후열처리 공정이 에어로졸 증착법에 의해 제조된 PMN-PZT 막의 미세구조와 전기적 특성에 미치는 영향

한병동,고관호,박동수,최종진,윤운하,박찬,김도연,Hahn, Byung-Dong,Ko, Kwang-Ho,Park, Dong-Soo,Choi, Jong-Jin,Yoon, Woon-Ha,Park, Chan,Kim, Doh-Yeon 한국세라믹학회 2006 한국세라믹학회지 Vol.43 No.2

PMN-PZT films with thickness of $5\;{\mu}m$ were deposited on $Pt/Ti/SiO_2/Si$ substrate at room temperature using aerosol deposition process. The films showed fairly dense microstructure without any crack. XRD and TEM analysis revealed that the films consisted of randomly oriented nanocrystalline and amorphous phases. Post-annealing process was employed to induce crystallization and grain growth of the as-deposited films and to improve the electrical properties. The annealed film showed markedly improved electrical properties in comparison with as-deposited film. The film after annealing at $700^{\circ}C$ for 1h exhibited the best electrical properties. Dielectric constant $(\varepsilon_r)$, remanent polarization $(P_r)$ and piezoelectric constant $(d_{33})$ were 1050, $13\;{\mu}C/cm^2$ and 120 pC/N, respectively.

ASTM D5470 방법으로 연강과 스테인리스강의 열전도도 측정시 열그리스의 영향

조영욱,한병동,이주호,박성혁,백주환,조영래,Cho, Young-Wook,Hahn, Byung-Dong,Lee, Ju Ho,Park, Sung Hyuk,Baeg, Ju-Hwan,Cho, Young-Rae 한국재료학회 2019 한국재료학회지 Vol.29 No.7

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

50μm급 이트리아 안정화 지르코니아 비드의 미세구조 및 마모 조건에 따른 마모율 분석

김정환,윤세중,한병동,안철우,윤운하,최종진,Kim, Jung-Hwan,Yoon, Sae-Jung,Hahn, Byung-Dong,Ahn, Cheol-Woo,Yoon, Woon-Ha,Choi, Jong-Jin 한국재료학회 2019 한국재료학회지 Vol.29 No.4

This study analyzes the mechanical properties, including the attrition rate, of $50{\mu}m$ size yttria-stabilized zirconia (YSZ) beads with different microstructures and high-energy milling conditions. The yttria distribution in the grain and grain-boundary of the fully sintered beads relates closely to Vickers hardness and the attrition rate of the YSZ beads. Grain size, fractured surfaces, and yttrium distribution are analyzed by electronic microscopes. For standardization and a reliable comparison of the attrition rate of zirconia beads with different conditions, Zr content in milled ceramic powder is analyzed and calculated by X-ray Fluorescence Spectrometer(XRF) instead of directly measuring the weight change of milled YSZ beads. The beads with small grain sizes sintered at lower temperature exhibit a higher Vickers hardness and lower attrition rate. The attrition rate of $50{\mu}m$ YSZ beads is measured and compared with the various materials properties of ceramic powders used for high-energy milling. The attrition rate of beads appears to be closely related to the Vickers hardness of ceramic materials used for milling, and demonstrates more than a 10 times higher attrition rate with Alumina(Hv ~1650) powder than $BaTiO_3$ powder (Hv ~315).

상온 진공 분말 분사법에 의한 NiMn₂O₄계 NTC Thermistor 후막제작 및 특성평가

백창우,한귀팡,한병동,윤운하,최종진,박동수,류정호,정대용,Baek, Chang-Woo,Han, Gui-fang,Hahn, Byung-Dong,Yoon, Woon-Ha,Choi, Jong-Jin,Park, Dong-Soo,Ryu, Jung-ho,Jeong, Dae-Yong 한국재료학회 2011 한국재료학회지 Vol.21 No.5

Negative temperature coefficient (NTC) materials have been widely studied for industrial applications, such as sensors and temperature compensation devices. NTC thermistor thick films of $Ni_{1+x}Mn_{2-x}O_{4+{\delta}}$ (x = 0.05, 0, -0.05) were fabricated on a glass substrate using the aerosol deposition method at room temperature. Resistance verse temperature (R-T) characteristics of the as-deposited films showed that the B constant ranged from 3900 to 4200 K between $25^{\circ}C$ and $85^{\circ}C$ without heat treatment. When the film was annealed at $600^{\circ}C$ 1h, the resistivity of the film gradually decreased due to crystallization and grain growth. The resistivity and the activation energy of films annealed at $600^{\circ}C$ for 1 h were 5.203, 5.95, and 4.772 $K{\Omega}{\cdot}cm$ and 351, 326, and 299 meV for $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$, $NiMn_2O_4$, and $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$, respectively. The annealing process induced insulating $Mn_2O_3$ in the Ni deficient $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$ composition resulting in large resistivity and activation energy. Meanwhile, excess Ni in $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$ suppressed the abnormal grain growth and changed $Mn^{3+}$ to $Mn^{4+}$, giving lower resistivity and activation energy.

상온 진공 분말 분사공정에 의해 제조된 TiO₂ 광촉매 막의 두께변화에 따른 광촉매 특성

김근영,류정호,한병동,최종진,윤운하,이병국,박동수,박찬,Kim, Kun-Young,Ryu, Jung-Ho,Hahn, Byung-Dong,Choi, Jong-Jin,Yoon, Woon-Ha,Lee, Byoung-Kuk,Park, Dong-Soo,Park, Chan 한국세라믹학회 2008 한국세라믹학회지 Vol.45 No.12

$TiO_2$ is an environment-friendly semiconducting material, and it has photocatalytic and hydrophilic effect. There are a lot of reports on the photocatalytic characteristics of $TiO_2$, such as organic pollutants resolving, anti-bacterial, and self-purification material. In this paper, $TiO_2$ micron-sized powders were deposited on the glass by room temperature powder spray in vacuum process, so called aerosol deposition (AD), and nano-grained $TiO_2$ photocatalytic thin films were fabricated. The thickness of the films were controlled by changing the number of deposition cycle. Morphologies and characteristics of the AD-$TiO_2$ thin films were examined by SEM, TEM, XRD, and UV-Visible Spectrophotometer. As the thickness of $TiO_2$ films increased, surface roughness increased. By this increment, the reaction area between film and pollutant was enlarged, resulting in better photocatalytic property.

알루미늄 기판에 스크린 인쇄한 AlN 후막의 두께 방향으로 열전도도 평가

김종구,박홍석,김현,한병동,조영래,Kim, Jong-Gu,Park, Hong-Seok,Kim, Hyun,Hahn, Byung-Dong,Cho, Young-Rae 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.4

히트 싱크용 소재에 응용할 목적으로 단층금속과 2층 단면구조 복합재료에 대해 열전도 특성을 연구하였다. 단층금속으로는 알루미늄합금(Al6061)을 사용했으며, 2층 단면구조 복합재료로는 Al6061기판에 질화알루미늄(AlN)을 스크린 인쇄한 층상구조 복합재료를 선택하였다. 섬광법으로 측정한 열확산계수와 비열 및 밀도를 사용해서 열전도도를 측정하였다. 실험을 통해 얻은 열전도 특성 값을 참고문헌에 보고된 자료를 사용해 계산한 값과 비교하였다. Al6061 기판에 스크린인쇄법으로 AlN 후막을 형성시킨 2층 단면구조 복합재료 시편의 열전도도는 AlN 후막의 두께가 증가할수록 선형적으로 감소하였다. 측정한 복합재료의 열전도도는 두께가 $53{\mu}m$과 $163{\mu}m$일 때, 각각 $114.1W/m{\cdot}K$와 $72.3W/m{\cdot}K$로 나타났다. 또한, 스크린 인쇄한 AlN 후막의 열전도도를 열전도비저항에 대한 혼합법칙을 적용해서 평가하였다. AlN 후막의 두께가 $53{\mu}m$와 $163{\mu}m$인 경우, 스크린 인쇄한 AlN 후막의 열전도도는 각각 $9.35W/m{\cdot}K$와 $12.40W/m{\cdot}K$로 나타났다. A study on thermal properties for a single-layer metal and two-layer composites was investigated for the heat-sink application. For the single-layer metal, an aluminum alloy (Al6061) was selected. A screen printed aluminum nitride (AlN) layer on the Al6061 substrate was chosen for the two-layer composites. The thermal conductivity of the sample was determined from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared to calculated values using the data from the references. The thermal conductivity of composites with screen printed AlN layer on the Al6061 substrate decreased linearly with increasing the thickness of AlN layer. Measured values of the thermal conductivity for composites with $53{\mu}m$ and $163{\mu}m$ thick AlN layers were $114.1W/m{\cdot}K$ and $72.3W/m{\cdot}K$, respectively. In particular, the thermal conductivity of the screen-printed AlN layer was demonstrated by appling the rule of mixture in view point of thermal resistivity. Measured values of the thermal conductivity for AlN layers with the thickness of $53{\mu}m$ and $163{\mu}m$ showed $9.35W/m{\cdot}K$ and $12.40W/m{\cdot}K$, respectively.

에어로졸 데포지션에 의한 이트리아 필름의 미세구조와 특성

이병국,박동수,윤운하,류정호,한병동,최종진,Lee, Byung-Kuk,Park, Dong-Soo,Yoon, Woon-Ha,Ryu, Jung-Ho,Hahn, Byung-Dong,Choi, Jong-Jin 한국세라믹학회 2009 한국세라믹학회지 Vol.46 No.5

Dense crack-free yttria film with 10 $\mu m$ thickness was prepared on aluminum by aerosol deposition. X-ray diffraction pattern on the film showed that it contained the same crystalline phase as the raw powder. Transmission electron microscopy revealed a nanostructured yttria film with grains smaller than 100 nm. Tensile adhesion strength between the film and aluminum substrate was 57.8 $\pm$ 6.3MPa. According to the etching test with $CF_4-O_2$ plasma, the etching rate of the yttria film was 1/100 that of quartz, 1/10 that of sintered alumina and comparable to that of sintered yttria.

히트 싱크용 클래드메탈에서 두께 방향의 열전도 특성에 미치는 계면의 영향

김종구,김동용,김현,한병동,조영래,Kim, Jong-Gu,Kim, Dong-Yong,Kim, Hyun,Hahn, Byung-Dong,Cho, Young-Rae 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.3

히트 싱크용 소재에 응용할 목적으로 단층금속과 2층금속 클래드메탈에 대해 열전도 특성에 대한 연구를 하였다. 단층시편으로는 스테인리스강과 알루미늄을 선택하였으며, 2층 금속으로는 스테인리스강과 알루미늄을 압연해서 제조한 클래드메탈을 사용하였다. 열전도도는 섬광법으로 측정한 열확산계수와 비열 및 밀도를 사용해 얻었다. 실험을 통해 얻은 측정값을 참고문헌에 보고된 자료를 사용해 얻은 계산값과 비교하였다. 단층시편의 경우, 실험을 통해 얻는 열확산계수와 열전도도는 계산값보다 작았다. 스테인리스강의 경우, 측정한 열전도도는 계산값에 비해 6% 정도 작았으며, 알루미늄의 경우 18% 정도 작았다. 반면, 2층 금속인 스테인리스강과 알루미늄의 클래드메탈은 측정한 열전도도가 계산값에 비해 55% 정도 낮게 나타났다. 섬광법으로 측정한 열전도도가 계산값보다 55% 정도 낮게 나타난 이유는 스테인리스강과 알루미늄의 사이에 존재하는 계면의 영향 때문이다. 스테인리스강과 알루미늄의 사이에 존재하는 계면은 열전도 특성을 지배하는 전자와 탄성파의 이동을 어렵게 하기 때문이다. 우수한 방열특성을 갖는 다층구조 방열모듈을 개발하기 위해서는 열전도 특성에 결정적으로 영향을 주는 계면 특성의 조절이 중요하다. A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

상온 진공 분말 분사 공정을 이용한 다층 박막 소재의 제조 및 전기적 특성

류정호,안철우,김종우,최종진,윤운하,한병동,최준환,박동수,Ryu, Jung-Ho,Ahn, Cheol-Woo,Kim, Jong-Woo,Choi, Jong-Jin,Yoon, Woon-Ha,Hahn, Byung-Dong,Choi, Joon-Hwan,Park, Dong-Soo 한국전기전자재료학회 2012 전기전자재료학회논문지 Vol.25 No.8

Room temperature powder spray in vacuum process, so called Aerosol deposition (AD) is a room temperature (RT) process to fabricate thick and dense ceramic films, based on collision of solid ceramic particles. This technique can provide crack-free dense thin and thick films with thicknesses ranging from sub micrometer to several hundred micrometers with very fast deposition rates at RT. In addition, this technique is using solid particles to form the ceramic films at RT, thus there is few limitation of the substrate and easy to control the compositions of the films. In this article, we review the progress made in synthesis of piezoelectric thin/thick films, multi-layer structures, NTC thermistor thin/thick films, oxide electrode thin films for actuators or sensor applications by AD at Korea Institute of Materials Science (KIMS) during the last 4 years.