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Cutting simulation 을 이용한 End-milling cutter 의 모델링 및 제작에 관한 연구
김재현(J. H. Kim),박수정(S. J. Park),김종한(J. H. Kim),박정환(J. W. Park),고태조(T. J. Ko),김희술(H. S. Kim) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
This paper describes a design process of end-milling cutters: solid model of the designed cutter is constructed along with computation of cutter geometry, and the wheel geometry as well as wheel positioning data for fabricating end-mills with required cutter geometry is calculated. In the process, the main idea is to use the cutting simulation method by which the machined shape of an end-milling cutter is obtained via Boolean operation between a given grinding wheel and a cylindrical workpiece (raw stock). Major design parameters of a cutter such as rake angle, inner radius can be verified by interrogating the section profile of its solid model. We studied relations between various dimensional parameters and proposed an iterative approach to obtain the required geometry of a grinding wheel and the CL data for machining an end-milling cutter satisfying the design parameters. This research has been implemented on a commercial CAD system by use of the API function programming, and is currently used by a tool maker in Korea. It can eliminate producing a physical prototype during the design stage, and it can be used for virtual cutting test and analysis as well.
띠 굽힘 시험을 통한 100 ㎚ 두께 금 박막의 기계적 특성 평가
김재현(J.H. Kim),이학주(H.J. Lee),한승우(S.W. Han),백창욱(C.-W. Baek),김종만(J.-M. Kim),김용권(Y.-K. Kim) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
Nanometer-sized structures are being applied to many devices including micro/nano electronics, optoelectronics, quantum devices, MEMS/NEMS, biosensors, etc. Especially, the thin film with submicron thickness is a basic structure for fabricating these devices, but its mechanical behaviors are not well understood. The mechanical properties of the thin film are different from those of the bulk structure and are difficult to measure because of its handling inconvenience. Several techniques have been applied to mechanical characterization of the thin film, such as nanoindentation test, micro/nano tensile test, strip bending test, etc. In this study, we focus on the strip bending test because of its high accuracy and moderate specimen preparation efforts, and measure Au thin film, which is a very popular material in micro/nano electronic devices. Au film is deposited on Si substrate by evaporation process, of which thickness is 100㎚. Using the strip bending test, we obtain elastic modulus, yield and ultimate tensile strength, and residual stress of Au thin film.
김재현(J.H. Kim),엄준현(J.H. Oum),정영국(Y.G. Jung),임영철(Y.C. Lim) 전력전자학회 2007 전력전자학술대회 논문집 Vol.- No.-
본 연구에서는 Z-소스 네트워크를 갖는 순시전압sag 보상기를 제안하였다. 제안된 시스템은 연료전지 스택(fuel cells stack)을 갖고 있는 Z-소스 인버터의 shoot-through제어에 의하여 ac보상전압을 직접 발생한다. PSIM 시뮬레이션에 의하여 sag와 swell이 발생되는 정상상태와 과도상태에서의 제안된 방법의 타당성을 검토하였다.