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설우석,권순형,최은미,Yinhua Cui,이강원,심호재,Yuan Gao,한상준,표성규 대한금속·재료학회 2017 ELECTRONIC MATERIALS LETTERS Vol.13 No.3
We report the analysis of the radiofrequency (RF) characteristicsaccording to the size, area, and shape of TaN thin-film resistor (TFR)layers. As the TFR size increased, its characteristics were degradedwith increasing frequency owing to the increased capacitive parasiticcomponents. As the frequency increased from 1 MHz to 10 GHz, theeffective resistance decreased by approximately 12.5%, 16.4%, and37.8% when the resistor widths and lengths were 0.5 × 20, 1 × 40, and2 × 80 μm, respectively. To optimize the performance of the highfrequencyTFR, ensuring RF isolation via sufficient separation fromthe silicon substrates was crucial. To realize this RF isolation,methods for minimizing the effect of lossy Si substrates by usingTFRs with a smaller area or by forming a patterned ground shieldshould be introduced.
설우석,김삼동,이성대,강태신,DanAn,전영훈,In-SeokHwang,이진구,Ki-HyunRyu 한국물리학회 2003 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.43 No.6
A variety of three-dimensional (3-D) transmission line structures were fabricated using lowdielectric- constant benzocyclobutene (BCB) interlayers to achieve low characteristic impedances (Zo) at millimeter wave frequencies. The eects of structural variations on the Zo of the transmission line structures were examined at a frequency of 50 GHz. Two dierent 3-D coplanar waveguide (CPW) structures, the bottom-ground and the double-ground structures, showed very low Zo values of 7.3 and 9.4 , respectively, at a signal linewidth of 100 m and a bottom-ground spacing of 20 m. When the ratio of the spacing of bottom-ground width to the signal linewidth became greater than 2.5, the Zo was nearly saturated, showing a minimum Zo. The thin-lm microstrip lines fabricated using the BCB inter layers showed a higher minimum Zo of 25.5 at a ground plane width of 55 m and a signal linewidth of 35 m than the 3-D CPW structures did. Among the 3-D transmission structures, the bottom-ground CPW was shown to be the most ecient structure to achieve a low Zo by maximizing the capacitance between the signal and the ground lines at 50 GHz. A variety of three-dimensional (3-D) transmission line structures were fabricated using lowdielectric-constant benzocyclobutene (BCB) interlayers to achieve low characteristic impedances(Zo) at millimeter wave frequencies. The eects of structural variations on the Zo of the transmissionline structures were examined at a frequency of 50 GHz. Two dierent 3-D coplanar waveguide(CPW) structures, the bottom-ground and the double-ground structures, showed very low Zo valuesof 7.3 and 9.4, respectively, at a signal linewidth of 100 m and a bottom-ground spacingof 20 m. When the ratio of the spacing of bottom-ground width to the signal linewidth becamegreater than 2.5, the Zo was nearly saturated, showing a minimum Zo. The thin-lm microstriplines fabricated using the BCB inter layers showed a higher minimum Zo of 25.5at a groundplane width of 55 m and a signal linewidth of 35 m than the 3-D CPW structures did. Among the3-D transmission structures, the bottom-ground CPW was shown to be the most ecient structureto achieve a low Zo by maximizing the capacitance between the signal and the ground lines at 50GHz.