연구원 활동 : 발표논문요약 ; < 기계공학분야 > 원심형 압축기 임펠러 3 차원 점성 유동해석

홍상진,문영준 고려대학교 공학기술연구소 1996 생산기술연구소보 Vol.3 No.-

In-Situ Optical Monitoring of Electrochemical Copper Deposition Process for Semiconductor Interconnection Technology

홍상진,Li Wang,서동선,윤태식 한국전기전자재료학회 2012 Transactions on Electrical and Electronic Material Vol.13 No.2

An in-situ optical monitoring method for real-time process monitoring of electrochemical copper deposition (CED)is presented. Process variables to be controlled in achieving desired process results are numerous in the CED process,and the importance of the chemical bath conditions cannot be overemphasized for a successful process. Conventional monitoring of the chemical solution for CED relies on the pH value of the solution, electrical voltage level for the reduction of metal cations, and gravity measurement by immersing sensors into a plating bath. We propose a nonintrusive optical monitoring technique using three types of optical sensors such as chromatic sensors and UV/VIS spectroscopy sensors as potential candidates as a feasible optical monitoring method. By monitoring the color of the plating solution in the bath, we revealed that optically acquired information is strongly related to the thickness of the deposited copper on the wafers, and that the chromatic information is inversely proportional to the ratio of Cu (111)and {Cu (111)+Cu (200)}, which can used to measure the quality of the chemical solution for electrochemical copper deposition in advanced interconnection technology.

Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

홍상진,Jong Ha Hwang,서동선 한국전기전자재료학회 2011 Transactions on Electrical and Electronic Material Vol.12 No.3

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters,such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of 25-1 fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

종합일간지의 대체의학 관련 기사 보도 경향 분석

홍상진,김영애 대한의료정보학회 2005 Healthcare Informatics Research Vol.11 No.4

Objective: This study analyze the standpoint of newspapers toward alternative medicine. Methods: Through the content analysis of the articles selected by Korean Integrated News Database System(KINDS). With news items about alternative medicine in nine general dailies for six years between 1997 and 2002, this study was conducted to grasp the trend of the reports and provide investigation data to the alternative medicine communication. Results: As social concerns about health drastically increase, many types of health information and common senses in medicine are recently pouring out through various media. Newspapers and TV are competitively presenting items and programs about health every day. Now anyone can approach information and common senses in medicine with ease if he or she wants. The problem is that reports and programs about health pouring out through each medium contain a great amount of wrong information that can have a bad influence on national health. If wrong information is delivered to the people, or medical consumers, through the mass media, they can suffer from very serious side-effects and aftereffects. If patients or caregivers misled by false information on health commit an error in judgement, they can make their disease worse or miss the proper moment for treatment and consequently meet an irrevocable misfortune. For this reason, they must be careful in dealing with information on health. Conclusion: In consideration of results, many type of health information are expected to grow in the future. Therefore it is important for information providers to maintain a sound policy which is scientific and objective in order to protect information consumers. (Journal of Korean Society of Medical Informatics 11-4, 353-360, 2005)

Multiple‐inputs Dual‐outputs Process Characterization and Optimization of HDP‐CVD SiO2 Deposition

홍상진,Jong Ha Hwang,Sang Hyun Chun,한승수 대한전자공학회 2011 Journal of semiconductor technology and science Vol.11 No.3

Accurate process characterization and optimization are the first step for a successful advanced process control (APC), and they should be followed by continuous monitoring and control in order to run manufacturing processes most efficiently. In this paper, process characterization and recipe optimization methods with multiple outputs are presented in high density plasma-chemical vapor deposition (HDP-CVD) silicon dioxide deposition process. Five controllable process variables of Top SiH4, Bottom SiH4, O2, Top RF Power, and Bottom RF Power, and two responses of interest, such as deposition rate and uniformity, are simultaneously considered employing both statistical response surface methodology (RSM) and neural networks (NNs)based genetic algorithm (GA). Statistically, two phases of experimental design was performed, and the established statistical models were optimized using performance index (PI). Artificial intelligently,NN process model with two outputs were established,and recipe synthesis was performed employing GA. Statistical RSM offers minimum numbers of experiment to build regression models and response surface models, but the analysis of the data need to satisfy underlying assumption and statistical data analysis capability. NN based-GA does not require any underlying assumption for data modeling;however, the selection of the input data for the model establishment is important for accurate model construction. Both statistical and artificial intelligent methods suggest competitive characterization and optimization results in HDP-CVD SiO2 deposition process, and the NN based-GA method showed 26%uniformity improvement with 36% less SiH4 gas usage yielding 20.8 Å/sec deposition rate.

Abnormal Detection in 3D-NAND Dielectrics Deposition Equipment Using Photo Diagnostic Sensor

홍상진,강대원,백재근 한국반도체디스플레이기술학회 2022 반도체디스플레이기술학회지 Vol.21 No.2

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

Incipient Fault Detection of Reactive Ion Etching Process

홍상진,박재현,한승수 한국전기전자재료학회 2005 Transactions on Electrical and Electronic Material Vol.6 No.6

In order to achieve timely and accurate fault detection of plasma etching process, neural network based time series modeling has been applied to reactive ion etching (RIE) using two different in-situ plasma-monitoring sensors called optical emission spectroscopy (OES) and residual gas analyzer (RGA). Four different subsystems of RIE (such as RF power, chamber pressure, and two gas flows) were considered as potential sources of fault, and multiple degrees of faults were tested. OES and RGA data were simultaneously collected while the etching of benzocyclobutene (BCB) in a SF6/O2 plasma was taking place. To simulate established TSNNs as incipient fault detectors, each TSNN was trained to learn the parameters at t, t+T, …, and t+4T. This prediction scheme could effectively compensate run-time-delay (RTD) caused by data preprocessing and computation. Satisfying results are presented in this paper, and it turned out that OES is more sensitive to RF power and RGA is to chamber pressure and gas flows. Therefore, the combination of these two sensors is recommended for better fault detection, and they show a potential to the applications of not only incipient fault detection but also incipient real-time diagnosis.

Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

홍상진,Jong Ha Hwang,서동선 한국전기전자재료학회 2011 Transactions on Electrical and Electronic Material Vol.12 No.2

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of 25-1 fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

Process Optimization for Flexible Printed Circuit Board Assembly Manufacturing

홍상진,Hee Yeon Kim,Seung-Soo Han 한국전기전자재료학회 2012 Transactions on Electrical and Electronic Material Vol.13 No.3

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

서비스회복노력이 인터넷이용자의 지속적 이용의도에 미치는 영향 - 개인정보유출을 중심으로 -

홍상진,이수형 대한안전경영과학회 2010 대한안전경영과학회지 Vol.12 No.2

The most important concern in the internet service organizations in competitive market circumstances is to focus on formation and maintenance of continuous relationship with customers. The purpose of this study is to verify the effect of perception of the fairness - procedural fairness for recovery, interactional fairness, fairness for reward on customer's satisfaction and trust, behavior when the internet service company failed to service such as disclosure of personal information. This study aims to apply justice theories to service recovery. As a result, first, the customer's perceived justice had a significant effect on the customer satisfaction and trust in service recovery. Second, the customer's satisfaction positive effect on trust. Third, customer's satisfaction formed by service recovery had a effect on the customer's behavior such as continuous usage intention. Therefore, this study was reveal how the extent of justice perception felt by customers in the service recovery process, causes positive causation relationship which affect customer behavior intention.