅱ-type metal electrodes are suggested. The suggested asymmetrical Ⅱ-type metal electrode is improved in the luminance, power and efficacy than the conventional metal electrode by 7.5%, 6%, and 14%, respectively. The efficacy of the suggested asymmetrical Ⅱ-type metal electrode is almost the same with the conventional ITO electrode. Moreover, the address time of the Ⅱ-type metal electrode is shorter than the conventional ITO electrode.