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Manual Application of Adhesives
Hellmanns, Mark,Bohm, Stefan,Dilger, Klaus The Society of Adhesion and Interface 2006 접착 및 계면 Vol.7 No.4
International standards claim the best possible reliability in industrial manufacturing processes. This is also essential for the application with manual applicators. The application of adhesives with manual applicators is one of the most frequently used application techniques. The range of application reaches from the building of prototypes in the automobile industry over the use in single or small-batch manufacturing up to applications in crafts enterprises. Conventional manual applicators for adhesives and sealants don't fulfill the demands in international standards for the best possible reliability. Only the worker is able to control the quality and the quantity of the bond. A velocity-controlled manual applicator solves these restrictions. Special sensors and micro controllers calculate the flow-rate, the velocity and the location of the manual applicator. This leads to stable and repeatable application processes which are claimed in international standards. The location of the bond can be compared with the nominal value, so that it is possible to check the quality of the bond during application. Furthermore there is the potential to document the data of the manufacturing process.
Lock-In Thermography Based NDT of Parts for the Automotive Industry
Bohm, Stefan,Hellmanns, Mark,Backes, Andreas,Dilger, Klaus The Society of Adhesion and Interface 2006 접착 및 계면 Vol.7 No.4
The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.