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      • KCI등재

        유연·신축성 전자 소자 개발을 위한 은 나노와이어 기반 투명전극 기술

        김대곤,김영민,김종웅,Kim, Dae-Gon,Kim, Youngmin,Kim, Jong-Woong 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.1

        Recently, advances in nano-material researches have opened the door for various transparent conductive materials, which include carbon nanotube, graphene, Ag and Cu nanowire, and printable metal grids. Among them, Ag nanowires are particularly interesting to synthesize because bulk Ag exhibits the highest electrical conductivity among all metals. Here we reviewed recently-published research works introducing various devices from organic light emitting diode to tactile sensing devices, all of which are employing AgNW for a conducting material. They proposed methods to enhance the stretchability and reversibility of the transparent electrodes, and apply them to make various flexible and stretchable electronics. It is expected that Ag nanowires are applicable to a wide range of high-performance, low-cost, stretchable electronic devices.

      • 품종 및 성별에 따른 쇠고기의 지방산조성 비교

        김대곤,성삼경,정근기,최창본 대구산업정보대학 1995 논문집 Vol.9 No.2

        Dae Gon The study was conducted to investigate the effect of breed, sex on fatty acid compostition. Hanwoo and Holstein used, in the study were classified by sex. The results are summarized as follows ; Oleic acid and unsaturated fatty acids(UFA) percentages of total fatty acids in Hanwoo were higher than in Holstein, but palmitic acid and saturated fatty acids(SFA) were lower in Hanwoo. Oleic acid in steers of Hanwoo and Holstein tended to increase compared with bulls. Oleic acid in rib loin and top round were considerably higher in Hanwoo steers than in Holstein steers. In Hanwoosteers, oleic acid and UFA tended to increased while stearic acid and SFA decreased as marbling degree increased.

      • KCI등재

        SWAT 및 HEC-RAS모형을 활용한 유역 내 토사수지분석기법

        김대곤,정태성,류권규,Kim. Dae Gon,Cheong. Tae Sung,Yu. Kwon Kyu 한국방재학회 2012 한국방재학회논문집 Vol.12 No.6

        하천내에서 각종 사업을 시행하면, 그로 인해 하천에서는 토사유출, 하상 저하에 따른 인공 구조물의 기초부 손상, 댐 저수지에서의 퇴적, 해안 침식 등과 같은 토사이동에 관련된 문제가 발생하게 된다. 이러한 토사의 유출-거동을 종합적으로 파악하는 것이 토사수지분석이다. 본 연구는 유역유출 모형과 하상변동 예측 모형을 이용하여 토사수지분석을 위한 새로운 방법을 제안하였다. 낙동강 주요 지류 중 하나이며 영주댐 건설이 계획된 대표적인 충적하천유역인 내성천에 모형을 적용하고 모형의 검정과 적용성 검토를 수행하였다. 모의결과 모형은 자연하천에서의 토사유출-거동을 잘 재현하는 것으로 나타났다. 특히, 모형은 내성천에서 실측한 유사량과 유사한 계산결과를 보이는 것으로 나타났다. 내성천 유역의 토사수지 분석결과 총 1,704만톤의 토사손실이 발생한 것으로 나타났으며 이들은 대부분 하도침식에 의한 것으로 추정된다. 제안된 방법은 자연하천에서 토사수지분석이나 토사이동 관련 재해위험도저감에 활용될 수 있을 것이다. Various river projects have caused sediment transport relate problems such as sediment yields, foundation damages of river facilities by riverbed degradation, siltation on reservoir and erosion in coast. To understand comprehensively these behaviors related on sediment erosion, transport and yields from inflows to outflows in river watershed, usually, the sediment budget analysis is used. This study propose a new sediment budget analysis method using both sediment transport models of the watershed runoff model and riverbed fluctuation model. To calibrate and validate the model, the method is applied in the Naeseong-cheon which typical alluvial river is one of the main tributaries of the Nakdong river and Yeong-ju dam is planned to be built. The results show that proposed sediment budget analysis method represents well sediment transports in the natural river watershed. Specifically, sediment loads calculated by the method is fit well to the measured sediment loads in the Naeseong-cheon watershed. The sediment budget analysis results show that the soil loss of 17,040,000 tons due to erosion in many parts of river bed is estimated in the Naeseong-cheon. The suggested method can be used for sediment budget analysis and sediment related disaster risk reduction in the natural streams.

      • KCI등재

        디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가

        김대곤,홍성택,김덕흥,홍원식,이창우,Kim, Dae Gon,Hong, Sung Taik,Kim, Deok Heung,Hong, Won Sik,Lee, Chang-Woo 대한용접접합학회 2013 대한용접·접합학회지 Vol.31 No.3

        These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

      • SCOPUSKCI등재

        조립오차가 능동 자기베어링으로 지지된 축의 성능에 미치는 영향

        김대곤,김경웅,Kim, Dae-Gon,Kim, Kyung-Woong 대한기계학회 1996 大韓機械學會論文集A Vol.20 No.12

        Magnetic bearing is the machine element that supports the shaft without mechanical contact using the magnetic force induced by permanent magnet of electromagnet. Active magnetic bearing system is composed of sensor, controller, power amplifier, and electromagnet. If all the elements were dieal, shaft position could be controlled to sensor resolution, Because each elements inreal system have mechanical and electricla losses and nonlinearity, it is impossible to attain the desired performance using general control algorithm. So far it has been studied on improvement of the control algorithm of the electric characteristics of each elements. Another factors to affect shaft behavior are the manufacturing errors due to machine work, and assembling errors due to accumulate manufacturing errors of the radial magnetic bearing. This paper describes that the shaft behavior due to accumulate manufacturing errors and asymmetric bolting. This paper describes that the shaft behavior due to assembling errors of the radial bearings donot affect the rotaitonal accuracy of the shaft. But when the amplitude of the assembling errors increasees over the certain value, the bearing can not support the shaft properly.

      • SCOPUSKCI등재

        3상 가변형 셀프 베어링 스텝모터의 제어

        김대곤,Kim, Dae-Gon 대한기계학회 2001 大韓機械學會論文集A Vol.25 No.12

        The control algorithm of a new type self-bearing step motor is presented. The motor actuator is used for both motor and bearing functionality without any redundant coil windings or redundant electromagnets. The self$.$bearing step motor layout and its control method are described. A linearized farce-current-displacement relationship is derived. As the result of the unbalance response approach, the constant torque production is possible fur the supply current regulation algorithm. And even if the bearing functionality is added in the motor functionality, no additional current for bearing functionality is possible, and this leads to minimize the net power loss. Also, the unbalance response shows the independent bearing force and motor torque.

      • KCI등재

        3D 패키지용 관통 전극 형성에 관한 연구

        김대곤,김종웅,하상수,정재필,신영의,문정훈,정승부,Kim, Dae-Gon,Kim, Jong-Woong,Ha, Sang-Su,Jung, Jae-Pil,Shin, Young-Eui,Moon, Jeong-Hoon,Jung, Seung-Boo 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.2

        The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

      • 단안 카메라 영상에서 움직임 정보와 물체 인식을 통한 충돌 회피 방법 에 관한 연구

        김대곤 ( Dae-gon Kim ),서우일 ( Wo-il Seo ),유철중 ( Cheol-jung Yoo ) 한국정보처리학회 2016 한국정보처리학회 학술대회논문집 Vol.23 No.1

        본 연구는 차량이 정차해 있거나 차량을 후진하여 이동시키고자 할 때 운전자의 시야에 보이지 않는 차량의 후방 좌·우측에서 접근하는 차량 또는 보행자와 같은 움직임을 가지는 물체와 충돌을 회피하기 위한 방법에 관한 연구이다. 해당 물체와 충돌을 피하기 위해서는 후방의 영상을 획득하여 움직임을 가진 물체를 식별하고 차량과의 거리, 속도 및 충돌 가능성을 계산할 수 있어야 한다.

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