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무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동
최재웅,황길호,한원규,이완희,강성군,Choi, Jae-Woong,Hwang, Gil-Ho,Han, Won-Kyu,Lee, Wan-Hee,Kang, Sung-Goon 한국재료학회 2005 한국재료학회지 Vol.15 No.9
Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.
A1-25Nb계와 (A1,X)-25Nb계 (X = Cr, Cu, Fe, Mn)의 기계적 합금화에 의한 금속간 화합물의 형성 거동에 관한 연구
최재웅,강성군,Choi, Jae-Woong,Kang, Sung-Goon 한국재료학회 2001 한국재료학회지 Vol.11 No.9
In Al-25Nb binary system, it was observed only formation of $D0_{22}$ $Al_3Nb$ intermetallic compound after 5hr milling but it was not observed formation of meta stable phase like L1$_2$ phase. In this state, $D0_{22}$ $Al_3Nb$ fabricated had nano sized grain of approximately 20nm. Ternary systems, transition metals such as Cr, Cu, Fe, Mn were added 6~12at.% as substitution of Al, showed formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. In Al- l2Cu-25Nb system, it was observed that broad XRD pattern like amorphization of Al and not observed formation of $D0_{22}$ $Al_3Nb$ after 5hr milling. But there was mixed phase of a lot of amorphous Al and little $D0_{22}$ $Al_3Nb$ through TEM. In the states of unalloyed, 5~7hr milling time, those showed exothermic reaction at 35$0^{\circ}C$, which was formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. With increasing milling time to 10hr, $D0_{22}$ $Al_3Nb$ was transformed to mixed phase of amorphous and nanocryatlline, having approximately 10nm grain but the meta stable $Al_3Nb$ was not fabricated by adding transition metals.
무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극의 확산 방지막 제조
최재웅,홍석준,이희열,강성군,Choi, Jae-Woong,Hong, Seok-Jun,Lee, Hee-Yeol,Kang, Sung-Goon 한국재료학회 2003 한국재료학회지 Vol.13 No.2
In this study, we have investigated the availability of the electroless Ni-B plating for a diffusion barrier of the bus electrode. The Ni-B layer of 1$\beta$: thick was electroless deposited on the electroplated Cu bus electrode for AC plasma display. The layer was to encapsulate Cu bus electrode to prevent from its oxidation and to serve as a diffusion barrier against Cu contamination of the transparent dielectric layer in AC plasma display. The microstructure of the as-plated barrier layer was made of an amorphous phase and the structure was converted to crystalline at about 30$0^{\circ}C$. The concentration of boron was about 5∼6 wt.% in the electroless Ni-B deposit regardless of DMAB concentration. The electroless Ni-B deposit was coated on the surface of the electroplated Cu bus electrode uniformly. And the electroless Ni-B plating was found to be an appropriate process to form the diffusion barrier.
무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극용 확산방지막의 열처리 영향
최재웅,황길호,홍석준,강성군,Choi Jae Woong,Hwang Gil Ho,Hong Seok Jun,Kang Sung Goon 한국재료학회 2004 한국재료학회지 Vol.14 No.8
Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.
차량용 CO<sub>2</sub> 에어컨 사이클 성능 향상을 위한 일체형 팽창기-압축기 성능 해석
최재웅,임정택,김현진,Choi, Jae Woong,Lim, Jeong Taek,Kim, Hyun Jin 대한설비공학회 2018 설비공학 논문집 Vol.30 No.3
A design combining the use of a compressor and expander was introduced in order to improve the cycle performance of a $CO_2$ automotive air conditioning system. Both the compressor and expander used were of rotary vane type and were designed to share a common shaft in a housing. Numerical simulation was carried out to evaluate the merit of the combined unit. In a typical automotive air conditioning operating conditions, the COP of the system was improved by 8.7% by the application of the combined unit. The compressor input was reduced by 5.2% through use of the expander output. In addition, about 3.06% increase in the cooling capacity was obtained through isentropic expansion in the expander. Our study noted that, as the pressure difference between the gas cooler and the evaporator becomes larger, the COP of the system improved increases unless the mass flow rate in the expander exceeds that in the compressor.
직선교량에 대한 디지털엔지니어링 모델의 선형연동 프로그램 개발
최재웅,강전용,김현민,Choi, Jae-Woong,Kang, Jeon-Yong,Kim, Hyun-Min 한국BIM학회 2020 KIBIM Magazine Vol.10 No.4
This report describes the development of a program that can be linked to an alignment and extracts related information using a prefab structured digital engineering model. The subject bridge was set as a straight alignment, the Superstructure type as Precast girder and the Substructure type as Precast pier and Cast-in-situ Abutment. We identified the variables required to create a digital engineering model and reviewed them to create the digital engineering model by entering them as numerical values in the program. In addition, it is configured so that the variables linked to the alignment can be entered numerically. The quantity takeoff can be calculated when the design is complete. The purpose of the program development presented in this report is to enable the designers to select the optimal alternative by designing a bridge that best fits their current situation, extracting the relevant information and then by providing it to the manufacturer and construction company.
Al-Ni계의 기계·화학적 방법으로 제조된 Raney Ni의 미세 구조 분석
최재웅,이창래,강성군,Choi, Jae-Woong,Lee, Chang-Rae,Kang, Sung-Goon 한국재료학회 2003 한국재료학회지 Vol.13 No.1
The Raney Ni catalyst was fabricated by mechanochemically process(MC process) in the Al-Ni system. Intermetallic compound obtained by mechanical alloying was leached in an alkaline solution. The characteristics of the mechanically alloyed powder and Raney Ni catalyst were analyzed by XRD, ICP-AES and EXAFS. In Al-50wt.%Ni, the metastable intermetallic compound phase close to AlNi phase was obtained by mechanical alloying unlike Al-Ni equilibrium phase diagram. The metastable intermetallic compound was transformed into $Al_3$$Ni_2$phase via the annealing at $750^{\circ}C$. The microstructure of Raney Ni fabricated by MC process was mainly bcc Ni including fcc Ni.