http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
나경환(Kyounghwan Na),누엔 티 후옹(Thi Huong Nguyen),이상명(Sang-Myung Lee),양성욱,김진석(Jinseok Kim),윤의성(Eui-Sung Yoon) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
The mechanical properties of a single-stranded deoxyribonucleic acid (ssDNA, 30-mer) in deionized water (DI) have been investigated by atomic force microscopy (AFM). Both ends of ssDNA molecules were labeled at 3’ and 5’ ends by biotin and thiol linkers, respectively. The streptavidin functionalized AFM tip ‘pick-up’ the biotinylated-end while the gold surface covalently bound to thiolated-end. The molecular stretching signal would be observed during the tip/sample separation process, and they were used to estimate the stiffness of the ssDNA molecule. We have obtained the different Young’s modulus results when the surface was un-modified or modified by a thiol backfilling spacer. Those were clarified by analyzing the binding force between DNA molecules and the un-modified gold surface or the thiol spacer-modified surface. The DNA binding to thiol spacer-modified surface is much weaker than that on the un-modified surface.
A study on forming a spacer for wafer-level CIS(CMOS Image Sensor) assembly
김일환(Ill hwan Kim),나경환(Kyounghwan Na),김현철(Hyeon Cheol Kim),전국진(Kukjin Chun) 대한전자공학회 2008 電子工學會論文誌-SD (Semiconductor and devices) Vol.45 No.2
본 논문에서는 CMOS 이미지 센서의 웨이퍼 레벨 어셈블리를 위한 스페이스 제작 방법을 설명하였다. 스페이스 제작을 위해서 SU-8, PDMS, Si-interposer를 이용하는 세 가지 방법을 제안하였다. SU-8 스페이스에서는 균일한 두께 특성을 위해서 웨이퍼 회전 장치를 고안했으며, PDMS 스페이스에서는 glass/PDMS/glass 구조의 정렬 접합을 위해서 새로운 접합 방법을 제안하였다. Si-interposer를 이용한 스페이스 제작에서는 DRF을 이용한 접합 조건을 확립하였다. 세 가지의 실험 결과 Si-interposer를 이용한 스페이스 제작 시 glass/스페이스/glass 구조의 접합력이 가장 뛰어났으며, 접합력의 크기는 32.3MPa의 전단응력을 나타내었다. This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.
CIS package 응용을 위한 DFR(Dry Film Resist)의 라미네이팅(Laminating) 방법 개선
김일환(Ill hwan Kim),나경환(Kyounghwan Na),김현철,전국진(Kukjin Chun) 대한전자공학회 2007 대한전자공학회 학술대회 Vol.2007 No.11
For CIS package application, this paper reports fabrication-improvements for laminating of DFR as bonding material and effects of this improvements on the structure of glass/Si-interposer/glass. A few jigs and punching machine are used for optimizing DFR-laminating. Each thickness of the fabricated structure of glass/Si-interposer/glass is 500㎛/500㎛/500㎛ and the size of a diced cell is 4.4×4.4㎟.