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閔丙珏 충주대 2001 한국교통대학교 논문집 Vol.36 No.2
The epoxy resin/poly(phenylene oxide)(PPO) blending systems as a use of matrix materials for printed circuit board(PCB) were specially prepared.A diglycidyl ether of bisphenol A(DGEBA) epoxy resin and an aromatic amine curing agent, 4,4'-diaminodiphenyl methane(DDM) were used in this study as the primary matrix materials, and PPO was blended additionally in order to improve the electric property of the system.Thermal and electric properties of the prepared epoxy resin/PPO blending systems have been investigated as a function of the concentration of PPO modifier.The glass transition temperature(Tg) was not changed noticeably up to the concentration of 10wt% of PPO and then decreased rapidly with further increment of the modifier.In addition the electric property was found showing the similar trend.The value of electric constant was decreased approximately 23% at 10wt% of PPO-modified epoxy system and then slightly increased again with further increment of PPO modifier over 10wt% concentration.
엔지니어링 플라스틱으로 강인화된 에폭시수지계의 물성 연구
민병각 충주대 산업과학기술연구소 1999 産業科學論文集 Vol.7 No.2
The fracture properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins modified with phenolic hydroxyl-terminated polysulfone (PSF) which is an engineering thermoplastic, and cured with diaminodiphenyl sulfone (DDS) curing agent have been investigated as a function of the molecular weight and concentration of PSF as well as a function of cure conditions. The fracture toughness, measured by compact tension test, increased with increasing molecular weight and/or concentration of the modifier while it was not influenced by cure conditions.