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시효처리된 연료전지 집전판용 Matte 주석도금 동판의 고온열화 거동과 비저항변화
김주한(Ju-Han Kim),김재훈(Jae-Hun Kim),구경완(Kyung-Wan Koo),금영범(Young-Bum Keum),정귀성(Kwi-Seong Jeong),고행진(Haeng-Jin Ko),한상옥(Sang-Ok Han) 대한전기학회 2009 전기학회논문지 Vol.58 No.8
Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(μ) and Cu3Sn(ε) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(μ) intermetallics layer gradually changed Cu3Sn(ε). Moreover Cu get through Sn layer and it was diffused in the surface at 200℃. On the other hand, only Cu3Sn(ε) intermetallics layer were formed at plate/substrate interface at 300℃. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.
연료전지 집전판용 주석도금 동판의 열 열화에 따른 금속간화합물 성장 및 비저항 변화
김재훈(Jae-Hun Kim),김주한(Ju-Han Kim),한상옥(Sang-Ok Han),구경완(Kyung-Wan Koo),금영범(Young-Bum Keum),정귀성(Kwi-Seong Jeong),고행진(Haeng-Zin Ko) 대한전기학회 2009 대한전기학회 학술대회 논문집 Vol.2009 No.7
Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu?Sn?(μ) and Cu₃Sn(ε) intermetallics layer were formed at plate/substrate interface. Cu?Sn?(μ) intermetallics layer gradually changed Cu₃Sn(ε). Moreover Cu get through Sn layer and it was diffused in the surface at 200℃. On the other hand, only Cu₃Sn(ε) intermetallics layer were formed at plate/substrate interface at 300℃. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.
박은하(Eun-Ha Park),김주한(Ju-Han Kim),김재훈(Jae-Hun Kim),김윤형(Yoon-Hyoung Kim),한상옥(Sang-Ok Han),금영범(Young-Bum Keum),정귀성(Kwi-Seong Jeong),고형진(Haeng-Zin Ko) 대한전기학회 2009 대한전기학회 학술대회 논문집 Vol.2009 No.7
본 연구에서는 수소 연료전지의 엔드플레이트와 외부 연결 부분의 금속을 진동시험기를 이용하여 접촉저항을 측정하였다. 수소 연료전지의 집접판에서의 전류밀도의 변화와 온도 분포의 변화를 비교해 볼 수 있었으며, 접촉저항을 측정 할 수 있었다. 진동시험기는 5∼50 ㎐의 범위까지 설계하였으며 진동에 대한 접촉저항의 변화도 확인 할 수 있었다.