http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Development of Debris-free Process using Erasable Ink for Polymer Ablation
신동식,이제훈,서정,김도훈,Shin, D.S.,Lee, J.H.,Suh, J.,Kim, T.H. Korean Society of Laser Processing 2005 한국레이저가공학회지 Vol.8 No.2
The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.
신동식(D. S. Shin),임세환(S. H. Lim),이제훈(J. H. Lee),김종도(J. D. Kim),송은영(E. Y. Song),방형배(H. B. Bang) 한국레이저가공학회 2008 한국레이저가공학회 학술대회 논문집 Vol.2008 No.-
Laser assisted machining of silicon nitride (Si₃N₄) is evaluated by using laser integrated machining center. Laser - tool angle of this machine is adopted at 180˚ in consideration of its usability, flexibility, and safety. The higher laser power was needed for the larger laser-tool angle, but excessive laser power could raise the tool temperature and tool wear.
폴리머의 어블레이션 시 소거성 잉크를 이용한 잔유물 제거공정 개발
신동식(D. S. Shin),이제훈(J. H. Lee),서정(J. Suh),김도훈(T. H. Kim) 한국레이저가공학회 2005 한국레이저가공학회지 Vol.8 No.2
The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polyimide. The ink pasted polyimide is ablated by a KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.