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DeviceNet 을 채용한 GaAs 본딩 시스템의 통합 제어기술
송준엽(J. Y. Song),이승우(S. W. Lee),임선종(S. J. Lim),김원경(W. K. K),배영걸(Y. G. Bae) 한국정밀공학회 2004 한국정밀공학회 학술발표대회 논문집 Vol.2004 No.10월
This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.
고속 반도체 패키지 검사시스템의 Picking System 경량화에 대한 연구
배영걸,이창우,송준엽,박상순,정영상 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
The demand of high speed inspection system for semiconductor package is becoming larger recently. The research for high speed handler and Pick & Place Technology is increasing also. In this paper, lightweight Picking System for use in high speed inspection system for semiconductor package is researched.