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감성제품개발을 위한 감성 이미지 디자인 프로세스 개발에 관한 연구
이순요,양선모,변상섭 한국감성과학회 1997 연차 학술대회 논문집 Vol.1997 No.-
This paper describes an image design process for product development based on human sensibility ergonomics.. The human sensibility about product image can be measured through some statistical methods and translated into product design factors by some mathemmical inference logics. This results also can be presented by 3D computer graphic tools. In order to integrate the above processess, a image design process on human sensibility is proposed in this paper. The first step of the system is to make a human sensibility database. Human sensibility database is constructed with the relational data of some adjeClive words and design factors. The next SIep is to extract the design information from the human sensibility database by fuzzy inference algorithm. This information is used for the input data for the graphic presentation. The final product can be modified according to the customer``s requirement.
Cu-6wt%Ni-4wt%Sn 합금의 기계적 전기적 성질에 미치는 Mm (Ce, La, etc) 의 미량 첨가 효과
김창주,이정무,한승전,정윤철,변상섭 대한금속재료학회(대한금속학회) 1999 대한금속·재료학회지 Vol.37 No.10
The effect of small addition of Mm(Ce, La, etc) on the mechanical properties and electrical resistivity of Cu-6Ni-4Sn(wt%) alloy has been investigated by means of microstructural observation as well as the tensile and electrical resistivity tests. The Cu-6Ni-4Sn alloy was found not to strengthen by an aging treatment after cold working but the tensile strength of this alloy was decreased with increasing the aging temperature, indicating that the spinodal decomposition didn't occur in the α supersaturated solid solution. The grain growth was significantly suppressed by the small addition of Mm, resulting into the substantially enhanced mechanical properties. The tensile strength and elongation of the Cu-6Ni-4Sn-0.05Mm alloy was found to increase with increasing aging temperature at low temperature range possibly due to the spinodal decomposition and CeNi₄Sn₂ precipitation. The electrical resisitivity was significantly reduced by the small addition of Mm. In all of the alloys examined, the electrical resistivity was reduced by raising the aging temperature. The Mm addition is found to reduce the electrical resistivity more rapidly as the aging temperature increases.
Cu-6Ni-4Sn 합금에 있어서 α 과포화 고용체의 분해거동에 미치는 Mm(Ce, La, etc) 의 미량첨가 효과
김창주,이정무,한승전,정윤철,변상섭 대한금속재료학회(대한금속학회) 1999 대한금속·재료학회지 Vol.37 No.6
The Effect of very small addition of misch metals (La, Ce, etc) on the decomposition behavior of the supersaturated solid solution a in Cu-6%Ni-4%Sn(wt.%) alloy was investigated by means of microstructural observations such as optical, scanning and transmission electron microscopies. In the case of Cu-6Ni-4Sn alloy which does not contain Mm, the supersaturated solid solution α was not decomposed into other phases such as spinodal decomposition, γ′ (D0_(22) and y (D0₃) by aging after solution treatment. The small addition of Mm to the Cu-6%Ni-4%Sn alloy, on the other hand, affected markedly the decomposition behaviors of the supersaturated solid solution α. In addition, the grain growth was significantly retarded by the small addition of Mm. In this alloy containing Mm, the supersaturated solid solution α was decomposed into γ′ and γ phases with aging time, indicating that the supersaturated solid solution α was decomposed by the spinodal decomposition in the first stage.
Cu-6Ni-6Sn-xMn 합금의 시효거동에 미치는 Mn, Al, Ti, Si 의 영향
김상식,김창주,이정무,한승전,정윤철,변상섭 대한금속재료학회(대한금속학회) 2000 대한금속·재료학회지 Vol.38 No.1
The effects of addition of Mn, Al, Ti and Si on the aging behavior in Cu-6Ni-6Sn-xMn (wt%) alloys were investigated by means of X-ray side band observation around (200)_α peak, hardness measurements and microstructural observations. The supersaturated solid solution α of Cu-6Ni-6Sn alloy decomposed via the spinodal mechanism to form the modulated structure on aging at temperatures below 350℃, then the matastable phase of γ' with DO_(22) structure formed later. However, when the alloy were aged at at temperatures above 450℃, the cellular structure consisting of αand γ phases formed. The decomposition process of Cu-6Ni-1.5Mn-6Sn alloy was similar to that of the Cu-6Ni-1.5Mn-6Sn alloy. In the alloys consisting more than 3 wt% Mn, however, neither the spinodal decomposition nor the formation of γ' were not occurred. The decomposition mode of the alloys were significantly altered by the small additions of Al, Ti or Si. Al, Ti and Si added alloys were hardened by the metastable CuAl₂, CuTi₂ and MnSi precipitates, respectively.