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두통에 대한 추나요법의 효과 : 체계적 문헌고찰과 메타분석
김대훈,황의형,허인,김병준,배지민,김재규,Kim, Dae-Hun,Hwang, Eui-Hyoung,Heo, In,Kim, Byung-Jun,Bae, Ji-Min,Kim, Jae-Kyu 척추신경추나의학회 2015 척추신경추나의학회지 Vol.10 No.2
Objectives : To determine the effectiveness of Chuna manual therapy for headache Methods : We searched 6 electronic databases(Pubmed, CAJ, Oasis, RISS, DBPIA, KoreanTK) and 2 journals up to Oct 2015. We included randomized controlled trials(RCTs) using Chuna manual therapy for headache. The methodological quality of each RCT was assessed by the Cochrane risk of bias tool. Results : 9 RCT studies were eligible in our review. The meta-analysis of 6 studies showed favorable results for the use of Chuna manual therapy. High risk of bias were observed in all studies. Conclusions : Although there are favorable results with meta-analysis, our systematic review arehighly dependent on the single source of Chinese electrical database, CAJ. Now limited evidence is available tosupport Chuna manual therapy for headache and further well-designed RCTs should be encouraged.
Now ESCO 1 - 2011 ESCO우수투자사례 -강남대학교 그린캠퍼스
김대훈,Kim, Dae-Hun 에너지절약전문기업협회 2012 esco Vol.74 No.-
2011년 10월 21일 열린 대한민국에너지대전에서 ESCO 우수투자사례 발표가 있었다. 전체 사업의 50% 이상이 에너지효율화와 연계하여 1980년 이후 5000개 이상의 에너지성과보증프로젝트를 성공적으로 수행해 온 한국하니웰은 강남대학교와 그린캠퍼스를 위한 산학 MOU를 체결해 캠퍼스 에너지 비용절감에 상당한 성과를 거두었다. 그린캠퍼스 종합 상황실을 구축해 에너지 절감을 위해 체계적으로 관리하고 있는 한국하니웰(주)의 ESCO 성과보증 사례를 소개한다.
스퍼터링법으로 증착한 주석 합금층을 중간재로 사용한 순동의 저온접합법에 대한 연구
김대훈,Kim, Dae-Hun 한국재료학회 1996 한국재료학회지 Vol.6 No.5
동과 동을 저온에서 단시간내에 접합시키는 가능성을 검토하기 위해서 직류 자기 스퍼터링을 이용한 코팅한 주석 및 주석-잡 합금층을 중간층으로 사용하였다. 접합은 대기중 200-35$0^{\circ}C$의 온도에서 수행되었고 접합온도에 도달직후 바로 냉각하였다. 접합 계면에는 액상의 주석과 고상의 동간의 반응에 의해 n-상(Cu6Sn5) 및 $\varepsilon$-상(Cu3Sn)으로 구성된 금속간화함물 층이 형성되었다. 전단강도로 측정된 접합강도는 접합온도에 따라 비례적으로 증가하지만 30$0^{\circ}C$ 이상에서 감소하였다. 접합강도는 2.8-6.2MPa 범위로 나타났으며, 중간층합금 성분에 따른 접합계면에서의 금속간화합물의 생성거동과 관련지어 설명되었다. 실험결과 실용적인 접합법으로서 저온 단시간 접합의 가능성이 확인되었다.
20년간(1987년~2007년) 한의원 경영수지의 경향 연구
김대훈,임병묵,Kim, Dae-Hun,Lim, Byung-Mook 대한예방한의학회 2012 대한예방한의학회지 Vol.16 No.2
Objectives : This study aimed to analyze the trend of financial balance of Korean medicine clinics during 20 years, and to provide basic information for adjusting the fee schedule of Korean medicine procedures in national health insurance(NHI). Methods : We collected 6 financial analysis reports for Korean medicine clinics from the Association of Korean Oriental Medicine(AKOM). The data on incomes, costs and EBIT(earning before interests and taxes) of subject clinics were abstracted, and their long-term trends were evaluated. Results : The proportion of insurance income in total income increased from 23% to 56% during 20 years. Among 5 treatment groups, 'non-insurance medication' took up 65~67% of total incomes in 1997, but its proportion decreased to 42.4% in 2007. 'medical procedure, physical therapy and others' increased from 12.4% in 1987 to 29.2% in 2007. The labor cost was major part of total cost and its proportion maintained from 52% to 54%. Cost of 'non-insurance medication' was on the decline from 41% in 1996 to 31.6% in 2007. EBIT were -17.4 million won in 1996, and 18.4 million won in 2007. Conclusions : Financial balance of Korean medicine clinics improved until early 2000, but it became worse in 2007. Though deficits from NHI procedures has been covered up by profit from 'non-insurance medication', health insurance became a major source of income during last two decades.
스퍼터링 코팅층을 중간재로 사용한 동(Cu)의 저온 접합(제1보)
김대훈,Kim, Dae-Hun 한국기계연구원 1994 硏究論文集 Vol.24 No.-
This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.