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송춘삼(Chun-Sam Song),지현식(Hyun-sik Ji),김주한(Joohan Kim),김종형(Jong-Hyeong Kim),김주현(Joo-Hyun Kim),장동영(Dong-Young Jang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
A flip-chip bonding system using DPSS (diode pumped solid state) Nd:YAG laser (wavelength : 1064㎚) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat the solder balls diretly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.
송춘삼(Chun-Sam Song),조웅(Woong Cho),유재명(Jae-Myung Yoo),김주현(Joo-Hyun Kim),김종형(Jong-Hyeong Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
TFT-LCD process has two advantages as compared with the semiconductor-process. It is that cycle time is short and number of the final products are small. But it is complex and high labor costs in the TFT-LCD process. Also, the process is a must for building PICS (Production Information and Control System) which automated and intelligent. In this paper, automated process of LCD module assembly line that can increases productivity and reduce the cost to strengthen the competitiveness corresponding with global market is planned in comparison with its manual/semi-auto. The result of the paper, the productivity will be increased about 1.5 times and cut down labor costs of 85%. In addition, whole assembly line can be short and simple.
다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구
송춘삼,지현식,김주한,김종형,안효석,Song, Chun-Sam,Ji, Hyun-Sik,Kim, Joo-Han,Kim, Jong-Hyeong,Ahn, Hyo-Sok 대한용접접합학회 2008 대한용접·접합학회지 Vol.26 No.3
A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.
X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출
송춘삼(Chun-Sam Song),조성만(Sung Man Cho),김준현(Joon-Hyun Kim),김주현(Joo-Hyun Kim),김민영(Min young Kim),김종형(Jong-Hyeong Kim) 제어로봇시스템학회 2009 제어·로봇·시스템학회 논문지 Vol.15 No.9
The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.
지명구,송춘삼,김주현,김종형,Ji, Myeong-Gu,Song, Chun-Sam,Kim, Joo-Hyun,Kim, Jong-Hyeong 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.1
In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.
고현준(Hyun-Jun Ko),송춘삼(Chun-sam Song),김종형(Jong-Hyung Kim) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
This paper introduces an working robot. four leg Walking type robot most of the existing problems at the walk, move the center of weight due to instability of posture. To compensate for these drawbacks, the structure of the leg design to rotate the joints and the joints, walking a straight line and at the same time, move the robot joints, linear joints and rotation changes in weight by almost do not occur, the body with balance and walking. Because of this, one side of the leg to be damaged, three leg is safety walking.