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유경훈 인하대학교 교육연구소 2023 교육문화연구 Vol.29 No.3
This study was conducted to determine the effect of university students' mindfulness level and psychological well-being through the development of psychology-related liberal arts classes, including mindfulness activities. A liberal arts class based on the theory of mindfulness, namely, “Understanding the Mind (Lew, 2021)” was developed, and the class was conducted for 15 weeks per semester. The subjects of the study were 28 students who took this class at S University in Seoul (the experimental group), and 32 students who took other liberal arts classes were selected as the control group. Regarding the test tools, a mindfulness scale (Park, 2006) and psychological well-being scale (Kim et al., 2001) were administered before and after class, respectively, and the collected data were analyzed using a pre-homogeneity test and mean comparison analysis with the SPSS 25.0 program. It was found that the mindfulness-based liberal arts class had a partial effect on mindfulness and a significant effect on psychological well-being. 본 연구는 마음챙김 활동을 포함한 심리학 관련 교양수업 개발을 통해 대학생들의 마음챙김 수준과 심리적 안녕감의효과성을 알아보고자 실시되었다. 연구대상은 서울의 s대학교 재학생 중 본 수업을 수강한 28명의 학생을 실험집단으로선정하였으며 마음챙김이론과 활동을 기반으로 하는 교양수업인 “인간의 마음이해(유경훈, 2021)” 교과목을 활용하여한 학기 15주 동안 수업을 실시하였다. 다른 교양수업을 수강한 32명의 학생들을 통제집단으로 선정하였다. 검사도구는마음챙김 척도(박성현, 2006)와 심리적 안녕감 척도(김명소 외, 2001)를 수업 전과 후에 각각 실시하였으며 수집된자료는 SPSS 25.0 프로그램을 활용하여 사전동질성 검사와 평균비교분석을 통해 효과성을 분석하였다. 마음챙김교양수업을 들은 학생들은 마음챙김에서 부분적으로 효과가 나타났으며, 심리적 안녕감은 전체적으로 의미있는 효과가나타났음을 알 수 있었다.
가열 또는 냉각되는 수평웨이퍼 표면으로의 입자침착에 관한 해석
유경훈,오명도,명현국 대한기계학회 1995 대한기계학회논문집 Vol.19 No.5
Numerical analysis was performed to characterize the particle deposition behavior on a horizontal free-standing wafer with thermophoretic effect under the turbulent flow field. A low Reynolds number k-.epsilon. turbulence model was used to analyze the turbulent flow field around the wafer, and the temperature field for the calculation of the thermophoretic effect was predicted from the energy equation introducing the eddy diffusivity concept. The deposition mechanisms considered were convection, diffusion, sedimentation, turbulence and thermophoresis. For both the upper and lower surfaces of the wafer, the averaged particle deposition velocities and their radial distributions were calculated and compared with the laminar flow results and available experimental data. It was shown by the calculated averaged particle deposition velocities on the upper surface of the wafer that the deposition-free zone, where the deposition velocite is lower than 10$^{-5}$ cm/s, exists between 0.096 .mu.m and 1.6 .mu.m through the influence of thermophoresis with positive temperature difference of 10 K between the wafer and the ambient air. As for the calsulated local deposition velocities, for small particle sizes d$_{p}$<0.05 .mu.m, the deposition velocity is higher at the center of the wafer than at the wafer edge, whereas for particle size of d$_{p}$ = 2.0 .mu.m the deposition takes place mainly on the inside area of the wafer. Finally, an approximate model for calculating the deposition velocities was recommended and the calculated deposition velocity results were compared with the present numerical solutions, those of Schmidt et al.'s model and the experimental data of Opiolka et al.. It is shown by the comparison that the results of the recommended model agree better with the numerical solutions and Opiolka et al.'s data than those of Schmidt's simple model.