반응표면분석법을 이용한 LED Die Bonding 공정능력 최적화

하석재(Ha, Seok-Jae),조용규(Cho, Yong-Kyu),조명우(Cho, Meyong-Woo),이광철(Lee, Kwang-Cheol),최원호(Choi, Won-Ho) 한국산학기술학회 2012 한국산학기술학회논문지 Vol.13 No.10

LED 칩 패키징에서 다이 본딩은 웨이퍼에서 분할된 다이를 리드 프레임에 접착제로 고정시켜 칩이 다음 공 정을 견딜 수 있는 충분한 강도를 제공하는 중요한 공정이다. 본 논문에서는 PLCC 구조 LED 패키지 프레임에 소형 제너 다이오드를 부착하는 다이 본딩 공정능력의 최적화를 위하여 공정에 영향을 미치는 여러 인자를 분석하여 반응 표면분석법을 적용하여 그 결과를 도출하였다. 인자를 분석하여 5인자 3수준 4반응치를 고려하여 실험계획법을 수립 하였으며, 그 결과 모든 반응치의 목표를 만족하는 최적 조건을 확보할 수 있었다. In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

다물체 동역학 해석을 이용한 커버글라스 Edge 연마용 Abrasive Film Polishing 시스템 개발

하석재(Ha, Seok-Jae),조용규(Cho, Yong-Kyu),김병찬(Kim, Byung-Chan),강동성(Kang, Dong-Seong),조명우(Cho, Meyong-Woo),이정우(Lee, Jung-Woo) 한국산학기술학회 2015 한국산학기술학회논문지 Vol.16 No.10

최근 스마트폰, 태블릿 PC 및 전자기기 등의 사용이 증가함에 따라 커버글라스의 수요가 증가하고 있는 추세이다. 모바일 기기의 디스플레이가 대형화되면서 접촉이나 낙하 등과 같이 외부에서 힘을 받게 되는 환경에서 높은 강도를 유지하 는 것이 요구되고 있다. 커버글라스 제작 공정에서 연마공정은 커버글라스의 표면거칠기 및 충분한 강도를 제공하는 중요한 공정이다. 기존 연삭 숫돌에 의한 가공방법은 커버글라스 가공표면에 스크레치, 칩핑, 노칭 및 마이크로 크랙 등의 가공 문제 점이 발생한다. 따라서 본 연구에서는 모바일 커버글라스의 연마를 위해 연마필름을 이용한 폴리싱 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 연마 필름 폴리싱 시스템에 대한 유한요소모델을 생성하였고 다물체 동역학 해석을 수행하 였다. 연마 필름 폴리싱 시스템에 대한 응력 및 변위 해석을 통해 특성을 분석하였고 레이저 변위 센서를 이용해 제작된 시스템에 대한 변위를 측정하여 구조적 안정성에 대해 확인하였다. In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

DSI 성형을 이용한 금속/플라스틱 복합 부품 제조에 관한 연구

하석재,차백순,고영배,Ha, Seok-Jae,Cha, Baeg-Soon,Ko, Young-Bae 한국금형공학회 2020 한국금형공학회지 Vol.14 No.4

Various manufacturing technologies, including over-molding and insert-injection molding, are used to produce hybrid plastics and metals. However, there are disadvantages to these technologies, as they require several steps in manufacturing and are limited to what can be reasonably achieved within the complexities of part geometry. This study aims to determine a practical approach for producing metal/plastic hybrid components by combining plastic injection molding and metal die casting to create a new hybrid metal/plastic molding process. The integrated metal/plastic hybrid injection molding process developed in this study uses the proven method of multi-component technology as a basis to combine plastic injection molding with metal die casting into one integrated process. In this study, the electrical conductivity and ampacity were verified to qualify the new process for the production of parts used in electronic devices. The electrical conductivity was measured, contacting both sides of the test sample with constant pressure, and the resistivity was measured using a micro ohmmeter. Also, the specific conductivity was subsequently calculated from the resistivity and contact surface of the conductor path. The ampacity defines the maximum amount of current a conductive path can carry before sustaining immediate or progressive deterioration. The manufactured hybrid multi-components were loaded with increasing currents, while the temperature was recorded with an infrared camera. To compare the measured infrared images, an electro-thermal simulation was conducted using commercial CAE software to predict the maximum temperature of the power loaded parts. Overall, during the injection molding process, it was demonstrated that multifunctional parts can be produced for electric and electronic applications.

미세 피치를 갖는 MEMS 프로브 팁의 설계 및 기계적 특성 평가

하석재(Ha, Seok-Jae),김동우(Kim Dong-Woo),신봉철(Shin, Bong-Cheol),조명우(Cho, Meyong-Woo),한청수(Han, Chung-Soo) 한국산학기술학회 2010 한국산학기술학회논문지 Vol.11 No.4

프로브 카드는 반도체 제조 공정 전에 반도체 소자 및 필름의 기능과 성능을 검사하기 위한 테스트 장비이 다. 반도체 산업의 급속한 기술 발전과 반도체 소자의 고집적화로 인하여 반도체 소자의 패드 간격과 패드의 수가 증가하고 있다. 따라서 반도체 소자의 크기 및 배열의 형태가 계속 축소됨에 따라 미세 피치를 갖고 검사용 핀의 수 가 많은 프로브 카드가 필요하다. 본 논문에서는 수직형 프로브 카드의 적용을 위하여 MEMS 기술을 이용한 프로브 팁을 개발하였다. 프로브 팁의 설계를 위해서 유한요소해석을 이용하여 프로브 팁의 구조 및 기계적 특성에 대한 구 조설계를 수행하였다. 또한 구조 설계를 적용한 프로브 팁을 제작하여 유한요소해석의 결과와 실제 시험을 통한 접 촉력의 평가를 수행하였다. 이에 따라 피치 간격이 약 50㎛이하의 프로브 카드를 제작하였다. The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than 50㎛.

티타늄 합금 플랜지 볼트 성형에서의 단조력 간접 측정을 위한 열간 단조 공정 모니터링에 관한 연구

하석재,최두선,이동원,송기혁,Ha, Seok-Jae,Choi, Doo-Sun,Lee, Dong-Won,Song, Ki-Hyeok 한국금형공학회 2021 한국금형공학회지 Vol.15 No.1

The objective of this study is to introduce the new possibility of sensing technology based on inductive displacement sensors to monitor the status of wheel position in the hot forging process. In order to validate effectiveness of proposed sensing technology, the indirect forging force measurement with displacement sensor was applied into a typical closed hot forging die-set used for the manufacturing of flange bolts. The locations to implement the displacement sensor were selected carefully by simulating forming process and static structural. From the measurement results of the forging force change during one hot forging cycle, it was found that the proposed monitoring system can provide useful information to understand the detailed behaviors of die-set in the closed hot forging process.

머신비전에 의한 LED Chip Package 형광물질 토출형상 측정

하석재(Ha, Seok-Jae),김종수(Kim, Jong-Soo),조명우(Cho, Meyong-Woo),최종명(Choi, Jong-Myung) 한국산학기술학회 2013 한국산학기술학회논문지 Vol.14 No.5

본 연구는, LED 칩 패키지에 있는 토출된 형광체 수지의 모양을 인라인 측정을 통해 개발된 검사 시스템을 기초로 한 효율적인 머신 비전에 관한 연구이다. 형광체의 반투명 특성 때문에 조사된 빛이 칩의 표면뿐만 아니라 하 단 부에서도 반사된다. 이러한 현상이 LED 칩 검사의 신뢰성을 저하시키기 때문에 적절한 조명 광학계를 결정하기 위해 백색광 LED 와 635nm의 레이저 슬릿 빛을 이용하여 검사하였다. 또한, 광 삼각측정법을 이용해 정반사와 분산 반사법으로 검사를 수행하였다. 실험 결과 백색 슬릿 광과 정반사 반사법의 조합이 가장 좋은 검사 결과를 낸다는 것 을 확인할 수 있었다. Catmull-Rom 스플라인 보간법을 이용하여 측정된 데이터를 부드러운 표면 형상으로 나타내었 다. 측정 결과를 통해 개발된 시스템이 LED 칩 패키징 공정에 인라인 검사에 성공적으로 적용될 수 있다는 결론을 내릴 수 있다. In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

마이크로 엔드밀링 공정에서 리브 변형과 절삭력과의 영향 분석

Seok-Jae Ha(하석재),Dong-Won Lee(이동원),Jeong-Yeon Park(박정연),Gil-Sang Yoon(윤길상) 한국소성가공학회 2019 금형가공 심포지엄 Vol.2019 No.12

LED Encapsulation을 위한 스태틱 믹서의 전산 설계 및 유동해석을 이용한 액상 실리콘의 혼합 특성에 대한 연구

조용규,하석재,호소,조명우,최종명,홍승민,Cho, Yong-Kyu,Ha, Seok-Jae,Huxiao, Huxiao,Cho, Myeong-Woo,Choi, Jong Myeong,Hong, Seung-Min 한국금형공학회 2013 한국금형공학회지 Vol.7 No.1

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

레이저 열-압착 본딩 시스템의 Lateral Force 감소를 위한 유연 힌지의 설계

이동원,하석재,박정연,윤길상,Lee, Dong-Won,Ha, Seok-Jae,Park, Jeong-Yeon,Yoon, Gil-Sang 한국금형공학회 2020 한국금형공학회지 Vol.14 No.3

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

비전도성 충진액을 포함하는 전동워터펌프 열 해석 모델

정성택,윤선진,하석재,Jung, Sung-Taek,Yoon, Seon-Jhin,Ha, Seok-Jae 한국금형공학회 2022 한국금형공학회지 Vol.16 No.2

As the consumer market in the eco-friendly vehicle industry grows, the demand for water pump in a electric car parts market. This study intend to propose a mathematical model that can verify the effect of improving thermal properties when a non-conductive cooling filler liquid is introduced into an electric vehicle water pump. Also, the pros and cons of the immersion cooling method and future development way were suggested by analyzing the cooling characteristics using on the derived analysis solution. Thermal characteristics analysis of electric water pump applied with non-conductive filler liquid was carried out, and the diffusion boundary condition in the motor body and the boundary condition the inside pump were expressed as a geometric model. As a result of analyzing the temperature change for the heat source of the natural convection method and the heat conduction method, the natural convection method has difficulty in dissipating heat because no decrease in temperature due to heat release was found even after 300 sec. Also, it can be seen that the heat dissipation effect was obtained even though the non-conductive filling liquid was applied at the 120 sec and 180 sec in the heat conduction method. It has proposed to minimize thermal embrittlement and lower motor torque by injecting a non-conductive filler liquid into the motor body and designing a partition wall thickness of 2.5 mm or less.