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Fabrication of Metal Nanobridge Arrays using Sacrificial Silicon Nanowire
Kook-Nyung Lee,Kyounggun Lee,Suk-Won Jung,Min-Ho Lee,Woo-Kyeong Seong 대한전기학회 2012 Journal of Electrical Engineering & Technology Vol.7 No.3
Novel fabrication method of nanobridge array of various materials was proposed using suspended silicon nanowire array as a sacrificial template structure. Nanobridges of various materials can be simply fabricated by direct deposition with thermal evaporation on the top of prefabricated suspended silicon nanobridge arrays, which are used as a sacrificial structure. Since silicon nanowire can be easily removed by selective dry etching, nanobridge arrays of an intended material are finally obtained. In this paper, metal nanobridges of Ti/Au, around 50-200 nm in thickness and width, 5-20 μm in length were fabricated to prove the advantages of the proposed nanowire or nanobridge fabrication method. The nanobridges of Ti/Au after complete removal of sacrificial silicon nanowire template were well-established and bending of nanobridge caused by the tensile stress was observed after silicon removing. Up to 50 nm and 10 μm of silicon nanowire in diameter and length respectively was also very useful for nanowire templates.
Well controlled assembly of silicon nanowires by nanowire transfer method
Lee, Kook-Nyung,Jung, Suk-Won,Kim, Won-Hyo,Lee, Min-Ho,Shin, Kyu-Sik,Seong, Woo-Kyeong IOP Pub 2007 Nanotechnology Vol.18 No.44
<P>Efforts to date in silicon nanowire research have primarily focused on the nanowire synthesis and the demonstration of individual nanowire-based devices exhibiting interdisciplinary potential spanned from electrical (Duan <I>et al</I> 2003 <I>Nature</I> <B>425</B> 274–8; Cui and Lieber 2001 <I>Science</I> <B>291</B> 851–3; Morales and Lieber 1998 Science <B>279</B> 208–11) through biomedical applications (Cui <I>et al</I> 2003 <I>Science</I> <B>293</B> 1289–92; Zheng <I>et al</I> 2005 <I>Nature Biotechnol.</I> <B>23</B> 1294–301). However, the realization of integrated nanowire devices requires well ordered assembly of a silicon nanowire (Huang <I>et al</I> 2001 <I>Science</I> <B>291</B> 630–3; Whang <I>et al</I> 2003 <I>Nano Lett.</I> <B>3</B> 1255–9) as well as simple and cost effective fabrication. Here we describe a simple fabrication scheme and a large-scale assembly of silicon nanowires by combining top-down fabrication with nanowire transfer onto another insulator substrate for device manufacture. Our innovative fabrication method enables us to obtain well defined silicon nanowires as a freestanding bridge structure with a diameter of 20–200 nm and a length varying from 5 to 100 µm using micro-machining processes. Direct transfer of the freestanding nanowires simply provides large-scale assembly of silicon nanowire on various substrates for highly integrated devices such as high-performance thin-film transistors (TFTs) (Duan <I>et al</I> 2003 <I>Nature</I> <B>425</B> 274–8; Ishihara <I>et al</I> 2003 <I>Thin Solid Films</I> <B>427</B> 77–85) and nanowire-based electronics (Cui and Lieber 2001 <I>Science</I> <B>291</B> 851–3). Electrical transport properties of the transferred silicon nanowire were also investigated. </P>
Monolithic fabrication of optical benches and scanning mirror using silicon bulk micromachining
Lee, Kook-Nyung,Jang, Yun-Ho,Kim, Hoseong,Lee, Yoon-Sik,Kim, Yong-Kweon IOP 2005 JOURNAL OF MICROMECHANICS AND MICROENGINEERING - Vol.15 No.4
<P>This paper details an optical scanning mirror with a 54.74° inclined reflective plane and optical benches to align the optical components simply in a monolithic silicon substrate so as to implement a miniaturized laser scanner. The scanning mirror was designed and fabricated to achieve laser scanning on a miniaturized scale so that fluorescence detection of arrays of patterns on biochips can be performed by a handheld system. The inclined (1 1 1) reflective plane of the scanning mirror was formed by the KOH wet etching process, and proved to be a very appropriate structure for the assembly of optical scanning systems composed of a laser input and a scanning mirror in a silicon substrate. The optical benches, torsion spring and comb electrodes were fabricated using the DRIE process. The scanning mirror is actuated by its moment of inertia, the electrostatic torque of the comb electrodes and the restoring torque of the torsion spring. As designed, the scanning mirror is 2165 × 778 µm<SUP>2</SUP> in an upper part of the rotor of the mirror, and the chip size including optical bench guides is 9 × 10 × 1 mm<SUP>3</SUP>. The deflection angle of the scanning mirror was measured by a laser displacement meter (LC2420, Keyence, Japan), and the optical components were assembled and aligned in optical bench guides to observe the laser scanning. The deflection angle of the scanning mirror depends on matching the frequency of the driving signal and the mechanical oscillation of the scanning mirror, and a maximum deflection angle of ±7° was obtained when a 16 V peak–peak square wave was applied to the comb electrodes. The scanning mirror with an inclined reflective plane and optical benches fabricated in a monolithic silicon substrate was proved to be a smart structure to implement a handheld-type scanning system for biochip application.</P>
Fabrication of Metal Nanobridge Arrays using Sacrificial Silicon Nanowire
Lee, Kook-Nyung,Lee, Kyoung-Gun,Jung, Suk-Won,Lee, Min-Ho,Seong, Woo-Kyeong The Korean Institute of Electrical Engineers 2012 Journal of Electrical Engineering & Technology Vol.7 No.3
Novel fabrication method of nanobridge array of various materials was proposed using suspended silicon nanowire array as a sacrificial template structure. Nanobridges of various materials can be simply fabricated by direct deposition with thermal evaporation on the top of prefabricated suspended silicon nanobridge arrays, which are used as a sacrificial structure. Since silicon nanowire can be easily removed by selective dry etching, nanobridge arrays of an intended material are finally obtained. In this paper, metal nanobridges of Ti/Au, around 50-200 nm in thickness and width, 5-20 ${\mu}m$ in length were fabricated to prove the advantages of the proposed nanowire or nanobridge fabrication method. The nanobridges of Ti/Au after complete removal of sacrificial silicon nanowire template were well-established and bending of nanobridge caused by the tensile stress was observed after silicon removing. Up to 50 nm and 10 ${\mu}m$ of silicon nanowire in diameter and length respectively was also very useful for nanowire templates.
A high-temperature MEMS heater using suspended silicon structures
Lee, Kook-Nyung,Lee, Dae-Sung,Jung, Suk-Won,Jang, Yun-Ho,Kim, Yong-Kweon,Seong, Woo-Kyeong IOP 2009 JOURNAL OF MICROMECHANICS AND MICROENGINEERING - Vol.19 No.11
<P>A high-temperature MEMS heater using suspended serpentine silicon beams as a filament is proposed for an infrared light source. The MEMS heater utilizes suspended silicon beams for thermal isolation and the mechanical support of heat resistors, and Pt/Ti layers for a Joule heating resistor deposited onto suspended silicon beams. An SiO<SUB>2</SUB> insulator layer was deposited to provide electrical isolation between the thermal resistor and the silicon substrate. The proposed MEMS heater did not require a closed membrane-based back-cavity structure for thermal isolation. The heater is capable of being simply fabricated by a single photolithography process and subsequent silicon anisotropic etching and metal deposition processes. The fabrication process and driving characteristics of the MEMS heater are described. High temperature achieved by the heater was measured by IR camera image processing.</P>
Lee, Kook-Nyung,Kim, Yong-Kweon The Institute of Electronics and Information Engin 2001 Journal of semiconductor technology and science Vol.1 No.2
We considered the uniformity of fabricated micromirror arrays by characterizing the fabrication process and calculating the appropriate driving voltages of micromirrors used as virtual photomask in maskless photolithography. The uniformity of the micromirror array in terms of driving voltage and optical characteristics is adversely affected by factors, such as the air gap between the bottom electrode and the mirror plate, the spring shape and the deformation of the mirror plate or torsion spring. The thickness deviation of the photoresist sacrificial layer, the misalignment between mirror plate and bottom electrode, the aluminum deposition condition used to produce the spring and the mirror plate, and initial mirror deflection were identified as key factors. Their importance lies in the fact that they are related to air gap deviations under the mirror plate, asymmetric driving voltages in left and right mirror directions, and the deformation of the Al sring or mirror plate after removal of the sacrificial layer. The plasma ashing conditions used for removing the sacrificial layer also contributed to the deformation of the mirror plate and spring. Driving voltages were calculated for the pixel operation of the micromirror array, and the non-uniform characteristics of fabricated micromirrors were taken into consideration to improve driving performance reliability.
이국녕(Kook-Nyung Lee),정석원(Suk-Won Jung),성우경(Woo-Kyeong Seong) 대한전기학회 2009 대한전기학회 학술대회 논문집 Vol.2009 No.7
떠 있는 열선 구조를 채택한 고온 구동 마이크로 MEMS히터의 특성을 평가하고 분석하였다. 고온 MEMS 히터는 적외선을 이용한 광학식 가스센서의 주요한 핵심 부품인 적외선 발광원으로 활용할 수 있다. MEMS 기술을 이용하여 대량생산이 가능하여 가격을 낮출 수 있고 소비전력이 작아 적외선 센서의 광원으로 응용되는 등 관련 분야의 연구가 많이 이루어지고 있다. 본 논문에서는 실리콘 기판으로부터 떠 있는 실리콘 지지구조물 위에 형성된 백금 저항성으로 고온 발열 동작하는 새로운 구조의 MEMS 히터에 대한 온도 특성을 고해상도 적외선 카메라로 측정한 이미지를 이용하여 분석하였다.