http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
폐 스테인레스강 단섬유로 강화한 알루미늄 복합분말의 자기펄스압 성형 및 소결 특성
현창용,원철현,박재순,Hyun, Chang-Yong,Won, Chul-Hyun,Park, Jae-Soon 한국분말야금학회 2007 한국분말재료학회지 (KPMI) Vol.14 No.6
Characteristics of Al-based composites with waste stainless steel short fiber, fabricated by magnetic pulsed compaction and sintering were investigated. The compacts prepared by magnetic pulsed compaction showed high relative density and homogeneous microstructure compared with that by conventional press compaction. The relative density of sintered composites at $430^{\circ}C$ for 1 h exhibited the same value with compacts and decreased with increase in STS short fiber content. The reaction between Al and STS phase was confirmed by the microstructural analysis using EDS. The sintered composites, prepared by magnetic pulsed compaction, showed increased hardness value with increasing STS fiber content. Maximum yield strength of 100 MPa and tensile strength of 232 MPa were registered in the AI-based composite with 30 vol% STS short fiber.
현창용(Hyun Chang-Yong),최윤경(Choi Yoon-Kyung),전영훈(Jeon Young-Hoon) 대한건축학회 2011 대한건축학회논문집 Vol.27 No.7
This dissertation focuses on finding negative architectural matters in contemporary formalism and proposing an architectural metaphoric theory as an alternative. Firstly, metaphoric theories in linguistics are clarified. Based on the results of analysis about notions of linguistic and architectural metaphor, this study analyzes Kazuyo Sejima’s works. Through analyzing results of Sejima’s design works reveal her metaphoric presentation structure and establishes her potentiality about metaphor in spatial dimension. Sejima’s new senses in architecture spaces are able to advise to contemporary architecture’s formalism that has absence of spatial meaning.
손상된 Rod Type Coupler 주강재의 보수용접에 따른 열영향부특성
현창용(Hyun Chang-Yong),박수중(Park Soo-Choong) 한국철도학회 2005 한국철도학회 학술발표대회논문집 Vol.- No.-
Cast steels have been mainly in rod type couplers which connect railway vehicles. These components, as important members, are exposed to repeat to repeated stresses and impact loading during stop and departure service for a long tie. The coupler suffers fatigue crack initiations and demage that cause need to repair weldment due to these loading conditions. Therefore, the heat affected zone of cast steel couple in rod type were evaluated in view of metallurgical weld characteristics after repair welding at laboratory. The specimens with two different welding techniques were evaluated after several welding conditions and post-heat treatments. Micro-vickers hardness and tensile tests and microstructural observations were conducted on heat affected zone of the weldment according to repair weld and post-heat treatment.
Bi-10Cu-20Sb-0.3Ni 고온용 무연 솔더와 Cu와의 계면 반응 특성
김주형,현창용,이종현,Kim, Ju-Hyung,Hyun, Chang-Yong,Lee, Jong-Hyun 한국마이크로전자및패키징학회 2010 마이크로전자 및 패키징학회지 Vol.17 No.1
본 연구에서는 $430^{\circ}C$에서 Bi-10Cu-20Sb-0.3Ni 조성의 솔더 합금과 Cu간의 리플로루 솔더링 시 생성되는 계면 반응층을 분석하였고, 솔더링 시간에 따른 계면 반응층의 성장 속도를 측정하였다. 리플로우 솔더링 후 Bi-10Cu-20Sb-0.3Ni/Cu의 계면 반응층을 분석한 결과, $(Cu,Ni)_2Sb$ 및 $Cu_4Sb$ 금속간 화합물층, 그리고 Bi 조성과 $Cu_4Sb$ 상이 주기적으로 존재하는 아지랑이 형상층이 연속적으로 생성되었다. 또한 120 s까지의 솔더링 시간 영역에서는 계면 반응층의 총 두께가 솔더링 시간에 대해 직선적으로 증가하는 경향이 관찰되었다. 합금원소로 첨가된 Ni은 가장 두꺼운 $Cu_4Sb$ 반응층의 형성에 참여하지 않아 계면 금속간 화합물의 성장 속도를 억제시키는 작용을 나타내지 못했다. Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at $430^{\circ}C$. The thickness of interfacial reaction layers with respect to the soldering time was also measured. After the reflow soldering, it was observed that a $(Cu,Ni)_2Sb$, a $Cu_4Sb$ intermetallic layer, and a haze layer, which is consisted of Bi and $Cu_4Sb$ phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest $Cu_4Sb$ interfacial layer, suppression of the interfacial growth was not observed.
Sn-Ag-Cu-In 4원계 무연솔더 조인트의 고속 전단 특성
김주형,현창용,Kim, Ju-Hyung,Hyun, Chang-Yong 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2
본 연구에서는 고속 전단시험의 변형속도를 500 mm/s로 설정한 상태에서 Sn-Ag-Cu계(Sn-1.0wt.%Ag-0.5Cu 및 Sn-4.0Ag-0.5Cu)뿐만이 아니라 4종의 4원계 Sn-Ag-Cu-In 조성(Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, Sn-1.2Ag-0.7Cu-0.4In)을 포함하는 무연 솔더 접합부의 솔더링 직후 및 시효 시간에 따른 파면 생성결과, 접합강도 및 접합부 파괴에너지값의 변화를 측정, 비교해 보았다. 그 결과, 리플로우 솔더링 직후 및 $125^{\circ}C$에서의 500 시간 시효까지 주로 연성 파괴모드 및 준연성 파괴모드가 관찰되었으며, 준연성 파괴모드의 발생 빈도를 분석할 때 고속 전단조건에서 상용 무연 솔더 조성인 Sn-3.0Ag-0.5Cu 이상의 연성파괴 특성을 나타내는 것으로 파악되었다. 또한 4원계 무연 솔더 조인트는 평균적으로 Sn-Ag-Cu계 조성 수준의 파단에너지값을 나타내었는데, 약 100 시간의 시효 후 최고의 파단에너지값이 관찰되었으나 500 시간의 시효 후에는 파단에너지값의 확연한 감소가 관찰되어 500 시간의 시효시점부터 솔더 접합 계면부의 신뢰성 감소가 가속화되는 경향을 관찰할 수 있었다. With Pb-free solder joints containing Sn-Ag-Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and Sn-Ag-Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measured under a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones or solid-aged ones at $125^{\circ}C$ to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in the most of Sn-Ag-Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the Sn-Ag-Cu-In joints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover, the Sn-Ag-Cu-In joints presented averagely fracture energies similar to those of Sn-Ag-Cu joints. While maximum values in the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observed after the solid aging for 500 h. This result indicated that reliability degradation of the Sn-Ag-Cu-In solder joints might accelerate from about that time.
경화촉매 분말의 입도조절 및 표면코팅에 의한 에폭시 레진 기반 혼합조성의 상온 보관특성 개선
이준식,현창용,이종현,Lee, Jun-Sik,Hyun, Chang-Yong,Lee, Jong-Hyun 한국분말야금학회 2008 한국분말재료학회지 (KPMI) Vol.15 No.2
To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.
CuO-SnO<sub>2</sub>/camphene 슬러리의 동결 및 소결조건이 Cu-Sn 다공체의 기공구조에 미치는 영향
김주형,오승탁,현창용,Kim, Joo-Hyung,Oh, Sung-Tag,Hyun, Chang-Yong 한국분말야금학회 2016 한국분말재료학회지 (KPMI) Vol.23 No.1
The present study demonstrates the effect of freezing conditions on the pore structure of porous Cu-10 wt.% Sn prepared by freeze drying of $CuO-SnO_2$/camphene slurry. Mixtures of CuO and $SnO_2$ powders are prepared by ball milling for 10 h. Camphene slurries with 10 vol.% of $CuO-SnO_2$ are unidirectionally frozen in a mold maintained at a temperature of $-30^{\circ}C$ for 1 and 24 h, respectively. Pores are generated by the sublimation of camphene at room temperature. After hydrogen reduction and sintering at $650^{\circ}C$ for 2 h, the green body of the $CuO-SnO_2$ is completely converted into porous Cu-Sn alloy. Microstructural observation reveals that the sintered samples have large pores which are aligned parallel to the camphene growth direction. The size of the large pores increases from 150 to $300{\mu}m$ with an increase in the holding time. Also, the internal walls of the large pores contain relatively small pores whose size increases with the holding time. The change in pore structure is explained by the growth behavior of the camphene crystals and rearrangement of the solid particles during the freezing process.
NiO/camphene 슬러리의 동결건조 및 수소환원 공정에 의한 Ni 다공체 제조
정재헌,오승탁,현창용,Jeong, Jae-Hun,Oh, Sung-Tag,Hyun, Chang-Yong 한국분말재료학회 (*구 분말야금학회) 2019 한국분말재료학회지 (KPMI) Vol.26 No.1
In this study, freeze drying of a porous Ni with unidirectionally aligned pore channels is accomplished by using a NiO powder and camphene. Camphene slurries with NiO content of 5 and 10 vol% are prepared by mixing them with a small amount of dispersant at $50^{\circ}C$. Freezing of a slurry is performed at $-25^{\circ}C$ while the growth direction of the camphene is unidirectionally controlled. Pores are generated subsequently by sublimation of the camphene during drying in air for 48 h. The green bodies are hydrogen-reduced at $400^{\circ}C$ and then sintered at $800^{\circ}C$ and $900^{\circ}C$ for 1 h. X-ray diffraction analysis reveals that the NiO powder is completely converted to the Ni phase without any reaction phases. The sintered samples show large pores that align parallel pores in the camphene growth direction as well as small pores in the internal walls of large pores. The size of large and small pores decreases with increasing powder content from 5 to 10 vol%. The influence of powder content on the pore structure is explained by the degree of powder rearrangement in slurry and the accumulation behavior of powders in the interdendritic spaces of solidified camphene.