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피에조 구동기의 원주가공의 성능향상을 위한 설계 및 제어에 관한 연구
김태훈(T. H. Kim),고태조(T. J. Ko),정병묵(B. M. Chung),김희술(H. S. Kim),석진우(J. W. Seok),박종권(J. K. Park) 한국생산제조학회 2005 한국공작기계학회 추계학술대회논문집 Vol.2005 No.-
Recently, there are many studies for the micro-machining using Piezo actuator. However, because of its step by step motion, it is nearly impossible to increase the machining accuracy for a circular path. To increase the accuracy, it is well known that it is necessary the finer and synchronous movement for x-y axes. Therefore, this paper proposes an adaptivecontrol for finer movement of the actuator, and realizes a synchronous control for the x-y axes. The experimental results show that the machining accuracy is remarkably improved.
마이크로 밀링에서 피에조 구동기의 전압제어를 이용한 원주가공의 성능향상
김태훈(T. H. Kim),고태조(T. J. Ko),정병묵(B. M. Chung),김희술(H. S. Kim),석진우(J. W. Seok),이지형(J. H. Lee) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
Recently, there are many studies for the micro-machining using Piezo actuator. However, because of its step by step motion, it is nearly impossible to increase the machining accuracy for a circular path. To increase the accuracy, it is well known that it is necessary the finer and synchronous movement for x-y axes. Therefore, this paper proposes an adaptive control for finer movement of the actuator, and realizes a synchronous control for the x-y axes. The experimental results show that the machining accuracy is remarkably improved.
마이크로밀링에서 피에조 구동기의 전압제어를 이용한 원주가공의 성능향상
석진우,정병묵,고태조,김희술,박종권 한국공작기계학회 2005 한국공작기계학회 춘계학술대회논문집 Vol.2005 No.-
Recently, there are many studies for the micro-machining using Piezo actuator. However, because of its step by step motion, it is nearly impossible to increase the machining accuracy for a circular path. To increase the accuracy, it is well known that it is necessary the finer and synchronous movement for x-y axes. Therefore, this paper proposes a voltage control for finer movement of the actuator, and realizes a synchronous control for the x-y axes. The experimental results show that the machining accuracy is remarkably improved.
이온 보존 반응법에 의하여 표면처리된 Polyimide(PI) 표면과 구리박막의 접착력 향상
최성창,석진우,최원국,손용배,정형진,고석근 한국마이크로전자및패키징학회 1997 하이브리드마이크로일렉트로닉스 Vol.4 No.1
Polyimide films are modified by Ar^+ion beam at 1 kV in an oxygen environments. Amounts of ions changed from 5 x 10^(15) to 1 x 10^(17) ions /㎠ and amounts of blowing oxygen from 0 to 8 sccm ml /min. The wettabilities and the surface free energies of modified polyimide were measured by a contact angle meter and the chemical state of the modified polyimide surface was measured by x-ray photoelectron spectroscopy. The wetting angles between water and polyimide films modified by Ar^+ ion without oxygen blowing decrease from 67 to 40 degrees and surface free energies increase from 46 to 64 dyne /㎠. The wetting angle of polyimide films modified by Ar^+ ion in an oxygen environments decrease to 12 degree and surface free energy increase to 72 dyne /㎠. Polyimide surface was modified with various gas environments and ions. Lowest wetting angle was obtained by oxygen ion irradiation in an oxygen gas environment and its value was 8°. In the case of polyimide film modified by Ar^+ ions in an oxygen environment, the wetting angle increase up to 65° when it kept in air and that increase up to 46° when it kept in water after 110 hour. In the case of polyimide film modified by O^+ ions in an oxygen environment, however, the wetting angle of polyimide film dose not increase. From the x-ray photoelectron analysis, it is found that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as (C=O)-(ON)-, COH and (C=O)-C are formed by the reaction between newly formed radicals and blowing oxygen. I t was found that the adhesion between Cu and polyimide modified by ion assisted reaction was improved, and the main reason of the enhanced adhesion is due to the reaction between Cu and C-O groups formed by ion assisted reaction on the polyimide surface.
Choi, S. C.,석진우,Choi, W. K.,Jung, H. J.,Koh, S. K. 한국마이크로전자및패키징학회 1997 Symposium on Multichip Module and Advanced Packagi Vol.1 No.1
Polyimide films are modified by Ar^+ ion beam at 1 kV in oxygen environments. Amounts of ions changed from 5x10^(15) to 1x10^(17) ions/cm and amounts of blowing oxygen from C to 6 sccm(ml/min). The wetting angles between water and polyimide films modified by Ar^+ ion without oxygen blowing decrease from 67 to 40 degrees and surface free energies increase from 46 to 64 dyne/㎠. The wetting angle of polyimide films modified by Ar^+ ion in oxygen environments decrease to 12 degree and surface free energy increase to 72 dyne/㎠. From the x-ray photoelectron analysis, it is found that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as -(C=O)-(ON)-, COH and (C=O)-C are formed by the reaction between newly formed radicals and blowing oxygen. Adhesion tests between metals(Al, Au, Cu, Pt) were performed by Scatch tape test. The metals films adhere well to the treated polyimide than to the untreated one.