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한국형 틸팅열차와 새마을호의 사용단계 비교 전과정평가 연구
이현배(Lee Hyun-Bae),천윤영(Chun Yoon-Yong),이건모(Lee Kun-Mo),김용기(Kim Yong-Ki) 한국철도학회 2009 한국철도학회 학술발표대회논문집 Vol.2009 No.11월
Sustainable Consumption and Production(SCP) is a key strategy for most countries. Thus, Korea government has tried to develop various measures and activities to foster the railway toward environmental friendly system under "low-carbon and green development. Among the rest one is developing the train oneself. Three types of train such as KTX, Semaul and Mugunghwa are in the process of running and among them, Korea Tilting Train Express(TTX) was lately developed. In addition, the car-body of TTX is designed to be easily slanted in the curved section of the line so that the train can not be derailed even though it runs round at a high speed. It is in the process of test-driving for 10 million kilometers and it is also expected to operate the TTX after 2010. The train has significant environmental impact in use stage among the whole life cycle stage caused by that legal decide to 25 years use duration of the train. Therefore, this study are going to Simplified Life Cycle Assessment about the TTX and Semaul train in use stage, and presents an environmental improvement degree fixed quantity from the case use stage where the TTX will substitute the Semaul train. The result of this study presents the environmental effect which occurs from TTX's use stage fixed quantity, compare with the existing train and TTX, it will be help to structure sustainable railway industry.
이현배(Hyun-Bae Lee),김용기(Yong-Ki Kim),이건모(Kun-Mo Lee) 한국철도학회 2010 한국철도학회 학술발표대회논문집 Vol.2010 No.7
A recent Tilting train development operation for existing line high speed, already developed "Korean Tilting Train eXpress(bellow TTX)" and that doing demonstration of operation. And TTX are going to commercial service in 2012. They are preparing Environmental Declaration of Product(bellow EDP) for offering environmental impact of TTX to customer. EDP calculated environmental impact of target product's whole life cycle(raw material and manufacturing, distribution, use, end of life) more quantity for that improving environmental impact and then certification them, it is using for that estimate some part of existence of specific pollutants, GHGs, energy consumption and recycling ratio. In this study, 1) analyze the process of getting EDP, 2) satisfy common criteria and each criteria(plan) in the Product Category Rules(bellow PCRs) provided KEITI, 3) according to ISO 14044, implementation of LCA. 4) These results be shown Characterized Impact(bellow CI) about each life cycle stage and six impact categories(ARD, GWP, OD, AD, EU, POC).
PCB상 Single 및 Differential Via의 전기적 파라미터 추출
채지은,이현배,박홍준,Chae Ji Eun,Lee Hyun Bae,Park Hon June 대한전자공학회 2005 電子工學會論文誌-SD (Semiconductor and devices) Vol.42 No.4
This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias. 본 논문은 인쇄 회로 기판에 있는 through hole vias를 시간 영역과 주파수 영역 측정을 통하여 characterization을 하였다. Via characterization은 Time Domain Reflectometry (TDR)를 이용하여 시간 영역에서 측정하고 HSPICE fitting 시뮬레이션으로 via 모델 파라미터를 추출하였다. 또한 2 port Vector Network Analyzer (VNA)로 주파수 영역에서 측정하고 Advanced Design System (ADS) fitting 시뮬레이션 하였다. VNA를 이용한 측정에서는 같은 평면에서 probing하기 위해 ABCD matrix 를 이용하여 do-embedding 수식을 유도하였다. 그리고 single via characterization 결과를 바탕으로 differential signaling을 위한 differential via characterization을 TDR과 VNA 측정을 통하여 수행하였다. Differential via characterization은 TDR 모듈의 odd mode와 even mode 소스들을 이용하여 시간 영역에서 측정하고 HSPICE로 fitting 시뮬레이션으로 모델 파라미터를 추출하였다. 추출된 모든 data는 측정 및 simulation 결과를 비교한 결과 single via의 경우, 최대 $14\%$, differential via의 경우 최대 $17\%$의 오차를 나타내었다.