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최광성 대한의사협회 2013 대한의사협회지 Vol.56 No.1
The scalp hair is composed of one hundred thousand of hairs. Each hair goes through the three phases of the hair cycle, which causes the hair to turn from an anagen hair into a catagen hair,then into a telogen hair, and finally into a new anagen hair. The number of hairs is maintained at a relatively constant level because each hair has its own hair cycle. The hair of Koreans is relatively thicker than that of Caucasians and Africans but its growth rate and density are lower. There are various factors that influence hair growth such as hormones, nutritional status, and drugs. However,androgen is most important among these factors and, particularly, androgenetic alopecia is caused by androgen and genetic factors. Because excessive dihydrotestosterone produced by 5α-reductase is of the greatest importance in androgenetic alopecia, finasteride or dutasteride,which inhibits the action of 5α-reductase, is effective in treating androgenetic alopecia. Also,minoxidil is widely used as it promotes hair growth. Furthermore, there are various types of hair diseases and specialized examination is required for differential diagnosis.
최광성,이학선,배현철,엄용성,Choi, K.S.,Lee, H.,Bae, H.C.,Oem, Y.S. 한국전자통신연구원 2013 전자통신동향분석 Vol.28 No.5
플립 칩 본딩 기술은 1960년대에 개발된 기술이지만 가격 경쟁력, 경박단소(輕薄短小)의 부품 구현, 뛰어난 전기적 특성으로 인해 최근에 와서 다시금 주목 받고 있고, 관련 시장이 지속적으로 성장하고 있는 분야이다. 기술 응용 분야로는 스마트 폰, 타블렛 PC 등 개인 휴대 단말기에서 고성능 서버, 게임 컨트롤로 등 다양한 제품을 아우르고 있다. 미세 피치의 경우 관련 시장이 2018년까지 연평균 35%의 폭발적인 성장을 보일 것으로 예측되고 있다. 따라서, 국내외 기업, 연구소, 학계 등에서 활발한 연구 활동이 진행되고 있다. 본고에서는 플립 칩 본딩 기술의 세부 기술을 살펴보며 동시에 피치에 따라 각 세부 기술에 있어 최근에 개발되고 있는 기술 동향을 논의하고자 한다.
Interconnection Technology Based on InSn Solder for Flexible Display Applications
최광성,이학선,배현철,엄용성,이진호 한국전자통신연구원 2015 ETRI Journal Vol.37 No.2
A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 μm pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C.
다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술
최광성,문석환,엄용성,Choi, K.S.,Moon, S.H.,Eom, Y.S. 한국전자통신연구원 2018 전자통신동향분석 Vol.33 No.6
As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.