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SWAT 모형을 이용한 최적관리기법 적용에 따른 충주댐 유역의 하천수질 개선연구
유영석,박종윤,신형진,김샛별,김성준,Yu, Yung-Seok,Park, Jong-Yoon,Shin, Hyung-Jin,Kim, Saet-Byul,Kim, Seong-Joon 한국농공학회 2012 한국농공학회논문집 Vol.54 No.1
This study is to assess the reduction of nonpoint source pollution by applying Best Management Practice (BMP) in Chungju-dam watershed (6,585.1 $km^2$) using Soil and Water Assessment Tool (SWAT). The model was calibrated using 3 years (1998-2000) daily streamflow at 3 locations and monthly water quality of sediment (SS), total nitrogen (T-N) and total phosphorus (T-P) data at 2 locations and validated for another 3 years (2001-2003) data. The 5 BMPs of streambank stabilization, porous gully plugs, recharge structures, terrace, and contour farming were applied to stream and area with the specific criteria of previous researches. Through the parameter sensitivity analysis, the farming practice P-factor and Manning's roughness of stream were sensitive. Overall, the NPS reduction effect was high for streambank stabilization, terrace, and contour farming. At the watershed outlet, the SS, T-P, and T-N were reduced by 64.4 %, 62.8 % and 17.6 % respectively.
폴리이미드박막내에 석출된 구리산화물 관찰을 위한 TEM 시편 제조와 구리산화물 분석
유영석,김영호,You, Young-Sek,Kim, Young-Ho 한국현미경학회 1995 Applied microscopy Vol.25 No.1
TEM specimen preparation methods have been examined to characterize Cu oxide particles in the polyimide film. Polyimide films were prepared by coating polyamic acid onto Cu films which had been deposited on TEM-mask and glass substrates and Cu foil, followed by thermal curing. In case of TEM-mask, direct observation was possible without further preparation. In other cases, TEM specimen were made by separating polyimide film from the substrate. Polyimide films were removed from glass and Cu foil by dissolving glass in HF solution and Cu foil in $H_{2}SO_{4}$ solution. TEM-mask observation confirms that fine $Cu_{2}O$ particles precipitate in the polyimide as a result of reaction of polyamic acid with Cu. However $Cu_{2}O$ particle reacts with HF and $H_{2}SO_{4}$ solution during dissolving the substrate and interpretation could be misled. It is concluded characterization of $Cu_{2}O$ particle in polyimide using TEM-mask is better than other methods.
광전소자 패키징에서 광섬유 정렬을 위한 Si V-groove 형성
유영석,김영호 한국마이크로전자및패키징학회 1999 마이크로전자 및 패키징학회지 Vol.6 No.3
광 패키징에서 광섬유와 광전자소자를 정확히 정렬하기 위한 V-groove의 치수 정밀도에 미치는 마스크 재료와 에칭용액의 영향을 연구하였다. PECVD nitride, LPCVD nitride, thermal oxide($SiO_2$)를 마스크재료로 사용하였고 실리콘을 이방성에칭하는 용액으로 KOH(40wt%)용액과 KOH(40wt%)용액에 IPA를 첨가한 용액을 이용하였다. 마스크재료로는 LPCVD nitride가 가장 좋은 선택적에칭특성을 나타내었으며 사용된 마스크재료 중 thermal oxide가 가장 빠른 속도로 에칭되었다. V-groove의 크기 증가는 마스크충 아래로의 undercutting에 의해 생겼는데 이는 주로 (111)면으로의 에칭 때문이었다. KOH(40wt%)용액에서 (111)면의 에칭속도는 0.034 - 0.037 $\mu\textrm{m}$/min로 마스크재료에 관계없이 거의 일정하였다. IPA를 KOH(40wt%)용액에 첨가하면 (100)면과 (111)면의 에칭속도는 모두 감소하지만 (111)면에 대한 (100)면의 에칭속도비는 증가하였다. 그러므로 이런 용액에서 (111)면으로의 에칭에 의한 undercutting현상은 줄어들었으며 V-groove의 크기를 더 정확하게 조절할 수 있었다. The effects of mask materials and etching solutions on the dimensional accuracy of V-groove were studied for the alignment between optoelectronic devices and optical fibers in optical packaging. PECVD nitride, LPCVD nitride, or thermal oxide($SiO_2$) was used as a mask material. The anisotropic etching solution was KOH(40wt%) or the mixture of KOH and IPA. LPCVB nitride has the best etching selectivity and thermal oxide was etched most rapidly in KOH(40wt%) at $85^{\circ}C$ among the mask materials studied here. The V-groove size enlarged than the designed value. This phenomenon was due to the undercutting benearth the mask layer from the etching toward Si (111) plane. The etch rate of (111) plane wart 0.034 - 0.037 $\mu\textrm{m}$/min in KOH(40wt%). This rate was almost same regardless of mask materials. When IPA added to KOH(40wt%), the etch rate of (100) plane and (111) plane decreased, but etching ratio of (100) to (111) plane increased. Consequently, the undercutting phenomenon due to etching toward (111) plane decreased and the size of V-groove could be controlled more accurately.
IT사례-RFID 시스템 도입 시 상대적 증가비용을 줄이는 것이 중요
유영석,Yu, Yeong-Seok 한국컴퓨터사용자협회 2006 The USERS Vol.47 No.-
RFID 인프라를 셋업하고 상품에 RFID 태그를 부착하는데 소요되는 비용이 천문학적인 숫자임에는 틀림없다. 따라서 상대적 증가 비용을 줄이는 것이 중요하다. 이에 따라 인삼제품을 선정했다. 100만원짜리 인삼(홍삼)에 RFID태그를 붙이는 것은 새우깡 봉지에 붙이는 것에 비해 확실히 체감비용이 다르기 때문이다.