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박수길,박종은,정승준,엄재석,전세호,이주성,Park Soo-Gil,Park Jong-Eun,Jung Seung-Jun,Yum Jae-Suk,Jun Sae-ho,Lee Ju-Seong 한국전기화학회 1999 한국전기화학회지 Vol.2 No.3
최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다. Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.
박수길,이주성,손원근,김종진,엄재석,전세호,이홍기 한국공업화학회 1998 응용화학 Vol.2 No.2
A new treatment of LiV₃O_8 has been proposed for improving its electrochemical behavior as a cathode material for secondary lithium batteries. Lithium trivanadate, LiV₃O_8, can be prepared in a finely dispersed form by dehydration of aqueous lithium trivanadate gels. The ultrasonic treated LiV₃O_8 can improve not only the specific capacity, but also the electrical conductivity.
무전해 니켈 / 금도금의 Bondability 향상에 관한 기초 연구
이주성,손원근,박수길,정승준,박정권,엄재석,전세호 한국공업화학회 1999 응용화학 Vol.3 No.1
The electoless plating has recently attracted considerable attention from these concerned with the fabrication of electronic devices because electroplating is not applicable to satisfy that circuits are becoming finer and denser. A bondability also is discussed on the one of the characteristic of electroless Ni/Au plating and it's contact material for the improving their high quality instruments was tried to developed in this wrok. So fianally, the bondability of the electroless Ni/Au finish were mesured successfully by gold wire full-test (wire diameter=1.2mil) and the bonding force could build up maxium about 7 g.