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박막 확산대의 상변화에 미치는 탄성응력과계면 반응장벽의 영향
許株烈,洪種波 대한금속재료학회 2002 대한금속·재료학회지 Vol.40 No.4
An explicit, finite difference scheme has been used to simulate the influence of coherency stresses and interface kinetic barriers on the phase evolution of a binary, thin-film diffusion couple. Thin-films, initially consisting of alternating layers of two terminal phases α and γ, were held at a temperature where the formation of an intermediate phase β at α/γ interface was thermodynamically probable. In the absence of both the coherency stresses and interface kinetic barriers, β phase nucleates to grow at the beginning of the phase evolution and all phase compositions at interfaces are constant during the evolution. When either the coherency stresses or interface kinetic barriers are present, however, the interfacial compositions become time-dependent and thus the following characteristics of phase evolution are possible: (1) thermodynamically stable phase β does not form at the early stages of the evolution but nucleates to grow in the middle of the evolution, and (2) thermodynamically unstable phase β can initially nucleate to grow and then shrink to disappear during the evolution. Even if the initial states of α/γ multilayers have the same overall composition, the presence of coherency constraint can result in different final equilibrium states depending on either the initial phase compositions of α and γ or the magnitude of interface kinetic barriers.
리플로우 솔더링시 솔더/Cu 계면반응속도에 미치는 Cu- 첨가 솔더의 영향
허주열,강대웅 대한금속재료학회(대한금속학회) 2000 대한금속·재료학회지 Vol.38 No.1
We have investigated the effects of Cu additions to pure Sn and eutectic Sn-Pb solders on the morphology and growth kinetics of the intermetatllics (Cu_6Sn_5) and on the consumption rate of Cu substrate during isothermal reflow soldering. The consumption rate of Cu substrate could be reduced with increasing Cu content in both Sn and Sn-Pb solders up to the respective solubilities at reflow temperatures. The effect of Cu addition was more significant for the Sn solder which had a higher Cu solubility. The Cu addition also resulted in morphological changes of the intermetallic layer. With increasing Cu content, the interface between Cu_6Sn_5 layer and solder roughened for pure Sn solder whereas it flattened fur the eutectic Sn-Pb solder. When the time(t) dependence of the intermatallic layer thickness(X ̄) was modelled as X ̄ = a×t^n, the growth constant a appeared to increase with the Cu content whereas the growth exponent n decreased. It was shown that the growth kinetics of the intermetallic layer could be well interpreted by a model of grain boundary diffusion controlled growth.