http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
국내 양양 송이 자생지 내 균환 유래 토양미생물과 송이균사체 생장촉진 효과
최두호,이은지,이강효,안기홍,Doo-Ho Choi,Eunji Lee,Kang-Hyo Lee,Gi-Hong An 한국버섯학회 2024 한국버섯학회지 Vol.22 No.1
Tricholoma matsutake is a traditional favorite food in East Asia, cultivated in fairy rings called "shiro," which are found near Pinus densiflora. For effective artificial cultivation of Tri. matsutake, microorganisms from symbiotic fairy rings are co-cultivated. In this study, one bacterial isolate (Y22_B35) and two fungal isolates (Y22_F64 and Y22_F68) displayed growth-promoting effects on Tri. matsutake mycelium (158.47, 125.00, and 122.26% enhanced growth, respectively). For identification, 16S rRNA or ITS regions from the microorganisms¡¯ genomes were sequenced. Other sequences, including BenA, CaM, and RPB2 were sequenced in the fungal isolates. The bacterial isolate Y22_B35 was identified as Bacillus cereus. Y22_F64 and Y22_F68 were identified as Umbelopsis nana and Aspergillus parvulus, respectively. To identify the effects of the dominant microorganisms on Tri. Matsutake cultivation, metagenomic analyses were performed. Discovery of these Tri. matsutake mycelium growth-promoting microorganisms and metagenomics analyses are expected to contribute to our understanding of Tri. matsutake fruiting body growth and construction of biomimicry.
최두호 대한금속·재료학회 2018 대한금속·재료학회지 Vol.56 No.8
Severe resistivity size effect in Cu interconnects is attributed to the relatively long bulk electron mean free path (39 nm at 298 K), which is inherently determined by phonon scattering. In this regard, Ru and Co have been recently considered as attractive alternatives for next-generation interconnect materials because the significantly shorter electron mean free paths for Ru (6.6 nm) and Co (11.8 nm) have been predicted to lead to a dramatically reduced resistivity size effect, which may allow lower resistivity of these materials than Cu at sufficiently reduced interconnect dimensions despite their relatively high bulk resistivies. In this study, the impact of surface and grain boundary scattering for Ru and Co was assessed based on the Fuchs-Sondheimer surface scattering model and the Mayadas-Shatzkes grain boundary scattering model, first by fitting these models to the resistivity data reported in the literature and second by artificially varying the scattering parameters in the models. The results predict that the wire resistivities of Ru and Co will cross below that of Cu at wire-widths of 10-15 nm.