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Snap Turns을 활용한 VR에서 몰입감을 높이는 File Browser 디자인
김휘성,최용순 한국디지털콘텐츠학회 2023 한국디지털콘텐츠학회논문지 Vol.24 No.1
Through the COVID-19 period, collaboration through computing platforms has increased, especially collaboration using VR is dramatically increasing. Accordingly, it is expected that the importance of File Browser, which is essential for remote collaboration, will grow in VR. Therefore, a study about the user interface of File Browser in VR was conducted in this paper. We identified the characteristics of the existing 3D File Browser and prepared the design guidelines for the production of the 3D File Browser suitable for VR. In addition, we tested through a comparative experiment with the 3D File Browser and the normal File Browser that is usually seen in the window system based on usable, useful, findable, credible, desirable, control factors, and realism factors. And the task completion time also was measured. The paired T-test was used for the analysis and all factors were statistically significant. It is expected that it will be helpful in designing the UI when making a 3D File Browser for VR. 코로나 시기를 거치면서 컴퓨팅 플랫폼을 통한 협업이 증가하였고, 그 중 VR을 이용한 협업이 증가하고 있다. 그에 따라 원격 협업에 중요한 File Browser에 대한 중요성이 VR 내에서 커질 것이라 예상된다. 이에 본 논문에서는 VR 내에서의 File Browser UI에 대한 연구를 진행하였다. 기존 3D File Browser의 특징을 파악해 VR에 적합한 3D File Browser 제작에 대한 기준을 마련하고 Dashborad File Browser와의 비교 실험을 통해 사용가능성, 유용성, 발견가능성, 신뢰성, 매력성, 조작의 자율성, 몰입감과 태스크 완료 시간에 대한 가설들을 실험하였다. 실험 데이터를 바탕으로 대응표본 T검정을 이용하여 분석하였다. 본 연구를 통해 VR에 적합한 3D File Browser 제작시 UI를 디자인 하는데 도움이 될 것으로 기대된다.
Sn-40Pb/Cu 및 Sn-3.0Ag-0.5Cu/Cu 접합부 계면반응 및 활성화에너지
김휘성,홍원식,박성훈,김광배,Kim, Whee-Sung,Hong, Won-Sik,Park, Sung-Hun,Kim, Kwang-Bae 한국재료학회 2007 한국재료학회지 Vol.17 No.8
In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.