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Effects of Nanoclay on the Properties of Low Temperature Cured Polyimide System
김광인,한학수,유태원,남기호,Patrick Han,장원봉 한국고분자학회 2014 Macromolecular Research Vol.22 No.11
Polyimide is a major polymer material in the electronics industry, and we conducted a study to cure polyimideat low temperatures in order to improve its thermal and mechanical properties. In this study, polyimide/claynanocomposites were prepared by the reaction of 4,4'-(hexafluoro isopropylidene) diphthalic anhydride (6FDA) and4,4'-oxydianiline (ODA) with the addition of 1,4-dizabicyclo[2.2.2]octane (DABCO) as a low-temperature catalystand nanoclay (Cloisite 20A). The synthesis of polyimide at low temperatures and the dispersion of a nanoclay in thepolymer matrix was confirmed by Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD),respectively. Thermal stabilities of the nanocomposites were confirmed by thermogravimetric analysis (TGA) anddifferential scanning calorimetry (DSC). The mechanical properties were measured by an universal testing machine. We demonstrated that when polyimide was cured at low temperatures and short curing times, it was possible toimprove the thermal and mechanical properties via the addition of a catalyst and inorganic material. Polyimide withDABCO and 0.25 wt% nanoclay showed a 5 oC higher degradation temperature, 560.88 oC; a 6 oC higher glass transitiontemperature, 293.62 oC; and a 20 MPa greater tensile strength, 136.94 MPa. Therefore, the polyimide curingprocess was demonstrated to be successful at low temperatures.
Poly(amide-imide) with low residual stress for electronic material
김광인,진호정,한학수 한국공업화학회 2015 한국공업화학회 연구논문 초록집 Vol.2015 No.1
Poly(amide-imide) was synthesized at low temperature process to offer a thermal stable memebrane with low residual stress. The low crack polymer with low glass transition temperature could be used to various applications such as semiconductors, integrated circuits, coating materials and display. Thermal stabilities of the polymer was confirmed by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The residual stress of the polymer was confirmed by Thin fimls stress analyzer(TFSA).
Effects of heating rate and catalyst for polyamide-imide synthesis
김광인 한국공업화학회 2016 한국공업화학회 연구논문 초록집 Vol.2016 No.1
Aromatic polyimides have been widely used in industry because of excellent properties in thermal stability, chemical resistance, and mechanical properties. But they have some disadvantages that most of aromatic polyamides were not dissolved in most organic solvents and were difficult to process due to intermolecular interactions. In order to improve solubility and processibility with maintaining thermal stability, amide group was combined with polyimide. In this study, it was investigated the effects of heating rate and catalyst for polyamide-imide synthesis.