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Modeling and Optimization in Precise Boring Processes for Aluminum Alloy 6061T6 Components
Rong-Tai Yang,Yung-Kuang Yang,Hsin-Te Liao,Show-Shyan Lin 한국정밀공학회 2012 International Journal of Precision Engineering and Vol. No.
This investigation applies a Taguchi orthogonal table, integrating response surface methodology (RSM) to optimize parameters of a precise boring process using a computer numerical control (CNC) machine operation for the production of aluminum alloy 6061T6 components. By applying RSM analysis, the predictive mathematical model of the roughness average and roundness were developed in terms of the cutting speed, feed rate, and depth of cut. The error analysis and experimental results indicate that the proposed predictive mathematical models could adequately describe the performance indicators within the limits of the factors that are being investigated. In addition, the analysis of variance (ANOVA) was implemented to identify the significant factors and the response surface contours were constructed for determining the optimum conditions of precise boring processes using CNC machine operations.
Huang, Wen-Kuan,Lin, Yung-Chang,Chiou, Meng-Jiun,Yang, Tsai-Sheng,Chang, John Wen-Cheng,Yu, Kuang-Hui,Kuo, Chang-Fu,See, Lai-Chu Asian Pacific Journal of Cancer Prevention 2013 Asian Pacific journal of cancer prevention Vol.14 No.8
Background: There have been no large-scale population-based studies to estimate the subsequent risk of primary liver cancer (PLC) among patients with pyogenic liver abscess (PLA). This study aimed to provide relevant data. Materials and Methods: The Taiwan Longitudinal Health Insurance Database for the years 2000 and 2005 was used. The PLA group were adult inpatients who were newly diagnosed with PLA from 2000 to 2008. The control group was randomly selected and matched with the PLA group in terms of age, sex, and date in which medical treatment was sought other than for PLA. Results: There were 1,987 patients each in the PLA and control groups. In total, 56 had PLC, 48 (2.4%, 601.5 per 100,000 person-years) from the PLA group, and 8 from the control group. After adjusting for potential covariates, the hazard ratio of PLC for the PLA group was 3.4 times that of the control group (95% confidence interval = 1.6-7.3, p <0.001). The PLC risk for the PLA group was significantly higher within the first year after PLA diagnosis (hazard ratio: 35.4) as compared with the control group and became insignificant (hazard ratio: 2.0, 95% confidence interval = 0.8-4.9) more than one year after PLA diagnosis. Conclusions: Patients with PLA have a higher rate of PLC than matched controls, especially within the first year after the diagnosis of PLA, suggesting PLA is a warning sign for PLC.
Applying a Life-Cycle Assessment to the Ultra Pure Water Process of Semiconductor Manufacturing
Tien, Shiaw-Wen,Chung, Yi-Chan,Tsai, Chih-Hung,Yang, Yung-Kuang,Wu, Min-Chi The Korean Society for Quality Management 2005 The Asian Journal on Quality Vol.6 No.3
A life-cycle assessment (LCA) is based on the attention given to the environmental protection and concerning the possible impact while producing, making, and consuming products. It includes all environmental concerns and the potential impact of a product's life cycle from raw material procurement, manufacturing, usage, and disposal (that is, from cradle to grave). This study assesses the environmental impact of the ultra pure water process of semiconductor manufacturing by a life-cycle assessment in order to point out the heavy environmental impact process for industry when attempting a balanced point between production and environmental protection. The main purpose of this research is studying the development and application of this technology by setting the ultra pure water of semiconductor manufacturing as a target. We evaluate the environmental impact of the Precoat filter process and the Cation/Anion (C/A) filter process of an ultra pure water manufacturing process. The difference is filter material used produces different water quality and waste material, and has a significant, different environmental influence. Finally, we calculate the cost by engineering economics so as to analyze deeply the minimized environmental impact and suitable process that can be accepted by industry. The structure of this study is mainly combined with a life-cycle assessment by implementing analysis software, using SimaPro as a tool. We clearly understand the environmental impact of ultra pure water of semiconductor used and provide a promotion alternative to the heavy environmental impact items by calculating the environmental impact during a life cycle. At the same time, we specify the cost of reducing the environmental impact by a life-cycle cost analysis.